DE10260613B8 - Verfahren zum Herstellen eines Feldeffekttransistors - Google Patents
Verfahren zum Herstellen eines Feldeffekttransistors Download PDFInfo
- Publication number
- DE10260613B8 DE10260613B8 DE10260613A DE10260613A DE10260613B8 DE 10260613 B8 DE10260613 B8 DE 10260613B8 DE 10260613 A DE10260613 A DE 10260613A DE 10260613 A DE10260613 A DE 10260613A DE 10260613 B8 DE10260613 B8 DE 10260613B8
- Authority
- DE
- Germany
- Prior art keywords
- producing
- field effect
- effect transistor
- transistor
- field
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000005669 field effect Effects 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02634—Homoepitaxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26586—Bombardment with radiation with high-energy radiation producing ion implantation characterised by the angle between the ion beam and the crystal planes or the main crystal surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66575—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate
- H01L29/6659—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate with both lightly doped source and drain extensions and source and drain self-aligned to the sides of the gate, e.g. lightly doped drain [LDD] MOSFET, double diffused drain [DDD] MOSFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
- H01L21/26513—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors of electrically active species
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- High Energy & Nuclear Physics (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Ceramic Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10260613A DE10260613B8 (de) | 2002-12-23 | 2002-12-23 | Verfahren zum Herstellen eines Feldeffekttransistors |
US10/462,893 US6806153B2 (en) | 2002-12-23 | 2003-06-17 | Method of manufacturing a field effect transistor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10260613A DE10260613B8 (de) | 2002-12-23 | 2002-12-23 | Verfahren zum Herstellen eines Feldeffekttransistors |
Publications (3)
Publication Number | Publication Date |
---|---|
DE10260613A1 DE10260613A1 (de) | 2004-07-15 |
DE10260613B4 DE10260613B4 (de) | 2009-11-26 |
DE10260613B8 true DE10260613B8 (de) | 2010-03-04 |
Family
ID=32519310
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE10260613A Expired - Lifetime DE10260613B8 (de) | 2002-12-23 | 2002-12-23 | Verfahren zum Herstellen eines Feldeffekttransistors |
Country Status (2)
Country | Link |
---|---|
US (1) | US6806153B2 (de) |
DE (1) | DE10260613B8 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2847383B1 (fr) * | 2002-11-14 | 2005-04-15 | St Microelectronics Sa | Procede de fabrication d'un transistor mos de longueur de grille reduite, et circuit integre comportant un tel transistor |
JP2005033098A (ja) * | 2003-03-05 | 2005-02-03 | Nec Electronics Corp | 半導体装置及びその製造方法 |
US6893909B2 (en) * | 2003-10-07 | 2005-05-17 | United Microelectronics Corp. | Method of manufacturing metal-oxide-semiconductor transistor |
DE60330965D1 (de) * | 2003-10-17 | 2010-03-04 | Imec | Verfahren zur Herstellung eines Halbleitersubstrats mit einer Schichtstruktur von aktivierten Dotierungsstoffen |
DE102005043913B4 (de) * | 2004-09-22 | 2011-06-30 | Infineon Technologies AG, 81669 | Verfahren zur Herstellung einer dotierten Zone in einem Halbleiterkörper |
DE102005057074B4 (de) * | 2005-11-30 | 2009-07-23 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren zum Reduzieren von Kristalldefekten in verformten Transistoren durch eine geneigte Voramorphisierung |
