DE10326286A1 - mobile device - Google Patents

mobile device Download PDF

Info

Publication number
DE10326286A1
DE10326286A1 DE10326286A DE10326286A DE10326286A1 DE 10326286 A1 DE10326286 A1 DE 10326286A1 DE 10326286 A DE10326286 A DE 10326286A DE 10326286 A DE10326286 A DE 10326286A DE 10326286 A1 DE10326286 A1 DE 10326286A1
Authority
DE
Germany
Prior art keywords
mobile device
camera
circuit board
built
device housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE10326286A
Other languages
German (de)
Inventor
Nicolai Walkling
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE10326286A priority Critical patent/DE10326286A1/en
Priority to PCT/EP2004/050448 priority patent/WO2004110034A1/en
Publication of DE10326286A1 publication Critical patent/DE10326286A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/16—Connectors or connections adapted for particular applications for telephony
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Telephone Set Structure (AREA)

Abstract

Die vorliegende Erfindung betrifft ein Mobilfunkgerät mit einer im Mobilfunkgerätegehäuse angeordneten Leiterplatte, auf welcher elektronische Bauelemente des Mobilfunkgerätes angeordnet sind, und mit einer eingebauten Kamera. Zur einfacheren Montage ist die Kamera direkt auf die Leiterplatte des Mobilfunkgerätes gelötet, wobei im zusammengebauten Zustand des Mobilfunkgerätes vor der Kamera im Mobilfunkgerätegehäuse eine Öffnung vorgesehen ist.The present invention relates to a mobile device with a circuit board arranged in the mobile device housing, on which electronic components of the mobile device are arranged, and with a built-in camera. For easier installation, the camera is soldered directly to the circuit board of the mobile device, wherein in the assembled state of the mobile device in front of the camera in the mobile device housing an opening is provided.

Description

Die vorliegende Erfindung betrifft ein Mobilfunkgerät mit einer im Mobilfunkgerätegehäuse angeordneten Leiterplatte, auf welche elektronische Bauelemente des Mobilfunkgerätes angeordnet sind, und mit einer eingebauten Kamera.The The present invention relates to a mobile device having a mobile device housing Printed circuit board on which arranged electronic components of the mobile device are, and with a built-in camera.

In der heutigen Zeit werden immer mehr Mobilfunkgerät mit einer eingebauten Kamera ausgestattet. Diese Kamera wird über Druckkontakte oder über eine flexible Verbindungsleitung und Steckverbinder mit der Leiterplatte des Mobilfunkgerätes verbunden. Hierbei handelt es sich um eine aufwendige, teure Verbindungsart, welche darüber hinaus einer automatischen Fertigung des Mobilfunkgerätes hindernd im Wege steht.In Nowadays, more and more mobile devices with a built-in camera fitted. This camera is about Pressure contacts or over a flexible connecting cable and connector with the circuit board of the mobile device connected. This is a complex, expensive connection, which about it In addition, an automatic production of the mobile device hindering gets in the way.

Aufgabe der vorliegenden Erfindung ist es ein Mobilfunkgerät der eingangs genannten Art anzugeben, bei welcher die Verbindung zwischen Kamera und Leiterplatte des Mobilfunkgerätes auf eine einfache Art und Weise hergestellt werden kann.task According to the present invention, it is a mobile radio device of the beginning specified type, in which the connection between the camera and Circuit board of the mobile device can be made in a simple way.

Diese Aufgabe wird erfindungsgemäß für das eingangs genannte Mobilfunkgerät dadurch gelöst, dass die Kamera direkt auf die Leiterplatte des Mobilfunkgerätes gelötet ist, und dass im zusammengebauten Zustand des Mobilfunkgerätes vor der Kamera im Mobilfunkgerätegehäuse eine Öffnung vorgesehen ist.These Object is according to the invention for the beginning called mobile device solved by that the camera is soldered directly to the PCB of the mobile device, and that in the assembled state of the mobile device before the camera in the mobile device housing provided an opening is.

