DE10394243D2 - Bondvorrichtung und Bondverfahren - Google Patents
Bondvorrichtung und BondverfahrenInfo
- Publication number
- DE10394243D2 DE10394243D2 DE10394243T DE10394243T DE10394243D2 DE 10394243 D2 DE10394243 D2 DE 10394243D2 DE 10394243 T DE10394243 T DE 10394243T DE 10394243 T DE10394243 T DE 10394243T DE 10394243 D2 DE10394243 D2 DE 10394243D2
- Authority
- DE
- Germany
- Prior art keywords
- bonding
- bonding method
- bonding device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/DE2003/001793 WO2004112100A1 (de) | 2003-06-02 | 2003-06-02 | Bondvorrichtung und bondverfahren |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE10394243D2 true DE10394243D2 (de) | 2006-03-02 |
| DE10394243B4 DE10394243B4 (de) | 2015-10-29 |
Family
ID=33546408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE10394243.2T Expired - Lifetime DE10394243B4 (de) | 2003-06-02 | 2003-06-02 | Bondvorrichtung und Bondverfahren |
Country Status (3)
| Country | Link |
|---|---|
| AU (1) | AU2003243906A1 (de) |
| DE (1) | DE10394243B4 (de) |
| WO (1) | WO2004112100A1 (de) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102013105660B3 (de) * | 2013-06-03 | 2014-07-24 | Amicra Microtechnologies Gmbh | Bestückungsvorrichtung und Verfahren zum Aufbringen von elektrischen und/oder optoelektrischen Bauteilen auf Substrate |
| KR102240822B1 (ko) * | 2016-10-08 | 2021-04-15 | 캡콘 리미티드 | 반도체 패키징 디바이스와 이의 제어 방법 및 제어 장치 |
| DE102017125932A1 (de) | 2017-11-07 | 2019-05-09 | Asm Amicra Microtechnologies Gmbh | Verfahren zum Bonden von elektrischen, elektronischen, optischen, opto-elektrischen und/oder mechanischen Bauelementen auf Substrate und eine zugehörige Bondvorrichtung |
| DE102019120954B4 (de) | 2019-08-02 | 2023-02-02 | Asmpt Amicra Gmbh | Verfahren zur Herstellung einer Klebeverbindung, Trägerplatte für die Herstellung einer Klebeverbindung und Klebevorrichtung zur Herstellung einer Klebeverbindung |
| DE102019120955B8 (de) * | 2019-08-02 | 2021-03-18 | Asm Amicra Microtechnologies Gmbh | Bondtool, Bondvorrichtung und Bondverfahren |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE8714813U1 (de) * | 1987-11-06 | 1989-03-09 | J. Mühlbauer GmbH, 8495 Roding | Die-Bonder bzw. Wire-Bonder |
| DE8714814U1 (de) * | 1987-11-06 | 1989-03-09 | J. Mühlbauer GmbH, 8495 Roding | Die-Bonder |
| DE8714815U1 (de) * | 1987-11-06 | 1989-03-09 | J. Mühlbauer GmbH, 8495 Roding | Die-Bonder bzw. Wire-Bonder |
| US4980971A (en) * | 1989-12-14 | 1991-01-01 | At&T Bell Laboratories | Method and apparatus for chip placement |
| GB9006035D0 (en) * | 1990-03-16 | 1990-05-09 | Emhart Deutschland | Die eject system for die bonder |
| JP2662131B2 (ja) * | 1991-12-26 | 1997-10-08 | 松下電器産業株式会社 | ボンディング装置 |
| US5547537A (en) * | 1992-05-20 | 1996-08-20 | Kulicke & Soffa, Investments, Inc. | Ceramic carrier transport for die attach equipment |
| DE19510230C2 (de) * | 1995-03-24 | 1999-08-05 | Michael Geringer | Transfervorrichtung für elektrische Bauelemente, insbesondere Chips |
| DE19515684C2 (de) * | 1995-04-28 | 2003-11-06 | Michael Geringer | Verfahren zur Vereinzelung von elektrischen Bauelementen |
| DE19748442A1 (de) * | 1997-11-03 | 1999-05-06 | Georg Sillner | Vorrichtung zum Fördern von kleinen Bauelementen, insbesondere von kleine elektrischen Bauelementen |
| DE59711263D1 (de) * | 1997-10-30 | 2004-03-04 | Esec Trading Sa | Verfahren und Einrichtung für die Justierung des Bondkopfs einer Maschine für das Bonden von Halbleiterchips auf ein Trägermaterial |
| EP0953398A1 (de) * | 1998-02-06 | 1999-11-03 | Esec Sa | Verfahren und Chip für die Kalibrierung eines Wire Bonders |
| FR2789068B1 (fr) * | 1999-02-03 | 2001-03-16 | Optique Et Microsystemes Sa | Dispositif d'alignement pour l'assemblage de microsystemes et pour la micro distribution sur microsystemes ou sur microcomposants biotechnologiques |
| DE10109009C2 (de) * | 2001-02-23 | 2003-12-18 | Geringer Michael | Bonder |
-
2003
- 2003-06-02 WO PCT/DE2003/001793 patent/WO2004112100A1/de active Application Filing
- 2003-06-02 DE DE10394243.2T patent/DE10394243B4/de not_active Expired - Lifetime
- 2003-06-02 AU AU2003243906A patent/AU2003243906A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| DE10394243B4 (de) | 2015-10-29 |
| WO2004112100A1 (de) | 2004-12-23 |
| AU2003243906A1 (en) | 2005-01-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8110 | Request for examination paragraph 44 | ||
| R079 | Amendment of ipc main class |
Free format text: PREVIOUS MAIN CLASS: H01L0021000000 Ipc: H01L0021680000 Free format text: PREVIOUS MAIN CLASS: H01L0021000000 Ipc: H01L0021680000 Effective date: 20110617 |
|
| R082 | Change of representative |
Representative=s name: , Representative=s name: GRAF GLUECK KRITZENBERGER, DE Representative=s name: GLUECK - KRITZENBERGER PATENTANWAELTE PARTGMBB, DE |
|
| R016 | Response to examination communication | ||
| R016 | Response to examination communication | ||
| R018 | Grant decision by examination section/examining division | ||
| R020 | Patent grant now final | ||
| R081 | Change of applicant/patentee |
Owner name: ASMPT AMICRA GMBH, DE Free format text: FORMER OWNER: AMICRA MICROTECHNOLOGIES GMBH, 93059 REGENSBURG, DE Owner name: ASM AMICRA MICROTECHNOLOGIES GMBH, DE Free format text: FORMER OWNER: AMICRA MICROTECHNOLOGIES GMBH, 93059 REGENSBURG, DE |
|
| R082 | Change of representative |
Representative=s name: GLUECK - KRITZENBERGER PATENTANWAELTE PARTGMBB, DE |
|
| R081 | Change of applicant/patentee |
Owner name: ASMPT AMICRA GMBH, DE Free format text: FORMER OWNER: ASM AMICRA MICROTECHNOLOGIES GMBH, 93055 REGENSBURG, DE |
|
| R071 | Expiry of right |