DE112017001791A5 - Lichtemittierendes Modul und Anzeigevorrichtung mit diesem - Google Patents

Lichtemittierendes Modul und Anzeigevorrichtung mit diesem Download PDF

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Publication number
DE112017001791A5
DE112017001791A5 DE112017001791.2T DE112017001791T DE112017001791A5 DE 112017001791 A5 DE112017001791 A5 DE 112017001791A5 DE 112017001791 T DE112017001791 T DE 112017001791T DE 112017001791 A5 DE112017001791 A5 DE 112017001791A5
Authority
DE
Germany
Prior art keywords
display device
light emitting
emitting module
module
display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112017001791.2T
Other languages
English (en)
Inventor
Jürgen Moosburger
Matthias Sabathil
Frank Singer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of DE112017001791A5 publication Critical patent/DE112017001791A5/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/24—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/10—Controlling the intensity of the light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/20—Controlling the colour of the light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/50—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits
    • H05B45/58—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits involving end of life detection of LEDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Led Device Packages (AREA)
  • Control Of Indicators Other Than Cathode Ray Tubes (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Control Of El Displays (AREA)
DE112017001791.2T 2016-04-01 2017-03-29 Lichtemittierendes Modul und Anzeigevorrichtung mit diesem Pending DE112017001791A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102016105989.7 2016-04-01
DE102016105989.7A DE102016105989A1 (de) 2016-04-01 2016-04-01 Lichtemittierendes Modul
PCT/EP2017/057434 WO2017167812A1 (de) 2016-04-01 2017-03-29 Lichtemittierendes modul und anzeigevorrichtung mit diesem

Publications (1)

Publication Number Publication Date
DE112017001791A5 true DE112017001791A5 (de) 2018-12-13

Family

ID=58536939

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102016105989.7A Withdrawn DE102016105989A1 (de) 2016-04-01 2016-04-01 Lichtemittierendes Modul
DE112017001791.2T Pending DE112017001791A5 (de) 2016-04-01 2017-03-29 Lichtemittierendes Modul und Anzeigevorrichtung mit diesem

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102016105989.7A Withdrawn DE102016105989A1 (de) 2016-04-01 2016-04-01 Lichtemittierendes Modul

Country Status (6)

Country Link
US (1) US10763396B2 (de)
JP (1) JP6707142B2 (de)
KR (2) KR102385059B1 (de)
CN (2) CN109075183B (de)
DE (2) DE102016105989A1 (de)
WO (1) WO2017167812A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017113573A1 (de) * 2017-06-20 2018-12-20 Osram Opto Semiconductors Gmbh Anordnung mit einer Mehrzahl von Leuchtmodulen und Verfahren zur Herstellung einer Anordnung mit einer Mehrzahl von Leuchtmodulen
DE102017119872A1 (de) * 2017-08-30 2019-02-28 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines optoelektronischen Halbleiterbauteils und optoelektronisches Halbleiterbauteil
DE102017123402A1 (de) * 2017-10-09 2019-04-11 Osram Opto Semiconductors Gmbh Optoelektronisches Modul und Anzeigeelement
DE102018111021A1 (de) 2017-12-14 2019-06-19 Osram Opto Semiconductors Gmbh Lichtemittierendes halbleiterbauteil und verfahren zur herstellung eines licht emittierenden halbleiterbauteils
DE102018120730A1 (de) * 2018-08-24 2020-02-27 Osram Oled Gmbh Display und Herstellungsverfahren für ein Display
CN117239020A (zh) * 2018-12-26 2023-12-15 亮锐有限责任公司 两步磷光体沉积来制得矩阵阵列
US11719974B2 (en) * 2020-02-03 2023-08-08 Mitsubishi Electric Corporation Self-luminous body for display apparatus, self-luminous display apparatus, backlight, liquid crystal display apparatus, and method for manufacturing self-luminous body for display apparatus
JP6914457B1 (ja) * 2020-06-23 2021-08-04 三菱電機株式会社 自発光装置、液晶表示装置、および自発光装置の製造方法

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US20050179675A1 (en) 2002-05-27 2005-08-18 Koninklijke Phillips Electonics N.C. Pixel fault masking
TWI349903B (en) 2002-11-06 2011-10-01 Chimei Innolux Corp Sensing of emissive elements in an active matrix display device
JP2005259724A (ja) 2004-02-10 2005-09-22 Fuji Photo Film Co Ltd 発光素子の順方向電圧降下測定方法及び装置、並びに光源装置及びこれを用いた感熱プリンタ
US7012382B2 (en) * 2004-04-30 2006-03-14 Tak Meng Cheang Light emitting diode based light system with a redundant light source
WO2006061728A2 (en) * 2004-12-06 2006-06-15 Koninklijke Philips Electronics N.V. Single chip led as compact color variable light source
JP5586120B2 (ja) 2005-07-04 2014-09-10 株式会社半導体エネルギー研究所 表示装置
CA2688870A1 (en) 2009-11-30 2011-05-30 Ignis Innovation Inc. Methode and techniques for improving display uniformity
JP5279684B2 (ja) * 2009-11-09 2013-09-04 株式会社日立ハイテクノロジーズ Ｌｅｄ駆動回路、発光装置、画像検査装置、分析装置、ｌｅｄ駆動回路の故障検査方法
US20120147293A1 (en) * 2010-06-11 2012-06-14 Amercan Panel Corporation Redundant backlight for liquid crystal displays
DE102010047450A1 (de) 2010-10-04 2012-04-05 Osram Opto Semiconductors Gmbh Leuchtvorrichtung
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JP2015011928A (ja) * 2013-07-01 2015-01-19 パイオニア株式会社 発光装置
DE102013109031B4 (de) 2013-08-21 2021-11-04 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines optoelektronischen Halbleiterchips
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Also Published As

Publication number Publication date
CN109075183B (zh) 2023-07-25
JP6707142B2 (ja) 2020-06-10
WO2017167812A1 (de) 2017-10-05
KR20180120748A (ko) 2018-11-06
KR102385059B1 (ko) 2022-04-12
US10763396B2 (en) 2020-09-01
KR20210049962A (ko) 2021-05-06
DE102016105989A1 (de) 2017-10-05
US20190103516A1 (en) 2019-04-04
JP2019512878A (ja) 2019-05-16
CN116978920A (zh) 2023-10-31
CN109075183A (zh) 2018-12-21
KR102256893B1 (ko) 2021-05-28

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