DE1209844C2 - - Google Patents
Info
- Publication number
- DE1209844C2 DE1209844C2 DE1958T0015727 DET0015727A DE1209844C2 DE 1209844 C2 DE1209844 C2 DE 1209844C2 DE 1958T0015727 DE1958T0015727 DE 1958T0015727 DE T0015727 A DET0015727 A DE T0015727A DE 1209844 C2 DE1209844 C2 DE 1209844C2
- Authority
- DE
- Germany
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DET15727A DE1209844B (de) | 1958-10-08 | 1958-10-08 | Loesung zum Mattaetzen von Halbleiterkoerpern |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DET15727A DE1209844B (de) | 1958-10-08 | 1958-10-08 | Loesung zum Mattaetzen von Halbleiterkoerpern |
Publications (2)
Publication Number | Publication Date |
---|---|
DE1209844B DE1209844B (de) | 1966-01-27 |
DE1209844C2 true DE1209844C2 (de) | 1966-08-11 |
Family
ID=7548010
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DET15727A Granted DE1209844B (de) | 1958-10-08 | 1958-10-08 | Loesung zum Mattaetzen von Halbleiterkoerpern |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE1209844B (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0183925A3 (en) * | 1984-10-05 | 1987-09-23 | Schering Aktiengesellschaft Berlin Und Bergkamen | Process for etching the walls of through-holes in synthetic-resin boards to be used in the manufacture of printed circuits |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1299769B (de) * | 1966-08-26 | 1969-07-24 | Bosch Gmbh Robert | Verfahren zur Kontaktierung einer Halbleiteranordnung |
WO1991019429A1 (en) * | 1990-06-18 | 1991-12-26 | Ellis Frampton E Iii | Shoe sole structures |
US6284721B1 (en) | 1997-01-21 | 2001-09-04 | Ki Won Lee | Cleaning and etching compositions |
KR100248113B1 (ko) | 1997-01-21 | 2000-03-15 | 이기원 | 전자 표시 장치 및 기판용 세정 및 식각 조성물 |
DE102007061687B4 (de) | 2007-12-19 | 2010-04-29 | Cpi Chemiepark Institut Gmbh | Verfahren zum Mattierungsätzen von Siliziumsubstraten und Ätzmischung zur Durchführung des Verfahrens |
DE102009007136A1 (de) | 2009-02-02 | 2010-08-12 | Sovello Ag | Ätzmischung zur Herstellung einer strukturierten Oberfläche auf Siliziumsubstraten |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT165095B (de) * | 1947-03-19 | 1950-01-10 | Philipsen Patent Verwertungs G | Verfahren zum Schärfen von Werkzeugen, wie Feilen od. dgl. |
GB753158A (en) * | 1953-03-25 | 1956-07-18 | Standard Telephones Cables Ltd | Method of etching germanium or silicon |
DE1040135B (de) * | 1956-10-27 | 1958-10-02 | Siemens Ag | Verfahren zur Herstellung von Halbleiteranordnungen aus Silicium od. dgl. durch Anwendung eines chemischen AEtzvorganges an der Stelle des p-n-UEberganges |
-
1958
- 1958-10-08 DE DET15727A patent/DE1209844B/de active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0183925A3 (en) * | 1984-10-05 | 1987-09-23 | Schering Aktiengesellschaft Berlin Und Bergkamen | Process for etching the walls of through-holes in synthetic-resin boards to be used in the manufacture of printed circuits |
Also Published As
Publication number | Publication date |
---|---|
DE1209844B (de) | 1966-01-27 |