DE1071842B - - Google Patents

Info

Publication number
DE1071842B
DE1071842B DENDAT1071842D DE1071842DA DE1071842B DE 1071842 B DE1071842 B DE 1071842B DE NDAT1071842 D DENDAT1071842 D DE NDAT1071842D DE 1071842D A DE1071842D A DE 1071842DA DE 1071842 B DE1071842 B DE 1071842B
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DENDAT1071842D
Other languages
German (de)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of DE1071842B publication Critical patent/DE1071842B/de
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157Partial encapsulation or coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
DENDAT1071842D 1957-04-25 Pending DE1071842B (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DEP0018414 1957-04-25

Publications (1)

Publication Number Publication Date
DE1071842B true DE1071842B (xx)

Family

ID=7367004

Family Applications (1)

Application Number Title Priority Date Filing Date
DENDAT1071842D Pending DE1071842B (xx) 1957-04-25

Country Status (1)

Country Link
DE (1) DE1071842B (xx)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1230912B (de) * 1960-06-09 1966-12-22 Siemens Ag Verfahren zum Herstellen einer Halbleiteranordnung

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1230912B (de) * 1960-06-09 1966-12-22 Siemens Ag Verfahren zum Herstellen einer Halbleiteranordnung

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