DE102020127606A1 - Electronic power switching device with a heat-conducting device and method for its manufacture - Google Patents
Electronic power switching device with a heat-conducting device and method for its manufacture Download PDFInfo
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- DE102020127606A1 DE102020127606A1 DE102020127606.0A DE102020127606A DE102020127606A1 DE 102020127606 A1 DE102020127606 A1 DE 102020127606A1 DE 102020127606 A DE102020127606 A DE 102020127606A DE 102020127606 A1 DE102020127606 A1 DE 102020127606A1
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- Germany
- Prior art keywords
- power semiconductor
- semiconductor component
- switching device
- substrate
- heat
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 10
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 239000004065 semiconductor Substances 0.000 claims abstract description 52
- 239000004020 conductor Substances 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 230000002093 peripheral effect Effects 0.000 claims abstract description 5
- 239000011810 insulating material Substances 0.000 claims description 27
- 239000011888 foil Substances 0.000 claims description 12
- 238000009413 insulation Methods 0.000 claims description 10
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 8
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 6
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 6
- 229910052582 BN Inorganic materials 0.000 claims description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 4
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 239000010432 diamond Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 239000011787 zinc oxide Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 239000002131 composite material Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- BUHVIAUBTBOHAG-FOYDDCNASA-N (2r,3r,4s,5r)-2-[6-[[2-(3,5-dimethoxyphenyl)-2-(2-methylphenyl)ethyl]amino]purin-9-yl]-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound COC1=CC(OC)=CC(C(CNC=2C=3N=CN(C=3N=CN=2)[C@H]2[C@@H]([C@H](O)[C@@H](CO)O2)O)C=2C(=CC=CC=2)C)=C1 BUHVIAUBTBOHAG-FOYDDCNASA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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Abstract
Vorgestellt wird ein Verfahren zur Herstellung und eine leistungselektronische Schalteinrichtung mit einem eine Normalenrichtung aufweisenden Substrat mit einer ersten und einer zweiten Leiterbahn, wobei auf der ersten Leiterbahn ein Leistungshalbleiterbauelement mittels einer elektrisch leitfähigen Verbindung angeordnet ist, wobei das Leistungshalbleiterbauelement einen seitlich umlaufenden Rand und auf seiner ersten, dem Substrat abgewandten Hauptseite einen Randbereich und einen Kontaktbereich aufweist, mit einer Verbindungseinrichtung, die mit einer Kontaktfläche des Kontaktbereichs elektrisch leitend verbunden ist, und mit einer Wärmeleiteinrichtung, die eine elektrisch isolierende, thermisch hoch leitfähige Verbindung zwischen der Verbindungseinrichtung und dem Substrat ausbildet.Presented is a method for manufacturing and a power electronic switching device with a substrate having a normal direction with a first and a second conductor track, a power semiconductor component being arranged on the first conductor track by means of an electrically conductive connection, the power semiconductor component having a lateral peripheral edge and on its first , the main side facing away from the substrate has an edge area and a contact area, with a connecting device which is electrically conductively connected to a contact surface of the contact area, and with a heat conducting device which forms an electrically insulating, thermally highly conductive connection between the connecting device and the substrate.
Description
Die Erfindung beschreibt eine leistungselektronische Schalteinrichtung mit einem Substrat mit einer ersten und einer zweiten Leiterbahn, wobei auf der ersten Leiterbahn ein Leistungshalbleiterbauelement mittels einer elektrisch leitfähigen Verbindung angeordnet ist, wobei das Leistungshalbleiterbauelement einen seitlich umlaufenden Rand und auf seiner ersten, dem Substrat abgewandten Hauptseite einen Randbereich und einen Kontaktbereich aufweist, mit einer Verbindungseinrichtung, die mit einer Kontaktfläche des Kontaktbereichs elektrisch leitend verbunden ist, und mit einer Wärmeleiteinrichtung. Die Erfindung beschreibt ebenso ein Verfahren zur Herstellung einer derartigen Schalteinrichtung.The invention describes a power electronic switching device with a substrate with a first and a second conductor track, with a power semiconductor component being arranged on the first conductor track by means of an electrically conductive connection, the power semiconductor component having a lateral peripheral edge and an edge area on its first main side facing away from the substrate and has a contact area, with a connecting device which is electrically conductively connected to a contact surface of the contact area, and with a heat conducting device. The invention also describes a method for producing such a switching device.