Damit kann eine einfache elektrische Verbindung ohne aufwendige flexible Verbindungsleitungen mit Steckverbindern zwischen der Kamera und der Leiterplatte hergestellt werden.In order to can be a simple electrical connection without consuming flexible Connecting cables with connectors between the camera and the printed circuit board are made.

Zweckmäßige Weiterbildungen des vorliegenden erfindungsgemäßen Mobilfunkgerätes ergeben sich aus den Unteransprüchen.Appropriate further education of the present mobile device according to the invention from the dependent claims.

Besonders vorteilhaft ist es, wenn die Leiterplatte mit den darauf anzuordnenden Bauelementen einschließlich der Kamera automatisch bestückt wird. Dies kann z. B. mittels eines SMD-Prozesses erfol gen. Anschließend kann die bestückte Leiterplatte einem Reflow-Lötprozess unterzogen werden.Especially It is advantageous if the circuit board with the order to be arranged thereon Including components the camera automatically populated becomes. This can be z. B. conditions by means of an SMD process conditions. Then can the stocked Printed circuit board a reflow soldering process be subjected.

Bei dem erfindungsgemäßen Mobilfunkgerät ist daher die Montage der Kamera sehr einfach und kostengünstig. Es versteht sich von selbst, dass ein derartiges Verfahren zur Montage einer Kamera nicht nur auf Mobilfunkgeräte beschränkt ist. So ist es z. B. denkbar, dass ein derartiges Verfahren beispielsweise auch bei PDAs angewendet werden kann.at The mobile device according to the invention is therefore mounting the camera is very easy and inexpensive. It goes without saying even that such a method of mounting a camera not only on mobile devices limited is. So it is z. B. conceivable that such a method, for example can also be applied to PDAs.

Claims (3)

Mobilfunkgerät mit einer im Mobilfunkgerätegehäuse angeordneten Leiterplatte, auf welcher elektronische Bauelemente des Mobilfunkgerätes angeordnet sind, und mit einer eingebauten Kamera, dadurch gekennzeichnet, dass die Kamera direkt auf die Leiterplatte des Mobilfunkgerätes gelötet ist, und dass im zusammengebauten Zustand des Mobilfunkgerätes vor der Kamera im Mobilfunkgerätegehäuse eine Öffnung vorgesehen ist.Mobile device with a arranged in the mobile device housing circuit board on which electronic components of the mobile device are arranged, and with a built-in camera, characterized in that the camera is soldered directly to the circuit board of the mobile device, and that in the assembled state of the mobile device in front of the camera in the mobile device housing an opening is provided. Verfahren zur Herstellung des Mobilfunkgerät nach Anspruch 1, dadurch gekennzeichnet, dass die Leiterplatte mit den darauf anzuordnenden Bauelementen einschließlich der Kamera automatisch bestückt wird und anschließend einem Reflow-Lötprozess unterzogen wird.A method for producing the mobile device according to claim 1, characterized in that the circuit board with the on it to be arranged components including the camera automatically stocked and then a reflow soldering process is subjected. Verfahren nach Anspruch 2, dadurch gekennzeichnet, dass die Leiterplatte mittels eines SMD-Prozesses bestückt wird.Method according to claim 2, characterized in that that the circuit board is equipped by means of an SMD process.
DE10326286A 2003-06-11 2003-06-11 mobile device Ceased DE10326286A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE10326286A DE10326286A1 (en) 2003-06-11 2003-06-11 mobile device
PCT/EP2004/050448 WO2004110034A1 (en) 2003-06-11 2004-04-05 Mobile radio device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10326286A DE10326286A1 (en) 2003-06-11 2003-06-11 mobile device

Publications (1)

Publication Number Publication Date
DE10326286A1 true DE10326286A1 (en) 2005-01-13

Family

ID=33494954

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10326286A Ceased DE10326286A1 (en) 2003-06-11 2003-06-11 mobile device

Country Status (2)

Country Link
DE (1) DE10326286A1 (en)
WO (1) WO2004110034A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008062261A1 (en) 2008-12-15 2010-06-17 Amphenol-Tuchel-Electronics Gmbh Scalable camera contact block, method of making the camera contact block, and method of installing, in particular, an SMD camera into the housing of a mobile phone

