DE112013002366A5 - Verfahren und Vorrichtung zur Vorbehandlung eines beschichteten oder unbeschichteten Substrats - Google Patents

Verfahren und Vorrichtung zur Vorbehandlung eines beschichteten oder unbeschichteten Substrats Download PDF

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Publication number
DE112013002366A5
DE112013002366A5 DE112013002366.0T DE112013002366T DE112013002366A5 DE 112013002366 A5 DE112013002366 A5 DE 112013002366A5 DE 112013002366 T DE112013002366 T DE 112013002366T DE 112013002366 A5 DE112013002366 A5 DE 112013002366A5
Authority
DE
Germany
Prior art keywords
pretreatment
coated
uncoated substrate
uncoated
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112013002366.0T
Other languages
English (en)
Inventor
Markus Berendt
Manfred Schreil
Volker Linss
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Von Ardenne Asset GmbH and Co KG
Original Assignee
Von Ardenne GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Von Ardenne GmbH filed Critical Von Ardenne GmbH
Publication of DE112013002366A5 publication Critical patent/DE112013002366A5/de
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/3438Electrodes other than cathode
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02Pretreatment of the material to be coated
    • C23C14/021Cleaning or etching treatments
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02Pretreatment of the material to be coated
    • C23C14/024Deposition of sublayers, e.g. to promote adhesion of the coating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32733Means for moving the material to be treated
    • H01J37/32752Means for moving the material to be treated for moving the material across the discharge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405Magnetron sputtering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/3414Targets
    • H01J37/3417Arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/3414Targets
    • H01J37/3423Shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
DE112013002366.0T 2012-06-22 2013-06-24 Verfahren und Vorrichtung zur Vorbehandlung eines beschichteten oder unbeschichteten Substrats Pending DE112013002366A5 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE102012210568.9 2012-06-22
DE102012210568 2012-06-22
DE102012110045 2012-10-22
DE102012110045.4 2012-10-22
PCT/EP2013/063112 WO2013190141A1 (de) 2012-06-22 2013-06-24 Verfahren und vorrichtung zur vorbehandlung eines beschichteten oder unbeschichteten substrats

Publications (1)

Publication Number Publication Date
DE112013002366A5 true DE112013002366A5 (de) 2015-02-26

Family

ID=48703468

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112013002366.0T Pending DE112013002366A5 (de) 2012-06-22 2013-06-24 Verfahren und Vorrichtung zur Vorbehandlung eines beschichteten oder unbeschichteten Substrats

Country Status (2)

Country Link
DE (1) DE112013002366A5 (de)
WO (1) WO2013190141A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015120723A1 (de) * 2015-11-30 2017-06-01 Von Ardenne Gmbh Beschichtungsanordnung, Substratträger und Verfahren
CN114059016A (zh) * 2021-11-02 2022-02-18 Oppo广东移动通信有限公司 镀膜前处理方法、装置、外观件制备方法和电子设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5073241A (en) * 1986-01-31 1991-12-17 Kabushiki Kaisha Meidenshae Method for carbon film production
US5106474A (en) * 1990-11-21 1992-04-21 Viratec Thin Films, Inc. Anode structures for magnetron sputtering apparatus
TW366367B (en) * 1995-01-26 1999-08-11 Ibm Sputter deposition of hydrogenated amorphous carbon film
DE10347521A1 (de) * 2002-12-04 2004-06-24 Leybold Optics Gmbh Verfahren zur Herstellung Multilayerschicht und Vorrichtung zur Durchführung des Verfahrens
JP4533815B2 (ja) * 2005-07-08 2010-09-01 株式会社東芝 スパッタリングターゲットとそれを用いた光学薄膜の製造方法
JP4536819B2 (ja) * 2008-08-19 2010-09-01 株式会社神戸製鋼所 窒素含有非晶質炭素系皮膜、非晶質炭素系積層皮膜および摺動部材

Also Published As

Publication number Publication date
WO2013190141A1 (de) 2013-12-27

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Legal Events

Date Code Title Description
R012 Request for examination validly filed
R081 Change of applicant/patentee

Owner name: VON ARDENNE ASSET GMBH & CO. KG, DE

Free format text: FORMER OWNER: VON ARDENNE ANLAGENTECHNIK GMBH, 01324 DRESDEN, DE

R082 Change of representative

Representative=s name: LIPPERT STACHOW PATENTANWAELTE RECHTSANWAELTE , DE

Representative=s name: PATENTANWAELTE LIPPERT, STACHOW & PARTNER, DE

R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: C23C0014000000

Ipc: C23C0014020000

R081 Change of applicant/patentee

Owner name: VON ARDENNE ASSET GMBH & CO. KG, DE

Free format text: FORMER OWNER: VON ARDENNE GMBH, 01324 DRESDEN, DE

R082 Change of representative

Representative=s name: LIPPERT STACHOW PATENTANWAELTE RECHTSANWAELTE , DE

R016 Response to examination communication
R016 Response to examination communication