DE112020004322A5 - Kühlsystem - Google Patents
Kühlsystem Download PDFInfo
- Publication number
- DE112020004322A5 DE112020004322A5 DE112020004322.3T DE112020004322T DE112020004322A5 DE 112020004322 A5 DE112020004322 A5 DE 112020004322A5 DE 112020004322 T DE112020004322 T DE 112020004322T DE 112020004322 A5 DE112020004322 A5 DE 112020004322A5
- Authority
- DE
- Germany
- Prior art keywords
- cooling system
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3731—Ceramic materials or glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102019124593.1 | 2019-09-12 | ||
DE102019124593.1A DE102019124593A1 (de) | 2019-09-12 | 2019-09-12 | Kühlsystem |
PCT/EP2020/071245 WO2021047815A1 (de) | 2019-09-12 | 2020-07-28 | Kühlsystem |
Publications (1)
Publication Number | Publication Date |
---|---|
DE112020004322A5 true DE112020004322A5 (de) | 2022-05-25 |
Family
ID=71899718
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102019124593.1A Pending DE102019124593A1 (de) | 2019-09-12 | 2019-09-12 | Kühlsystem |
DE112020004322.3T Pending DE112020004322A5 (de) | 2019-09-12 | 2020-07-28 | Kühlsystem |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102019124593.1A Pending DE102019124593A1 (de) | 2019-09-12 | 2019-09-12 | Kühlsystem |
Country Status (4)
Country | Link |
---|---|
US (1) | US20220293490A1 (de) |
CN (1) | CN114342070A (de) |
DE (2) | DE102019124593A1 (de) |
WO (1) | WO2021047815A1 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3996129A1 (de) * | 2020-11-04 | 2022-05-11 | Nexperia B.V. | Halbleiterbauelement und verfahren zur herstellung eines halbleiterbauelements |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6008535A (en) * | 1998-09-17 | 1999-12-28 | Advanced Ceramic X Corp. | Method of making a semiconductor diode from laminated ceramic tape |
DE19924960A1 (de) * | 1999-05-31 | 2000-12-14 | Siemens Ag | Vorrichtung zur Kühlung von Halbleiterbauelementen |
EP2142489A1 (de) * | 2007-04-24 | 2010-01-13 | CeramTec AG | Bauteil mit einem keramischen körper mit metallisierter oberfläche |
KR20130007630A (ko) * | 2010-04-28 | 2013-01-18 | 교세라 가부시키가이샤 | 방열 장치 및 반도체 장치 |
DE102014208526B4 (de) * | 2014-05-07 | 2020-01-30 | Infineon Technologies Ag | Elektronikbaugruppe |
DE102016200276A1 (de) * | 2016-01-13 | 2017-07-13 | Siemens Aktiengesellschaft | Leistungselektronische Schaltung mit einem keramischen Kühlkörper |
FR3054721B1 (fr) * | 2016-07-29 | 2018-12-07 | Safran | Module electronique de puissance d'un aeronef et procede de fabrication associe |
FR3054928B1 (fr) * | 2016-08-05 | 2018-08-17 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede d'encapsulation d'un circuit integre pour former un module de puissance tridimensionnel |
EP3367426A1 (de) * | 2017-02-27 | 2018-08-29 | Siemens Aktiengesellschaft | Halbleitermodul mit kühlkörper |
EP3607581A1 (de) * | 2017-04-06 | 2020-02-12 | CeramTec GmbH | Zweiseitig gekühlter schaltkreis |
DE102018102144A1 (de) * | 2018-01-31 | 2019-08-01 | Tdk Electronics Ag | Elektronisches Bauelement |
-
2019
- 2019-09-12 DE DE102019124593.1A patent/DE102019124593A1/de active Pending
-
2020
- 2020-07-28 WO PCT/EP2020/071245 patent/WO2021047815A1/de active Application Filing
- 2020-07-28 CN CN202080063961.0A patent/CN114342070A/zh active Pending
- 2020-07-28 US US17/635,474 patent/US20220293490A1/en active Pending
- 2020-07-28 DE DE112020004322.3T patent/DE112020004322A5/de active Pending
Also Published As
Publication number | Publication date |
---|---|
CN114342070A (zh) | 2022-04-12 |
US20220293490A1 (en) | 2022-09-15 |
DE102019124593A1 (de) | 2021-03-18 |
WO2021047815A1 (de) | 2021-03-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE112020002807A5 (de) | Kühlvorrichtung | |
DE112020002266A5 (de) | Kühlvorrichtung | |
DK3575022T3 (da) | Værktøjssystem | |
GB2589227B (en) | Cooling system | |
DK3564536T3 (da) | Kølehoved | |
DK3537089T3 (da) | Køleapparat | |
DK3781726T3 (da) | Fotovoltaisk-elektrokemisk (pv-ec) system | |
HUE064840T2 (hu) | Hûtõrendszer | |
DK3463715T3 (da) | Støbesystem | |
DK3404268T3 (da) | Ventilationsenhed til kølesystemer | |
NO345588B1 (en) | Cooling system | |
DK3793895T3 (da) | Udstødningssystem | |
DK3972389T3 (da) | Belysningssystem | |
NO345103B1 (no) | Kjølebaffel | |
DE112020004322A5 (de) | Kühlsystem | |
GB201803389D0 (en) | Cooling system | |
EP3884520C0 (de) | Kühlsystem | |
DK3567264T3 (da) | Fastgørelsessystem | |
GB201807143D0 (en) | Cooling system | |
FR3087992B1 (fr) | Systeme thermoretractable | |
IT201700082606A1 (it) | Impianto termico | |
DK3699425T3 (da) | Mekanisk kølesystem | |
JP1713336S (ja) | 冷却装置 | |
GB2600050B (en) | Cooling system | |
IT201900004021A1 (it) | Radiatore |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R012 | Request for examination validly filed |