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19917438A1 (en) * 1999-04-17 2000-10-19 Bosch Gmbh Robert Circuit arrangement for e.g. image sensor comprises carrier plate with contacts connected to image sensor via flip-chip mounting
DE19934507A1 (en) * 1999-07-22 2001-02-08 Siemens Ag Mobile videophone
EP1213924A1 (en) * 2000-11-30 2002-06-12 Mitsubishi Denki Kabushiki Kaisha Portable telephone provided with image pickup device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002185827A (en) * 2000-12-15 2002-06-28 Matsushita Electric Ind Co Ltd Camera to be mounted on printed circuit board
JP3932802B2 (en) * 2000-12-15 2007-06-20 松下電器産業株式会社 Board mounting camera, board mounting camera mounting method, and board mounting camera assembly method
DE10112895B4 (en) * 2001-03-15 2011-09-29 Ltn Servotechnik Gmbh Slip ring unit with a printed circuit board
JP4698874B2 (en) * 2001-04-24 2011-06-08 ローム株式会社 Image sensor module and method of manufacturing image sensor module

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19917438A1 (en) * 1999-04-17 2000-10-19 Bosch Gmbh Robert Circuit arrangement for e.g. image sensor comprises carrier plate with contacts connected to image sensor via flip-chip mounting
DE19934507A1 (en) * 1999-07-22 2001-02-08 Siemens Ag Mobile videophone
EP1213924A1 (en) * 2000-11-30 2002-06-12 Mitsubishi Denki Kabushiki Kaisha Portable telephone provided with image pickup device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP 2002314857 A (nur engl. Abstract) *

Also Published As

Publication number Publication date
WO2004110034A1 (en) 2004-12-16

Similar Documents

Publication Publication Date Title
DE102013101823B4 (en) Contact carrier with a lower part
DE102017117004B4 (en) Coaxial connector
DE102004009071B4 (en) Electrical connector
DE112009004576B4 (en) A connector connection structure for electrically connecting a connector terminal to an electrode surface of a panel and light emitting device therewith
DE102008001557A1 (en) Male connector contacting via intermediate PCBs
DE102006055023A1 (en) Pressing contact for electric conductor of e.g. ribbon cable, has pressing area electrically contactable with circuit board track and insertable and fixable in opening, and contacting area fixing and electrically contacting conductor ends
DE10061613A1 (en) Electric pluggable device with holder for an electronic component e.g. for automobiles, has frame with end section having a fixture element extending from end section, and a guide channel is provided in housing for receiving fixture element
DE102008056923A1 (en) Lighting device with two printed circuit boards
DE10141400A1 (en) control unit
DE102007005877B4 (en) Connection system for printed circuit boards
DE102011107768B4 (en) Plug and method for its manufacture
EP2051341A2 (en) Cable device with shielded cable sections
DE202008014542U1 (en) Connectors for circuit boards
EP2710679A1 (en) Assembly of plug connector and circuit board
DE10326286A1 (en) mobile device
WO2016000909A1 (en) Circuit-board connecting element
DE202013104811U1 (en) Electrical contact device, in particular electrical pressure terminal and / or base strip
DE102004037629B4 (en) Connecting element for printed circuit boards
DE102004041169B3 (en) Earthing system for linking an earth connection on an electric circuit carrier (ECC) to an earth conductor (EC) has a connection structure to make an electric connection between the ECC and the EC
DE102011004527A1 (en) Fixing pin for mechanical fastening and electrical attachment of circuit board with respect to metallic carrier, has several projections that are provided at outer circumference of the insertion portion
DE102011120056B4 (en) Plug connection for a circuit board
DE202015008007U1 (en) Printed circuit board assembly
DE102006009582A1 (en) Electronic device of a vehicle, in particular an antenna amplifier or a TV tuner, with a receiving space for a connector
DE102018010157A1 (en) Electronic device, assembly with the device, method of assembling the device and method of assembling the assembly
DE102012221603A1 (en) Actuator arrangement for window lifter drive in motor car, has electronic component, connector and contact element that are formed by surface mount device technique, and are arranged on circuit board

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8131 Rejection