Eine regelmäßige Anforderung an leistungselektronische Schalteinrichtungen und Leistungshalbleitermodule, die hiermit ausgebildet werden, ist, dass alle Komponenten, die sich im Betrieb erwärmen oder erwärmt werden, ausreichend, also insbesondere ohne negativen Einfluss auf die Lebensdauer und die Leistungsfähigkeit, gekühlt werden.A regular requirement for power electronic switching devices and power semiconductor modules that are formed with them is that all components that heat up or are heated up during operation are adequately cooled, ie in particular without negatively affecting the service life and performance.
Die
Der Erfindung liegt die Aufgabe zugrunde, die Kühlung der internen Verbindungseinrichtung einer leistungselektronischen Schalteinrichtung, insbesondere in der unmittelbaren Nähe eines Leistungshalbleiterbauelements, zu verbessern und ein Verfahren zur Herstellung einer derartigen leistungselektronischen Schalteinrichtung anzugeben.The object of the invention is to improve the cooling of the internal connection device of a power electronic switching device, in particular in the immediate vicinity of a power semiconductor component, and to specify a method for producing such a power electronic switching device.
Diese Aufgabe wird erfindungsgemäß gelöst durch eine leistungselektronische Schalteinrichtung mit einem eine Normalenrichtung aufweisenden Substrat mit einer ersten und einer zweiten Leiterbahn, wobei auf der ersten Leiterbahn ein Leistungshalbleiterbauelement mittels einer elektrisch leitfähigen Verbindung angeordnet ist, wobei das Leistungshalbleiterbauelement einen seitlich umlaufenden Rand und auf seiner ersten, dem Substrat abgewandten Hauptseite einen Randbereich und einen Kontaktbereich aufweist, mit einer Verbindungseinrichtung, die mit einer Kontaktfläche des Kontaktbereichs elektrisch leitend verbunden ist, und mit einer Wärmeleiteinrichtung, die eine elektrisch isolierende, thermisch hoch leitfähige Verbindung zwischen der Verbindungseinrichtung und dem Substrat ausbildet.This object is achieved according to the invention by a power electronic switching device with a substrate having a normal direction with a first and a second conductor track, a power semiconductor component being arranged on the first conductor track by means of an electrically conductive connection, the power semiconductor component having a laterally peripheral edge and on its first, has an edge region and a contact region on the main side facing away from the substrate, with a connecting device which is electrically conductively connected to a contact surface of the contact region, and with a heat conducting device which forms an electrically insulating, thermally highly conductive connection between the connecting device and the substrate.
Es kann vorteilhaft sein, wenn die Wärmeleiteinrichtung einen thermisch leitenden Kontakt mit der zweiten Leiterbahn, und vorzugsweise auch mit der ersten Leiterbahn, aufweist.It can be advantageous if the heat-conducting device has a thermally conductive contact with the second conductor track, and preferably also with the first conductor track.
Es kann bevorzugt sein, wenn aus Normalenrichtung betrachtet die Wärmeleiteinrichtung seitlich beabstandet vom Leistungshalbleiterbauelement angeordnet ist.It can be preferred if, viewed from the normal direction, the heat-conducting device is arranged at a lateral distance from the power semiconductor component.
Grundsätzlich kann es bevorzugt sein, wenn die Verbindungseinrichtung ausgebildet ist als ein Bonddraht, als ein starrer Metallformkörper oder als eine elektrisch leitfähige, vorzugsweise metallische, Folie, ihrerseits vorzugsweise als Teil eines Folienstapels, alternierend ausgebildet aus elektrisch leitfähigen und mindestens einer elektrisch isolierenden Folie. Unter dem Begriff Bonddraht soll auch ein Bondbändchen, insbesondere eines gemäß dem Stand der Technik, verstanden werden.In principle, it can be preferred if the connecting device is designed as a bonding wire, as a rigid metal molded body or as an electrically conductive, preferably metallic, film, in turn preferably as part of a film stack, formed alternately from electrically conductive and at least one electrically insulating film. The term bonding wire should also be understood to mean a bonding ribbon, in particular one according to the prior art.
Ebenso kann es bevorzugt sein, wenn ein erster Isolationsstoff am Rand und teilweise auch an einem anschließenden Abschnitt des Randbereichs des Leistungshalbleiterbauelements angeordnet ist.Likewise, it can be preferred if a first insulating material is arranged on the edge and partially also on an adjoining section of the edge region of the power semiconductor component.
