DE10360236A1 - Electronic components external energy-free cooling e.g. for microprocessors in computers, has closed double-wall pipe system with base plate - Google Patents
Electronic components external energy-free cooling e.g. for microprocessors in computers, has closed double-wall pipe system with base plate Download PDFInfo
- Publication number
- DE10360236A1 DE10360236A1 DE2003160236 DE10360236A DE10360236A1 DE 10360236 A1 DE10360236 A1 DE 10360236A1 DE 2003160236 DE2003160236 DE 2003160236 DE 10360236 A DE10360236 A DE 10360236A DE 10360236 A1 DE10360236 A1 DE 10360236A1
- Authority
- DE
- Germany
- Prior art keywords
- base plate
- electronic components
- pipe system
- evaporator
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Fremdenergiefreie Kühlung für elektronische Bauteile.External energy-free cooling for electronic Components.
Elektronische Bauteile, wie sie vor allem in der Computerbranche als Mikroprozessoren und Mikrochips verwendet werden, haben eine hohe elektrische Energieaufnahme, welche eine Aufheizung des elektronischen Bauteils bedingt. Um unzulässig hohe Temperaturen an dem elektronischen Bauteil zu vermeiden, werden diese, unabhängig von integrierten oder gefrästen Kühlrippen, mittels Lüftergebläse und oder Wasserkreisläufe gekühlt. Diese Zwangslüftung und oder Wasserkühlung erfordert ebenfalls zusätzliche Energie.electronic Components, especially in the computer industry as microprocessors and microchips used have a high electrical energy consumption, which causes a heating of the electronic component. Inadmissible high temperatures to avoid the electronic component, these are independent of integrated or milled Cooling fins, by means of fan blower and or Water cycles cooled. This forced ventilation and or water cooling also requires additional Energy.
Die technische Aufgabe besteht darin, dass eine Kühlung von elektronischen Bauelementen erreicht wird, ohne dass zusätzliche Energie für diese zu benötigt wird und ohne dass bei der Kühlung eine Geräuschbelästigung durch den Betrieb der Zwangslüftung und der Umwälzpumpe bei Wasserkühlung entsteht.The technical task is that a cooling of electronic components is achieved without any additional Energy for these too needed and without that during cooling a noise nuisance through the operation of forced ventilation and the circulation pump produced by water cooling.
Die
Lösung
des technischen Problems wird dadurch erreicht, dass ein Doppelrohrsystem
nach
Die
Funktion der Kühlung
erfolgt der Art, dass in das Doppelrohrsystem nach
- 11
- verschließbares Füll- bzw. Evakuierungsrohrlockable filling or evacuation tube
- 22
- Rücklaufrohr (Kondensat, Kältemittel)Return pipe (Condensate, refrigerant)
- 33
- Steigrohr (Kältemitteldampf)riser (Refrigerant vapor)
- 44
- zusätzlicher Verdampfungskörper (z.B. Konvektor)additional Evaporating body (e.g., convector)
- 55
- Elektronisches Bauteil als Wärmequelle (Prozessor, Mikrochip usw.)electronic Component as a heat source (Processor, microchip, etc.)
- 66
- Kondensator (Verflüssiger)capacitor (Condenser)
- 77
- KältemitteldampfRefrigerant vapor
- 88th
- Kältemittelrefrigerant
- 99
- Abstandpunkte (Arretierungs-)distance points (Arresting)
- 1010
- KlammerarretierungKlammerarretierung
- 1111
- Verdampferplatteevaporator plate
- 1212
- Ausdehnungsgefäß (offen oder geschlossen)Expansion vessel (open or closed)
- 1313
- Absperrventilshut-off valve
- 1414
- UmtriebsflüssigkeitUmtriebsflüssigkeit
Zeichnungen (als Prinzipdarstellungen)Drawings (as schematic representations)
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2003160236 DE10360236A1 (en) | 2003-12-20 | 2003-12-20 | Electronic components external energy-free cooling e.g. for microprocessors in computers, has closed double-wall pipe system with base plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2003160236 DE10360236A1 (en) | 2003-12-20 | 2003-12-20 | Electronic components external energy-free cooling e.g. for microprocessors in computers, has closed double-wall pipe system with base plate |
Publications (1)
Publication Number | Publication Date |
---|---|
DE10360236A1 true DE10360236A1 (en) | 2005-07-28 |
Family
ID=34706389
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2003160236 Ceased DE10360236A1 (en) | 2003-12-20 | 2003-12-20 | Electronic components external energy-free cooling e.g. for microprocessors in computers, has closed double-wall pipe system with base plate |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE10360236A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102155859A (en) * | 2011-04-30 | 2011-08-17 | 上海交通大学 | U-shaped gravity assisted heat pipe for freezing system |
CN101752330B (en) * | 2008-12-05 | 2012-02-01 | 财团法人工业技术研究院 | Heat dissipation cold plate and refrigeration system |
DE102011012577A1 (en) | 2011-02-26 | 2012-08-30 | Volkswagen Ag | Heat exchange device for air conditioning system, has internal spaces for receiving and/or supplying heat transfer medium and refrigerant respectively |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3986550A (en) * | 1973-10-11 | 1976-10-19 | Mitsubishi Denki Kabushiki Kaisha | Heat transferring apparatus |
WO1999047994A1 (en) * | 1998-03-16 | 1999-09-23 | Lee Mok Hyoung | System for cooling device in computer |
DE10053258A1 (en) * | 2000-10-26 | 2002-05-16 | Guenther Engineering Gmbh | Heat sink for electronic device has evaporator and condenser heat exchangers connected in hermetically sealed heat sink circuit |
WO2002093339A1 (en) * | 2001-05-15 | 2002-11-21 | Mok-Hyoung Lee | Heat transfer apparatus using refrigerant and computer having the same |
-
2003
- 2003-12-20 DE DE2003160236 patent/DE10360236A1/en not_active Ceased
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3986550A (en) * | 1973-10-11 | 1976-10-19 | Mitsubishi Denki Kabushiki Kaisha | Heat transferring apparatus |
WO1999047994A1 (en) * | 1998-03-16 | 1999-09-23 | Lee Mok Hyoung | System for cooling device in computer |
DE10053258A1 (en) * | 2000-10-26 | 2002-05-16 | Guenther Engineering Gmbh | Heat sink for electronic device has evaporator and condenser heat exchangers connected in hermetically sealed heat sink circuit |
WO2002093339A1 (en) * | 2001-05-15 | 2002-11-21 | Mok-Hyoung Lee | Heat transfer apparatus using refrigerant and computer having the same |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101752330B (en) * | 2008-12-05 | 2012-02-01 | 财团法人工业技术研究院 | Heat dissipation cold plate and refrigeration system |
DE102011012577A1 (en) | 2011-02-26 | 2012-08-30 | Volkswagen Ag | Heat exchange device for air conditioning system, has internal spaces for receiving and/or supplying heat transfer medium and refrigerant respectively |
CN102155859A (en) * | 2011-04-30 | 2011-08-17 | 上海交通大学 | U-shaped gravity assisted heat pipe for freezing system |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ON | Later submitted papers | ||
OP8 | Request for examination as to paragraph 44 patent law | ||
8122 | Nonbinding interest in granting licenses declared | ||
8131 | Rejection |