DE112011105763A5 - Light-emitting component - Google Patents

Light-emitting component Download PDF

Info

Publication number
DE112011105763A5
DE112011105763A5 DE112011105763.6T DE112011105763T DE112011105763A5 DE 112011105763 A5 DE112011105763 A5 DE 112011105763A5 DE 112011105763 T DE112011105763 T DE 112011105763T DE 112011105763 A5 DE112011105763 A5 DE 112011105763A5
Authority
DE
Germany
Prior art keywords
light
emitting component
emitting
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112011105763.6T
Other languages
German (de)
Inventor
Klaus Stockwald
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of DE112011105763A5 publication Critical patent/DE112011105763A5/en
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F21V29/58—Cooling arrangements using liquid coolants characterised by the coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
DE112011105763.6T 2011-10-25 2011-10-25 Light-emitting component Withdrawn DE112011105763A5 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2011/068620 WO2013060357A1 (en) 2011-10-25 2011-10-25 Light emitting component

Publications (1)

Publication Number Publication Date
DE112011105763A5 true DE112011105763A5 (en) 2014-09-25

Family

ID=44906059

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112011105763.6T Withdrawn DE112011105763A5 (en) 2011-10-25 2011-10-25 Light-emitting component

Country Status (2)

Country Link
DE (1) DE112011105763A5 (en)
WO (1) WO2013060357A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104019379A (en) * 2013-02-28 2014-09-03 北京艾久瓦光电科技有限公司 Liquid cooling led lamp
CN106574750B (en) * 2014-07-22 2020-01-21 飞利浦照明控股有限公司 Flexible winding main line lampwick
US9401468B2 (en) 2014-12-24 2016-07-26 GE Lighting Solutions, LLC Lamp with LED chips cooled by a phase transformation loop
CN108291707A (en) * 2015-11-19 2018-07-17 飞利浦照明控股有限公司 Lamp
JP6740654B2 (en) * 2016-03-18 2020-08-19 日亜化学工業株式会社 Light source
CN107270155B (en) * 2017-07-31 2018-08-28 东莞合安机电有限公司 A kind of liquid LED light installing mechanism
CN107477512A (en) * 2017-08-22 2017-12-15 苏州旭耀光电有限公司 A kind of automatic heat radiation water ripples LED landscape lamp
CN114122242B (en) * 2022-01-25 2022-05-13 宏齐光电子(深圳)有限公司 Packaging structure based on flip LED chip

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2617314A1 (en) * 2005-04-05 2006-10-12 Tir Technology Lp Mounting assembly for optoelectronic devices
WO2007069119A1 (en) * 2005-12-14 2007-06-21 Philips Intellectual Property & Standards Gmbh Lighting device and method for manufacturing same
EP1953837A3 (en) * 2007-01-31 2014-01-15 OSRAM Opto Semiconductors GmbH Semiconductor component with an optically active layer, assembly with a number of optically active layers and method for producing a semiconductor component
DE102007041852A1 (en) * 2007-09-03 2009-03-05 Osram Opto Semiconductors Gmbh High power LED module, has semicircular hollow portion extending into transparent carrier on side of LED and having evaporable cooling agent, and electrode structures provided in transparent carrier
US8188595B2 (en) * 2008-08-13 2012-05-29 Progressive Cooling Solutions, Inc. Two-phase cooling for light-emitting devices
US20110193479A1 (en) * 2010-02-08 2011-08-11 Nilssen Ole K Evaporation Cooled Lamp

Also Published As

Publication number Publication date
WO2013060357A1 (en) 2013-05-02

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Legal Events

Date Code Title Description
R005 Application deemed withdrawn due to failure to request examination