DE1966877A1 - RELEASABLE ELECTRICAL CONNECTIONS BETWEEN MICRO-ASSEMBLIES AND / OR WIRING BOARDS - Google Patents

RELEASABLE ELECTRICAL CONNECTIONS BETWEEN MICRO-ASSEMBLIES AND / OR WIRING BOARDS

Info

Publication number
DE1966877A1
DE1966877A1 DE19691966877 DE1966877A DE1966877A1 DE 1966877 A1 DE1966877 A1 DE 1966877A1 DE 19691966877 DE19691966877 DE 19691966877 DE 1966877 A DE1966877 A DE 1966877A DE 1966877 A1 DE1966877 A1 DE 1966877A1
Authority
DE
Germany
Prior art keywords
contact surfaces
assemblies
wiring boards
micro
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19691966877
Other languages
German (de)
Inventor
Gerhard Ing Dr Habil Fasching
Ernst Dipl-Ing Hebenstreit
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE19691966877 priority Critical patent/DE1966877A1/en
Priority claimed from DE19691919567 external-priority patent/DE1919567A1/en
Publication of DE1966877A1 publication Critical patent/DE1966877A1/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • G04G17/06—Electric connectors, e.g. conductive elastomers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09572—Solder filled plated through-hole in the final product
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Description

Lösbare elektrische Verbindungen zwischen Mikrobaugruppen und/oder Verdrahtungsplatten.Detachable electrical connections between micro-assemblies and / or Wiring boards.

Die Erfindung betrifft lösbare elektrische und zugleich mechanische und wärmetechnische Verbindungen, insbesondere für vielpolige Verbindungen zwischen Mikrobaugruppen und/oder Verdrahtungsplatten, bei denen j je wenigstens eine Seite mit Kontaktflächen versehen ist, deren elektrische Zuleitungen senkrecht zu den Kontaktflächen ausgebildet sind, bei denen sich diese Seiten mit ihren Kontaktflächen paarweise gegenüberstehen und bei denen zwischen den Kontaktflächen eine Isolierfolie mit Kontaktelementen angeordnet ist.The invention relates to detachable electrical and at the same time mechanical and thermal connections, especially for multipolar connections between Micro-assemblies and / or wiring boards in which j each has at least one side is provided with contact surfaces, the electrical leads perpendicular to the Contact surfaces are formed in which these sides with their contact surfaces face to face in pairs and where there is an insulating film between the contact surfaces is arranged with contact elements.

Lösbare elektrische Verbindungen, die aus zwischen Kontaktflächen angeordneten Kontaktelementen bestehen, finden in der Hochfrequenztechnik vielfach Verwendung, beispielsweise in Form von Federbändern zum hochfrequenzdichten Verschluß von Abschirmgehäusen oder Hohlleiterflanschverbindungen, sowie als galvanisch kontaktierende Abstimmkolben für MiLrowellenleitungen. Derartige Kontakte weisen den Nachteil auf, daß sie nur für großflächige Verbindungen geeignet sind.Detachable electrical connections made between contact surfaces arranged contact elements are found in high frequency technology many times Use, for example in the form of spring strips for high-frequency-tight closure of shielding housings or waveguide flange connections, as well as galvanically contacting Tuning piston for microwave cables. Such contacts have the disadvantage that they are only suitable for large-area connections.

Losbare elektrische Kontakte sind auch aus einem Baugruppenverband nach der deutschen Patentschrift 1 075 691 bekannt.Detachable electrical contacts are also from an assembly group known from German patent specification 1,075,691.

Sie dienen dort der Verbindung paralleler Schaltungsplatten über wenigstens eine Verbindungsplatte, bei der sich die Kontaktteile vorzugsweise in Richtung der Ebene der Verbindungsplatte erstrecken.They are used to connect parallel circuit boards via at least one a connecting plate in which the contact parts are preferably in the direction of Extend the plane of the connecting plate.

Aus dem DGM 1 891 Q42 ist ebenfalls eine Baugruppe bekannt, bei der ebene Kontaktflächen zweier paralleler Verdrahtungsplatten über in einer lösbaren Verbindungsplatte angeordnete Kontaktelemente und Bauelemente verbunden sind.A module is also known from DGM 1 891 Q42 in which flat contact surfaces of two parallel wiring boards over in one detachable Connecting plate arranged contact elements and components are connected.