DE102006009272B4 (de) | 2006-02-28 | 2013-01-03 | Globalfoundries Inc. | Verfahren zur Herstellung eines verspannten Transistors durch eine späte Amorphisierung und durch zu entfernende Abstandshalter |
DE102007020261B4 (de) * | 2007-04-30 | 2009-07-16 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren zur Erhöhung der Dotierstoffaktivierung unter Anwendung mehrerer sequenzieller fortschrittlicher Laser/Blitzlicht-Ausheizprozesse |
DE102007025326B4 (de) * | 2007-05-31 | 2011-01-20 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren zum Ausbilden einer Halbleiterstruktur, das eine Implantation von Ionen in eine zu ätzende Materialschicht umfasst |
CN102403256B (zh) * | 2010-09-08 | 2014-02-26 | 上海华虹宏力半导体制造有限公司 | 赝埋层及制造方法、深孔接触及三极管 |
DE102016104327B4 (de) * | 2016-03-09 | 2023-12-28 | Infineon Technologies Austria Ag | Verfahren zum Herstellen einer Halbleitervorrichtung |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0201585B1 (de) * | 1984-11-26 | 1990-01-10 | Hughes Aircraft Company | Halbleiter mit flachen, hyperabrupt dotierten gebieten und verfahren zu ihrer herstellung unter verwendung ionenimplantierter störstoffe |
JPH03157941A (ja) * | 1989-11-16 | 1991-07-05 | Sony Corp | Mis型半導体装置の製法 |
DE4035842A1 (de) * | 1990-11-10 | 1992-05-14 | Telefunken Electronic Gmbh | Verfahren zur rekristallisierung voramorphisierter halbleiteroberflaechenzonen |
US5885886A (en) * | 1996-12-26 | 1999-03-23 | Lg Semicon Co., Ltd. | Method for manufacturing semiconductor device |
WO2001080300A1 (en) * | 2000-04-12 | 2001-10-25 | Ultratech Stepper, Inc. | High-speed semiconductor transistor and selective absorption process for forming same |
US6362063B1 (en) * | 1999-01-06 | 2002-03-26 | Advanced Micro Devices, Inc. | Formation of low thermal budget shallow abrupt junctions for semiconductor devices |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4177084A (en) * | 1978-06-09 | 1979-12-04 | Hewlett-Packard Company | Method for producing a low defect layer of silicon-on-sapphire wafer |
EP0812009A3 (de) * | 1996-06-03 | 1998-01-07 | Texas Instruments Incorporated | Verbesserungen in der oder in Bezug auf die Halbleiterherstellung |
-
2002
- 2002-12-23 DE DE10260613A patent/DE10260613B8/de not_active Expired - Lifetime
-
2003
- 2003-06-17 US US10/462,893 patent/US6806153B2/en not_active Expired - Lifetime
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0201585B1 (de) * | 1984-11-26 | 1990-01-10 | Hughes Aircraft Company | Halbleiter mit flachen, hyperabrupt dotierten gebieten und verfahren zu ihrer herstellung unter verwendung ionenimplantierter störstoffe |
JPH03157941A (ja) * | 1989-11-16 | 1991-07-05 | Sony Corp | Mis型半導体装置の製法 |
DE4035842A1 (de) * | 1990-11-10 | 1992-05-14 | Telefunken Electronic Gmbh | Verfahren zur rekristallisierung voramorphisierter halbleiteroberflaechenzonen |
US5885886A (en) * | 1996-12-26 | 1999-03-23 | Lg Semicon Co., Ltd. | Method for manufacturing semiconductor device |
US6362063B1 (en) * | 1999-01-06 | 2002-03-26 | Advanced Micro Devices, Inc. | Formation of low thermal budget shallow abrupt junctions for semiconductor devices |
WO2001080300A1 (en) * | 2000-04-12 | 2001-10-25 | Ultratech Stepper, Inc. | High-speed semiconductor transistor and selective absorption process for forming same |
Also Published As
Publication number | Publication date |
---|---|
US6806153B2 (en) | 2004-10-19 |
US20040121565A1 (en) | 2004-06-24 |
DE10260613A1 (de) | 2004-07-15 |
DE10260613B4 (de) | 2009-11-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
8396 | Reprint of erroneous front page | ||
8364 | No opposition during term of opposition | ||
R071 | Expiry of right |