Besonders vorteilhaft ist es, wenn die Wärmeleiteinrichtung ausgebildet ist als ein starrer Isolationsformkörper mit einer ersten und dieser gegenüberliegenden zweiten Kontaktfläche oder als ein zweiter, elastischer, vorzugsweise gelartiger, während seiner Anordnung zähflüssiger, Isolationsstoff.It is particularly advantageous if the heat-conducting device is designed as a rigid insulating molded body with a first and opposite second contact surface or as a second, elastic, preferably gel-like insulating material that is viscous during its arrangement.
Hierbei kann der starre Isolationsformkörper eine Dicke aufweisen, die von der des benachbarten Leistungshalbleiterbauelements um nicht mehr als 25%, vorzugsweise nicht mehr als 10% abweicht oder er weist eine Dicke auf, die vom Dreifachen der Dicke des benachbarten Leistungshalbleiterbauelements um nicht mehr als 25%, vorzugsweise nicht mehr als 10% abweicht.In this case, the rigid insulating molded body can have a thickness that deviates from that of the adjacent power semiconductor component by no more than 25%, preferably no more than 10%, or it has a thickness that is three times the thickness of the adjacent power semiconductor component by no more than 25%. , preferably no more than 10%.
Der starre Isolationsformkörper weist vorzugsweise eine Wärmeleitfähigkeit von mehr als 100 W/m·K, vorzugsweise von mehr als 140 W/m·K, auf und ist vorzugsweise aus Silizium oder Aluminiumnitrid oder Siliziumkarbid oder Bornitrid oder aus Zinkoxid oder Diamant ausgebildet, oder enthält diese Stoffe zu mehr als 30%, insbesondere mehr als 50%.The rigid molded insulation body preferably has a thermal conductivity of more than 100 W/m·K, preferably more than 140 W/m·K, and is preferably made of silicon or aluminum nitride or silicon carbide or boron nitride or formed from zinc oxide or diamond, or contains these substances to more than 30%, especially more than 50%.
Der starre Isolationsformkörper ist weiterhin bevorzugt quaderförmig ausgebildet, wobei vorzugsweise seine größte Längsseite nicht länger ist als das 1 ,5-fache einer größten Längsseite des benachbarten Leistungshalbleiterbauelements.The rigid molded insulating body is also preferably cuboid, with its longest side preferably being no longer than 1.5 times the longest side of the adjacent power semiconductor component.
Der zweite Isolationsstoff weist vorzugsweise eine Wärmeleitfähigkeit von mehr als 2,5 W/m·K, vorzugsweise von mehr als 5 W/m·K, auf und ist vorzugsweise aus einem Silikongel mit partikelförmigen Beimengungen aus Aluminiumnitrid oder Siliziumkarbid oder Bornitrid oder Zinkoxid oder Diamant ausgebildet.The second insulating material preferably has a thermal conductivity of more than 2.5 W/m·K, preferably more than 5 W/m·K, and is preferably made of a silicone gel with particulate admixtures of aluminum nitride or silicon carbide or boron nitride or zinc oxide or diamond educated.
Der zweite Isolationsstoff 40 kann an den ersten Isolationsstoff 80 angrenzend oder von diesem beabstandet angeordnet sein.The second insulating material 40 can be arranged adjacent to the first
Durch die beschriebene Ausgestaltung und ihrer Varianten wird die Kühlung der internen Verbindungseinrichtung der leistungselektronischen Schalteinrichtung, insbesondere in der unmittelbaren Nähe eines Leistungshalbleiterbauelements erheblich verbessert und damit entweder die Stromtragfähigkeit gesteigert oder die Belastung reduziert und somit die Lebensdauer der leistungselektronischen Schalteinrichtung gesteigert.The configuration described and its variants considerably improve the cooling of the internal connection device of the electronic power switching device, particularly in the immediate vicinity of a power semiconductor component, and thus either increase the current-carrying capacity or reduce the load and thus increase the service life of the electronic power switching device.
Die Aufgabe wird weiterhin gelöst durch ein Verfahren zur Herstellung einer leistungselektronischen Schalteinrichtung nach einem der vorhergehenden Ansprüche mit den Verfahrensschritten, in der Reihenfolge a-b-c-d-e oder a-b-d-c-e:
- a) Bereitstellen des Substrats;
- b) Anordnen des Leistungshalbleiterbauelements und der Wärmeleiteinrichtung, ausgebildet als ein starrer Isolationsformkörper;
- c) Ausbilden einer stoffschlüssigen Verbindung des Leistungshalbleiterbauelements mit einer zugeordneten Leiterbahn des Substrats und der Wärmeleiteinrichtung mit einer zugeordneten Leiterbahn des Substrats;
- d) Anordnen der Verbindungseinrichtung;
- e) Ausbilden jeweils einer kraft- oder stoffschlüssigen Verbindung des Leistungshalbleiterbauelements und der Wärmeleiteinrichtung jeweils mit der Verbindungseinrichtung.