In der DAS 1 275 170 ist weiter eine Anordnung beschrieben, bei der eine starre Verbindungsplatte mit S-förmigen Kontaktelementen die Verbindung zwischen zwei Schaltungsplatten herstellt.In DAS 1 275 170 an arrangement is further described in which a rigid connecting plate with S-shaped contact elements the connection between manufactures two circuit boards.

Alle beschriebenen Lösungen zur Verbindung von Baugruppen und Verdrahtungaplatten weisen den Nachteil auf, daß ihre Kontakte viel Raum in Anspruch nehmen und Induktivitäten aufweisen, die für viele Anwendungen bei höchsten Frequenzen störend sind. Weiter ist bei ihnen der warmetechnische Uebergang auf kleine Kontaktstellen beschränkt und zur Herstellung der Verbindungen ist eine Kontaktkraft erforderlich, die bei vielpoligen Ausführungen erheblich ist.All the solutions described for connecting assemblies and wiring boards have the disadvantage that their contacts take up a lot of space and inductances have, which are disruptive for many applications at the highest frequencies. Further With them, the thermal transfer is limited to small contact points and to make the connections, a contact force is required that is at multipolar designs is significant.

Verbindungen der einleitend beschriebenen Art wurden in der DT-PS 1 916 160 vorgeschlagen. Die Kontaktgabe setzt jedoch eine Vorrichtung zum Zusammendrücken der zu verbindenden Teile voraus, die in manchen Fällen unerwunscht ist.Compounds of the type described in the introduction were found in the DT-PS 1 916 160 proposed. Contacting, however, employs a compression device the parts to be connected, which in some cases is undesirable.

Demgegenüber besteht die der Erfindung zugrunde liegende Aufgabe darin, Mikrobaugruppen und/oder Verdrahtungsplatten über eine Vielzahl von zugleich elektrischen, mechanischen und wärmetechnischen Verbindungen auf engstem Raum zusammen zufassen, die bei gutem Langzeitverhalten bei geringer Erschütterungsemfindlichkeit kräftefrei herstellbar und wieder lösbar sind. Die Verbindungen sollen einfacher, billiger und robuster als die bekannten sein.In contrast, the object on which the invention is based is Micro assemblies and / or wiring boards via a large number of simultaneously electrical, combine mechanical and thermal connections in a very small space, which are force-free with good long-term behavior and low vibration sensitivity can be produced and released again. The connections are supposed to be simpler, cheaper and be more robust than the known ones.

Ausgehend von elektrischen Verbindungen der einleitend geschilderten Art wird diese Aufgabe erfindungsgemäß dadurch gelöst, daß eine Folie insbesondere aus Glas-Sasere~oxydharz vorgesehen ist.Based on the electrical connections described in the introduction Art this object is achieved according to the invention in that a film in particular made of glass-fiber oxide resin is provided.

Vorteilhaft ist es, wenn eine Folie, beispielsweise aus Glasfasereporydharz vorgesehen ist, die das Lot trägt.It is advantageous if a film, for example made of glass fiber epicyclic resin is provided that carries the solder.

Vorteilhaft ist es dabei, wenn in der Folie zwischen den Paaren von Kontaktflächen metallisierte Bohrungen vorgesehen sind, die über die Metallisierungen hinausragende Weichlotpfropfen enthalten.It is advantageous if in the film between the pairs of Contact surfaces metallized holes are provided, which over the metallizations contain protruding soft solder plugs.

Die erfindungsgemäßen Verbindungen ermöglichen die Unterbringung einer großen Kontakt zahl pro Flächeneinheit bei niedrigem Ubergangswiderstand und kurzer elektrischer Länge.The compounds of the invention allow the accommodation of a large number of contacts per unit area with low contact resistance and shorter electrical length.

Anhand von Ausführungsbeispielen wird die Erfindung nachstehend näher erläutert.The invention is explained in more detail below with the aid of exemplary embodiments explained.

