DE112007003287A5 - Kameramodul auf Waferebene - Google Patents
Kameramodul auf Waferebene Download PDFInfo
- Publication number
- DE112007003287A5 DE112007003287A5 DE112007003287T DE112007003287T DE112007003287A5 DE 112007003287 A5 DE112007003287 A5 DE 112007003287A5 DE 112007003287 T DE112007003287 T DE 112007003287T DE 112007003287 T DE112007003287 T DE 112007003287T DE 112007003287 A5 DE112007003287 A5 DE 112007003287A5
- Authority
- DE
- Germany
- Prior art keywords
- camera module
- wafer level
- wafer
- level
- camera
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1464—Back illuminated imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14687—Wafer level processing
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006054883.3 | 2006-11-20 | ||
DE102006054883 | 2006-11-20 | ||
DE102007038465A DE102007038465A1 (de) | 2006-11-20 | 2007-08-14 | Kameramodul auf Waferebene |
DE102007038465.5 | 2007-08-14 | ||
PCT/DE2007/002101 WO2008061513A1 (de) | 2006-11-20 | 2007-11-19 | Kameramodul auf waferebene |
Publications (1)
Publication Number | Publication Date |
---|---|
DE112007003287A5 true DE112007003287A5 (de) | 2009-10-22 |
Family
ID=39311383
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102007038465A Withdrawn DE102007038465A1 (de) | 2006-11-20 | 2007-08-14 | Kameramodul auf Waferebene |
DE112007003287T Withdrawn DE112007003287A5 (de) | 2006-11-20 | 2007-11-19 | Kameramodul auf Waferebene |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102007038465A Withdrawn DE102007038465A1 (de) | 2006-11-20 | 2007-08-14 | Kameramodul auf Waferebene |
Country Status (2)
Country | Link |
---|---|
DE (2) | DE102007038465A1 (de) |
WO (1) | WO2008061513A1 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107919373B (zh) * | 2017-11-07 | 2019-03-12 | 德淮半导体有限公司 | 背照式图像传感器 |
CN110379805B (zh) * | 2019-07-25 | 2021-02-05 | 豪威科技(上海)有限公司 | 图像传感器晶圆、芯片及其制作方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7160478B2 (en) * | 2001-08-24 | 2007-01-09 | Schott Ag | Method for producing electronic componets |
US7253957B2 (en) * | 2004-05-13 | 2007-08-07 | Micron Technology, Inc. | Integrated optics units and methods of manufacturing integrated optics units for use with microelectronic imagers |
US7397066B2 (en) * | 2004-08-19 | 2008-07-08 | Micron Technology, Inc. | Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers |
US7511262B2 (en) * | 2004-08-30 | 2009-03-31 | Micron Technology, Inc. | Optical device and assembly for use with imaging dies, and wafer-label imager assembly |
-
2007
- 2007-08-14 DE DE102007038465A patent/DE102007038465A1/de not_active Withdrawn
- 2007-11-19 WO PCT/DE2007/002101 patent/WO2008061513A1/de active Application Filing
- 2007-11-19 DE DE112007003287T patent/DE112007003287A5/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
WO2008061513A1 (de) | 2008-05-29 |
DE102007038465A1 (de) | 2008-05-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8139 | Disposal/non-payment of the annual fee |