- a) providing the substrate;
- b) arranging the power semiconductor component and the heat conducting device, designed as a rigid insulation molding;
- c) Forming an integral connection of the power semiconductor component with an assigned conductor track of the substrate and of the heat-conducting device with an assigned conductor track of the substrate;
- d) arranging the connecting device;
- e) formation of a non-positive or material connection between the power semiconductor component and the heat-conducting device, each with the connecting device.
Es kann vorteilhaft sein, wenn vor dem Verfahrensschritt d) folgender Verfahrensschritt ausgeführt wird: Anordnen eines ersten gelartigen Isolationsstoffs auf dem Randbereich des Leistungshalbleiterbauelements.It can be advantageous if the following method step is carried out before method step d): Arranging a first gel-like insulating material on the edge region of the power semiconductor component.
Selbstverständlich können, sofern dies nicht per se oder explizit ausgeschlossen ist, die im Singular genannten Merkmale, insbesondere die Wärmeleiteinrichtung oder das Leistungshalbleiterbauelement, auch mehrfach in der erfindungsgemäßen leistungselektronischen Schalteinrichtung vorhanden sein.Of course, unless this is excluded per se or explicitly, the features mentioned in the singular, in particular the heat conducting device or the power semiconductor component, can also be present multiple times in the power electronic switching device according to the invention.
Es versteht sich, dass die verschiedenen Ausgestaltungen der Erfindung, gleichgültig ob sie im Rahmen der Beschreibung der leistungselektronischen Schalteinrichtung oder des Verfahrens zu ihrer Herstellung offenbart sind, einzeln oder in beliebigen Kombinationen realisiert sein können, um Verbesserungen zu erreichen. Insbesondere sind die vorstehend und im Folgenden genannten und erläuterten Merkmale nicht nur in den angegebenen Kombinationen, sondern auch in anderen Kombinationen oder in Alleinstellung einsetzbar, ohne den Rahmen der vorliegenden Erfindung zu verlassen.It goes without saying that the various configurations of the invention, regardless of whether they are disclosed in the context of the description of the electronic power switching device or the method for its production, can be implemented individually or in any combination in order to achieve improvements. In particular, the features mentioned and explained above and below can be used not only in the specified combinations, but also in other combinations or on their own, without departing from the scope of the present invention.
Weitere Erläuterungen der Erfindung, vorteilhafte Einzelheiten und Merkmale, ergeben sich aus der nachfolgenden Beschreibung der in den
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1 zeigt eine seitliche Ansicht einer leistungselektronischen Schalteinrichtung nach dem Stand der Technik. -
2 bis7 zeigen in seitlicher Ansicht jeweils eine erfindungsgemäße Ausgestaltung einer leistungselektronischen Schalteinrichtung. -
8 zeigt zur weiteren Erläuterung eine Draufsicht auf ein beispielhaftes Leistungshalbleiterbauelement. -
9 zeigt in Draufsicht eine Anordnung analog6 .
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1 shows a side view of a power electronic switching device according to the prior art. -
2 until7 each show a side view of an embodiment of a power electronic switching device according to the invention. -
8th FIG. 12 shows a plan view of an exemplary power semiconductor component for further explanation. -
9 shows a top view of an arrangement analogous6 .