Fig. 1 zeigt ein Ausführungsbeispiel der erfindungsgemäßen vielpoligen Verbindung. Die Anordnung enthält eine obere Trägerplatte 1 mit elektrischen Zuleitungen 2, die unten als Kontaktflächen ausgebildet sind, eine untere Trägerplatte 3 mit elektrischen Zuleitungen 4, die oben als Kontaktflächen ausgebildet sind, sowie eine Folie 5 aus Glasfaserepoxydharz mit Lötpfropfen 6,die bei der Verbindung und Erwärmung der Anordnung zwischen den Kontaktflächen liegen.Fig. 1 shows an embodiment of the multi-pole according to the invention Link. The arrangement contains an upper support plate 1 with electrical leads 2, which are designed as contact surfaces below, a lower carrier plate 3 with electrical leads 4, which are designed as contact surfaces at the top, as well as a film 5 made of glass fiber epoxy resin with solder plugs 6, which in the connection and Heating the arrangement lie between the contact surfaces.

Die Folie 5 kann zur Aufnahme der Lötpfropfen 6 metallisierte Bereiche 7, 8 tragen, wie Fig. 2 und 3 zeigen.The foil 5 can have metallized areas to accommodate the solder plugs 6 7, 8 wear, as shown in FIGS. 2 and 3.

Diese metallisierten Bereiche 7 können in der Weise hergestellt werden, daß sie nach einem bekannten optischen und ätztechnischen Verfahren aus einer ursprünglich beidseitig kupferkaschierten Glasfaserepoxydharzfolie ausgespart werden. Mittels eines an sich bekannten Durchkontaktierungsverfahren können dabei die Wandungen der Bohrungen mit einer Metallschicht 8 versehen werden.These metallized areas 7 can be produced in such a way that they were originally based on a known optical and etching process double-sided copper-clad glass fiber epoxy resin film can be left out. Means The walls can use a through-hole plating method known per se the holes are provided with a metal layer 8.

Sollen gelöste Verbindungen, bei denen eine derartige Folie 5 eingesetzt war, erneut verschmolzen werden, so legt man eine neue Folie 5 zwischen die beiden zu verbindenden Kontaktflächenraster ein. Auf diese Weise wird gewährleistet, daß in allen Fällen auch nach mehreren Trenn- und Verbindungszyklen ein guter elektrischer Kontakt auftritt.Should loosened connections in which such a film 5 is used was to be fused again, a new film 5 is placed between the two contact surface grid to be connected. This ensures that in all cases a good electrical one even after several disconnection and connection cycles Contact occurs.

Für die Lotpfropfen steht eine große Anzahl von Loten zur Verfügung, so daß der gewUnschte Schmelzpunkt in weiten Grenzen wählbar ist. Es wurden mit Vorteil folgende Legierungen verwendet: a) 50 % Bi, 26,7 % Pb, 13,3 Sn, 10% Cd (Schmelzpunkt 700C); 52 % Bi, 32 % Pb, 16 % Sb (Schmelzpunkt 960C); c) 18 % Cd, 32 % Pb, 50 % Sn (Schmelzpunkt 145OC) Die Metall stifte beider Trägerplatten können gegeneinander um 900 gedreht sein, um die Justierung zu erleichtern.A large number of solders are available for the solder plugs, so that the desired melting point can be selected within wide limits. It was with Advantage of using the following alloys: a) 50% Bi, 26.7% Pb, 13.3 Sn, 10% Cd (melting point 700C); 52% Bi, 32% Pb, 16% Sb (melting point 960C); c) 18% Cd, 32% Pb, 50% Sn (melting point 145OC) The metal pins of both carrier plates can be against each other rotated by 900 to make adjustment easier.

4 Patentansprüche 3 Figuren4 claims 3 figures

Claims (4)

