DE1627541A1 - Method for achieving uniform soldering gaps - Google Patents

Method for achieving uniform soldering gaps

Info

Publication number
DE1627541A1
DE1627541A1 DE19671627541 DE1627541A DE1627541A1 DE 1627541 A1 DE1627541 A1 DE 1627541A1 DE 19671627541 DE19671627541 DE 19671627541 DE 1627541 A DE1627541 A DE 1627541A DE 1627541 A1 DE1627541 A1 DE 1627541A1
Authority
DE
Germany
Prior art keywords
achieving uniform
achieving
uniform soldering
soldering
soldering gaps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19671627541
Other languages
German (de)
Inventor
Lothar Zutz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Publication of DE1627541A1 publication Critical patent/DE1627541A1/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

Claims (1)

Pa@entans@xt@ahe 1. Verfahren zum Erzielen gzecbmäßiger Lötspalte zwischen Verkstüclnn mit gekrümmten Lötflächen, beidem Lot. vofi dem en zwischen die Verk®tücke gegeben wird, dadurch gekenzeichnet, äaß Lot der Horngröße a. 9 :bis a:6 mal ?ßtspalt zwischen die Werksdicke (10, 11) gebracht wird und diese Wörkstücke gegeneinander bewegt werden. 2.- Vestahren nach .Artspruch 'I 9 dadurch gekennzeichnet, dnB das Einbringen.äer Lotkörner (13) durch Einschlammen erfolgt. 3. Perrabren naah Anspruch 1, dadurch gekennzeichnet,> da8 mindestens ein VorkstUai nach Erzielen den gleichmäßigen Lötspaltes (12) gehaltert xird.-.Pa @ entans @ xt @ ahe 1. Method for achieving large soldering gaps between pieces with curved soldering surfaces, both solder. vofi which en is placed between the obstacles, marked thereby, was the perpendicular of the horn size a. 9 : to a: 6 times the ßspalt is brought between the work thickness (10, 11) and these workpieces are moved against each other. 2.- Vestahren according to .Artspruch 'I 9, characterized in that the introduction of solder grains (13) takes place by sludging. 3. Perrabren naah claim 1, characterized in that> da8 at least one preliminary stage after achieving the uniform soldering gap (12) held xird.-.
DE19671627541 1967-06-15 1967-06-15 Method for achieving uniform soldering gaps Pending DE1627541A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DEL0056750 1967-06-15

Publications (1)

Publication Number Publication Date
DE1627541A1 true DE1627541A1 (en) 1971-01-21

Family

ID=7278021

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19671627541 Pending DE1627541A1 (en) 1967-06-15 1967-06-15 Method for achieving uniform soldering gaps

Country Status (1)

Country Link
DE (1) DE1627541A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2344765A1 (en) * 1976-03-19 1977-10-14 Clarke Robert Sealing method for spot welded joints - uses metallic globules mixed with plastic sealing compound and fused by welding arc
EP0136514A1 (en) * 1983-09-05 1985-04-10 INTERATOM Gesellschaft mit beschränkter Haftung Method of solder-coating fine structures of thin sheets to be soldered together, especially of exhaust gas catalyst-carrier elements
EP0259635A1 (en) * 1986-09-05 1988-03-16 Forschungszentrum Jülich Gmbh Method for the production of thermally highly stressed cooling elements
DE102012022873A1 (en) * 2012-11-22 2014-05-22 Compact Dynamics Gmbh Method for soldering stand and cooler and stand with soldered connection to the stand carrier

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2344765A1 (en) * 1976-03-19 1977-10-14 Clarke Robert Sealing method for spot welded joints - uses metallic globules mixed with plastic sealing compound and fused by welding arc
EP0136514A1 (en) * 1983-09-05 1985-04-10 INTERATOM Gesellschaft mit beschränkter Haftung Method of solder-coating fine structures of thin sheets to be soldered together, especially of exhaust gas catalyst-carrier elements
EP0259635A1 (en) * 1986-09-05 1988-03-16 Forschungszentrum Jülich Gmbh Method for the production of thermally highly stressed cooling elements
DE102012022873A1 (en) * 2012-11-22 2014-05-22 Compact Dynamics Gmbh Method for soldering stand and cooler and stand with soldered connection to the stand carrier

Similar Documents

Publication Publication Date Title
CH529520A (en) Process for processing tobacco substitute plant parts into a tobacco substitute film and tobacco substitute film produced according to this process
AT324255B (en) BRA AND METHOD AND DEVICE FOR MANUFACTURING TESSES
CH485954A (en) Method and device for producing a connection between workpieces and connection produced according to the method
DE1627541A1 (en) Method for achieving uniform soldering gaps
DE69205193T2 (en) Method for producing a semiconductor arrangement with a semiconductor body with a buried silicide layer.
CH503851A (en) Method for producing an assembly connection between a panel-shaped plate, in particular a corrugated sheet metal, and a carrier device, as well as assembly connection produced according to the method
ZA708474B (en) Method and apparatus for work-hardening restoration in welded components
DE829766C (en) Selenium AC rectifier and process for its manufacture
CH505301A (en) Method and apparatus for firmly joining a first and a second metal plate
DE919614C (en) Chassis for threshing machines with dust extraction
AT338335B (en) PROCESS FOR PRODUCING A ZONE OF A FIRST TYPE OF CONDUCTIVITY IN A SEMICONDUCTOR CRYSTAL FROM THE SECOND TO THE FIRST OPPOSITE CONDUCTIVITY TYPE
DE880365C (en) Copper oxide dry rectifier
DE662132C (en) Metal aircraft fuselage
DE814801C (en) Machine for spreading manure. 29.5 ". 49. p
Sagi et al. Torulom des Zentralnervensystems
DE1928535C3 (en) Decorative frame and process for the production of precious stones
DE1527419A1 (en) Device for applying soldering agents
DE939418C (en) Process for the production of clad deep-drawing tape
Schnitzer Vegetatives Nervensystem und Sensibilisierung
DE1427374A1 (en) Process for the production of composite strips to be pressed into bearing shells from a sheet steel cylinder provided with a bearing metal layer using a centrifugal process
DE741848C (en) Process for the production of one-piece trouser support flaps made of leather or the like.
DE1430905A1 (en) Method and apparatus for joining different materials in assembled sections
DE1839541U (en) CURTAIN FABRIC.
DE378811C (en) Process for the production of chip briquettes with the addition of finishing materials
DE895039C (en) Process for the manufacture of dry rectifiers