Das Leistungshalbleiterbauelement 5, genauer eine seiner dem Substrat 2 in dessen Normalenrichtung N abgewandten Kontaktflächen, ist mit einer zweiten Leiterbahn 24 des Substrats 2 mittels einer Verbindungseinrichtung 3 verbunden. Diese Verbindungseinrichtung 3 ist ausgebildet als ein Folienverbund 32 aus einer, dem Substrat 2 zugewandten, ersten elektrisch leitfähigen Folie 320, einer im Folienverbund folgenden elektrisch isolierenden Folie 322 und einer im Folienverbund weiter folgenden zweiten elektrisch leitfähigen Folie 324.The
Die leistungselektronische Schalteinrichtung 1 weist weiterhin Anschlusselemente 6, hier dargestellt als ein Hilfsanschlusselement zur Führung von Hilfspotentialen, wie beispielhaft Sensor- oder Ansteuersignalen, aber auch nicht dargestellte Lastanschlusselemente auf. Dieses dargestellte Anschlusselement 6 ist ausgebildet als ein fachübliches Press-Pin-Kontaktelement. Der Fuß dieses Anschlusselements 8 ist in einer Hülse angeordnet, die eine stoffschlüssige Verbindung zu einem Kontaktabschnitt auf der dem Substrat 2 abgewandten Oberfläche der ersten elektrisch leitfähigen Folie 320 aufweist. Fachüblich können die Anschlusselemente auch direkt auf einer der Leiterbahnen angeordnet sein. Das Anschlusselement reicht hier durch ein Gehäuse 7 eines Leistungshalbleitermoduls nach außen und bildet die externe Verbindung der leistungselektronischen Schalteinrichtung 1 im Inneren des Leistungshalbleitermoduls.The electronic power switching device 1 also has
Die erste elektrisch leitfähige Folie 320 ist mit der zweiten Leiterbahn 24 des Substrats 2 mittels einer stoffschlüssigen und elektrisch leitfähigen Verbindung 900, hier ausgebildet als fachübliche Drucksinterverbindung, verbunden.The first electrically
Erfindungsgemäß ist eine Wärmeleiteinrichtung 4, die hier als ein zweiter Isolationsstoff 40 ausgebildet ist, zwischen der Verbindungseinrichtung 3 und dem Substrat 2 angeordnet. Selbstverständlich steht dieser zweite Isolationsstoff 40 hier in thermisch leitendem Kontakt mit beiden. Dieser zweite Isolationsstoff 40 weist eine Wärmeleitfähigkeit von ca. 10 W/m-K auf und ist ausgebildet aus einem Silikongel mit partikelförmigen Beimengungen, hier, ohne Beschränkung der Allgemeinheit, Beimengungen aus Siliziumkarbid.According to the invention, a heat-conducting device 4 , which is designed here as a second insulating material 40 , is arranged between the connecting device 3 and the
Der zweite Isolationsstoff 40 wird bei der Herstellung nach dem ersten Isolationsstoff 80 angeordnet und überlappt dessen Oberfläche teilweise. Beide Isolationsstoffe 40,80 sind bei ihrer Anordnung zähflüssig und vernetzen nach ihrer Anordnung thermisch oder vorzugsweise optisch mittels UV-Licht zu ihrem gelartigen Endzustand.During manufacture, the second insulating material 40 is arranged after the first insulating
Der starre Isolationsformkörper 42 ist mittels seiner ersten und dieser gegenüberliegenden zweiten Kontaktfläche sowohl mit der Verbindungseinrichtung 3 wie auch mit der ersten Leiterbahn 22 stoffschlüssig und thermisch leitend verbunden. Die jeweilige Verbindung 900 ist hier als Lotverbindung ausgebildet. Bei dieser Ausgestaltung besteht, im Gegensatz zur Ausgestaltung gemäß
Der starre Isolationsformkörper 42 dieses Ausführungsbeispiels weist eine Dicke auf, die dem dreifachen der Dicke des benachbarten Leistungshalbleiterbauelements 5 entspricht. Somit wird ein hervorragender Kompromiss aus dem Abstand der Verbindungseinrichtung 3 von der ersten Leiterbahn 22 und dem Wirkungsgrad der Wärmeableitung aus dieser Verbindungseinrichtung 3 erreicht.The rigid insulation molding 42 of this exemplary embodiment has a thickness which corresponds to three times the thickness of the adjacent
Die Wärmeleiteinrichtung 4 ist wiederum ausgebildet als ein zweiter, elastischer, während seiner Anordnung zähflüssiger Isolationsstoff 40, der hier eine thermisch hoch leitfähige, aber elektrisch isolierende Verbindung zwischen der Verbindungseinrichtung 3, hier deren erster elektrisch leitfähigen Folie 320, und der ersten und zweiten Leiterbahn 22,24 und damit dem Substrat 2 ausbildet.The heat conducting device 4 is in turn designed as a second, elastic insulating material 40, which is viscous during its installation and which here forms a highly thermally conductive but electrically insulating connection between the connecting device 3, here its first electrically