Patentansprüche.Claims. 1. Lösbare elektrische und zugleich mechanische und wärmetechnische Verbindungen, insbesondere für vielpolige Verbindungen zwischen Mikrobaugruppen und/oder Verdrahtungsplatten, bei denen je wenigstens eine Seite mit Kontaktflächen.versehen ist, deren elektrische Zuleitungen senkrecht zu den Kontaktflächen ausgebildet sind, bei denen sich diese Seiten mit ihren Kontaktflächen paarweise gegenüberstehen und bei denen zwischen den Kontaktflächen eine Isolierfolie mit Kontaktelementen angeordnet ist, d a d u r c h g e k e n n z e i c h -n e t , daß eine Isolierfolie mit diese durchdringenden Weichlotpfropfen als Kontaktelemente vorgesehen ist. 1. Detachable electrical and at the same time mechanical and thermal Connections, especially for multi-pole connections between micro-assemblies and / or wiring boards, each of which has at least one side provided with contact surfaces whose electrical leads are perpendicular to the contact surfaces, in which these sides face each other with their contact surfaces in pairs and in which an insulating film with contact elements is arranged between the contact surfaces is, d u r c h e k e n n n z e i c h -n e t, that an insulating film with this penetrating soft solder plug is provided as contact elements. 2. Verbindungen nach Anspruch 1, d a d u r c h g e k e n n -z e i c h n e t , daß eine Folie insbesondere aus Glasfaserepoxydharz vorgesehen ist. 2. Compounds according to claim 1, d a d u r c h g e k e n n -z e i c h n e t that a film in particular made of glass fiber epoxy resin is provided. 3. Verbindungen nach Anspruch 1 oder 2, d a d u r c h g e k e n n z e i c h n e t , daß in der Folie zwischen den Paaren von Kontaktflächen metallisierte Bohrungen vorgesehen sind, die über die Metallisierungen hinausragende Weichlotpfropfen enthalten. 3. Compounds according to claim 1 or 2, d a d u r c h g e k e n n notices that metallized in the foil between the pairs of contact surfaces Bores are provided, the soft solder plugs protruding beyond the metallizations contain. 4. Verbindungen nach einem der vorhergehenden Ansprüche, g e k e n n z e i c h n e t d u r c h die Anordnung der Weichlotpfropfen in einem Raster mit einem Rastermaß gleich oder kleiner 2,54 mm. 4. Compounds according to any one of the preceding claims, g e k e n n z e i c h n e t d u r c h the arrangement of the soft solder plugs in a grid with a grid dimension equal to or less than 2.54 mm. L e e r s e i t eL e r s e i t e
DE19691966877 1969-04-17 1969-04-17 RELEASABLE ELECTRICAL CONNECTIONS BETWEEN MICRO-ASSEMBLIES AND / OR WIRING BOARDS Pending DE1966877A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19691966877 DE1966877A1 (en) 1969-04-17 1969-04-17 RELEASABLE ELECTRICAL CONNECTIONS BETWEEN MICRO-ASSEMBLIES AND / OR WIRING BOARDS

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19691966877 DE1966877A1 (en) 1969-04-17 1969-04-17 RELEASABLE ELECTRICAL CONNECTIONS BETWEEN MICRO-ASSEMBLIES AND / OR WIRING BOARDS
DE19691919567 DE1919567A1 (en) 1969-04-17 1969-04-17 Detachable electrical connections between micro-assemblies and / or wiring boards

Publications (1)

Publication Number Publication Date
DE1966877A1 true DE1966877A1 (en) 1974-10-31

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4438561A (en) * 1981-10-01 1984-03-27 Rogers Corporation Method of reworking printed circuit boards
FR2594261A1 (en) * 1986-02-11 1987-08-14 Connexion Ste Nouvelle Electrical connection device for flat (ribbon) cables
EP0351851A2 (en) * 1988-07-21 1990-01-24 Microelectronics and Computer Technology Corporation Method and apparatus for making a flexible interconnect
DE29500428U1 (en) * 1995-01-12 1995-03-30 Hewlett Packard Gmbh Connecting component
EP0804057A2 (en) * 1996-04-26 1997-10-29 NGK Spark Plug Co. Ltd. Improvements in or relating to connecting board for connection between base plate and mounting board

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4438561A (en) * 1981-10-01 1984-03-27 Rogers Corporation Method of reworking printed circuit boards
FR2594261A1 (en) * 1986-02-11 1987-08-14 Connexion Ste Nouvelle Electrical connection device for flat (ribbon) cables
EP0351851A2 (en) * 1988-07-21 1990-01-24 Microelectronics and Computer Technology Corporation Method and apparatus for making a flexible interconnect
EP0351851A3 (en) * 1988-07-21 1991-11-06 Microelectronics and Computer Technology Corporation Method and apparatus for making a flexible interconnect
DE29500428U1 (en) * 1995-01-12 1995-03-30 Hewlett Packard Gmbh Connecting component
EP0804057A2 (en) * 1996-04-26 1997-10-29 NGK Spark Plug Co. Ltd. Improvements in or relating to connecting board for connection between base plate and mounting board
EP0804057A3 (en) * 1996-04-26 1999-02-10 NGK Spark Plug Co. Ltd. Improvements in or relating to connecting board for connection between base plate and mounting board
US6148900A (en) * 1996-04-26 2000-11-21 Ngk Spark Plug Co., Ltd. Connecting board for connection between base plate and mounting board

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