Auch hier weist der starre Isolationsformkörper 42 eine Dicke auf, die ca. dem dreifachen der Dicke des benachbarten Leistungshalbleiterbauelements 5 entspricht.Here, too, the rigid molded insulation body 42 has a thickness which corresponds to approximately three times the thickness of the adjacent
Die Wärmeleiteinrichtung 4 ist wiederum als ein starrer Isolationsformkörper 42 mit einer ersten und dieser gegenüberliegenden zweiten Kontaktfläche ausgebildet und weist hier eine Dicke auf, die derjenigen des benachbarten Leistungshalbleiterbauelements 5 entspricht. Der starre Isolationsformkörper 42 ist hier ausschließlich mit der zweiten Leiterbahn 24 des Substrats 2 und mit der Verbindungseinrichtung 3 thermisch leitend verbunden. Die jeweilige Verbindung 900 ist wiederum als Drucksinterverbindung ausgebildet. Alternativ kann zumindest eine der beiden Verbindungen auch als kraftschlüssige Verbindung ausgebildet sein. Hierbei würde ein gestrichelt dargestellter Druckkörper 70 aus der Normalenrichtung N auf die Verbindungseinrichtung 3 drücken und somit die kraftschlüssige Verbindung ausbilden.The heat conducting device 4 is in turn embodied as a rigid insulating molded body 42 with a first contact surface and a second contact surface opposite thereto and has a thickness here that corresponds to that of the adjacent
Zudem überlappt hier der zweite Isolationsstoff 40 nicht nur den ersten Isolationsstoff 80, sondern in Projektion betrachtet auch das Leistungshalbleiterbauelement 5 und ist somit, wiederum in Projektion, also aus Normalenrichtung N betrachtet, nicht wie in den bisher dargestellten Ausführungsbeispielen von diesem lateral, also seitlich beabstandet.In addition, here the second insulating material 40 not only overlaps the first insulating
Im Randbereich 52 und umgeben um den Kontaktbereich 54 des Leistungshalbleiterbauelements 5 ist dessen Randstruktur dargestellt. Der Randbereich 52 und damit auch diese Randstruktur wird bevorzugt zumindest teilweise von dem ersten Isolationsstoff 80, vgl.
ZITATE ENTHALTEN IN DER BESCHREIBUNGQUOTES INCLUDED IN DESCRIPTION
Diese Liste der vom Anmelder aufgeführten Dokumente wurde automatisiert erzeugt und ist ausschließlich zur besseren Information des Lesers aufgenommen. Die Liste ist nicht Bestandteil der deutschen Patent- bzw. Gebrauchsmusteranmeldung. Das DPMA übernimmt keinerlei Haftung für etwaige Fehler oder Auslassungen.This list of the documents cited by the applicant was generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.
Zitierte PatentliteraturPatent Literature Cited
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DE102020127606.0A DE102020127606B4 (en) | 2020-10-20 | 2020-10-20 | Power electronic switching device with a heat-conducting device and method for its production |
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DE102022213482A1 (en) | 2022-12-12 | 2024-06-13 | Robert Bosch Gesellschaft mit beschränkter Haftung | Power module with sealed connections |
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JP2005276968A (en) | 2004-03-24 | 2005-10-06 | Mitsubishi Electric Corp | Power semiconductor device |
US20080042142A1 (en) | 2005-01-27 | 2008-02-21 | The Kansai Electric Power Co., Inc. | Highly Heat-Resistant Synthetic Polymer Compound and High Withstand Voltage Semiconductor Device |
DE102015116165A1 (en) | 2015-09-24 | 2017-03-30 | Semikron Elektronik Gmbh & Co. Kg | Method for producing a power electronic switching device and power electronic switching device |
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2020
- 2020-10-20 DE DE102020127606.0A patent/DE102020127606B4/en active Active
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JP2005276968A (en) | 2004-03-24 | 2005-10-06 | Mitsubishi Electric Corp | Power semiconductor device |
US20080042142A1 (en) | 2005-01-27 | 2008-02-21 | The Kansai Electric Power Co., Inc. | Highly Heat-Resistant Synthetic Polymer Compound and High Withstand Voltage Semiconductor Device |
DE102015116165A1 (en) | 2015-09-24 | 2017-03-30 | Semikron Elektronik Gmbh & Co. Kg | Method for producing a power electronic switching device and power electronic switching device |
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DE102022213482A1 (en) | 2022-12-12 | 2024-06-13 | Robert Bosch Gesellschaft mit beschränkter Haftung | Power module with sealed connections |
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