DE102016103530A1 - Substrate holding device with projecting from an annular groove supporting projections - Google Patents
Substrate holding device with projecting from an annular groove supporting projections Download PDFInfo
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- DE102016103530A1 DE102016103530A1 DE102016103530.0A DE102016103530A DE102016103530A1 DE 102016103530 A1 DE102016103530 A1 DE 102016103530A1 DE 102016103530 A DE102016103530 A DE 102016103530A DE 102016103530 A1 DE102016103530 A1 DE 102016103530A1
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- groove
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4581—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber characterised by material of construction or surface finish of the means for supporting the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Die Erfindung betrifft eine Vorrichtung zur Halterung mindestens eines Substrates (20) in einer Prozesskammer eines CVD- oder PVD-Reaktors, in dessen flacher Oberseite sich zumindest eine von zumindest einer Positionierflanke (3) begrenzte Lagertasche (2) zur Aufnahme des mindestens einen Substrates (20) befindet, wobei die Lagertasche (2) einen Lagertaschenboden (4) aufweist, aus dem in der Nachbarschaft der Positionierflanke (3) ein Tragvorsprung (8) entspringt, der eine von einer Seitenwand (10) umgebene Auflagezone (9) ausbildet, die in einer Auflageebene (E) liegt, welche von einem Boden (6) einer den Tragvorsprung (8) umgebenen Nut (5) einen größeren Vertikalabstand aufweist als vom Lagertaschenboden (4). Zur Erhöhung der Temperaturhomogenität auf der Oberseite des Substrates ist vorgesehen, dass sich die Nut (5) in einer Vertiefung (11) erstreckt, deren Vertikalniveau zwischen dem Boden (6) der Nut (5) und dem Lagertaschenboden (4) liegt. Der Tragvorsprung (8) und/oder die den Tragvorsprung (8) umgebende Nut (5) besitzen einen horizontalen Abstand von der Positionierflanke (3).The invention relates to a device for holding at least one substrate (20) in a process chamber of a CVD or PVD reactor, in the flat top of which at least one bearing pocket (2) bounded by at least one positioning flank (3) for receiving the at least one substrate (2). 20), wherein the bearing pocket (2) has a bearing pocket bottom (4), from which in the vicinity of the positioning edge (3) a support projection (8) springs, which forms one of a side wall (10) surrounded support zone (9) in a support plane (E), which of a bottom (6) of the support projection (8) surrounded groove (5) has a greater vertical distance than the bearing pocket bottom (4). To increase the temperature homogeneity on the upper side of the substrate, it is provided that the groove (5) extends in a depression (11) whose vertical level lies between the bottom (6) of the groove (5) and the bearing pocket bottom (4). The supporting projection (8) and / or the groove (5) surrounding the supporting projection (8) have a horizontal distance from the positioning flank (3).
Description
Gebiet der TechnikField of engineering
Die Erfindung betrifft eine Vorrichtung zur Halterung mindestens eines Substrates in einer Prozesskammer eines CVD- oder PVD-Reaktors, in dessen flacher Oberseite sich zumindest eine von zumindest einer Positionierflanke begrenzte Lagertasche zur Aufnahme des mindestens einen Substrates befindet, wobei die Lagertasche einen Lagertaschenboden aufweist, aus dem in der Nachbarschaft seines an die mindestens eine Positionierflanke angrenzenden Randes ein Tragvorsprung entspringt, der eine von einer Seitenwand umgebene Auflagefläche/-zone ausbildet, die in einer Auflageebene liegt, welche von einem Boden einer den Tragvorsprung umgebenen Nut einen größeren Vertikalabstand aufweist als vom Lagertaschenboden.The invention relates to a device for holding at least one substrate in a process chamber of a CVD or PVD reactor, in the flat top is at least one limited by at least one positioning edge bearing pocket for receiving the at least one substrate, wherein the bearing pocket has a bearing pocket bottom, from in the vicinity of its adjacent to the at least one positioning edge edge a support projection springs, which forms a side wall surrounded by a support surface / zone, which lies in a support plane which has a greater vertical distance from a bottom of the support projection groove than the bearing pocket bottom ,
Stand der TechnikState of the art
Die
Aus der
Aus der
Die
Die
Ein gattungsgemäßer Suszeptor wird insbesondere in einem CVD-Reaktor verwendet, wo er den Boden einer Prozesskammer ausbildet. Der Suszeptor wird von unten, bspw. durch Wärmestrahlung, aufgeheizt. Durch Wärmeleitung gelangt die Strahlungswärme zur Oberseite des Suszeptors, auf dem die Substrate in den dort angeordneten Lagertaschen einliegen. Oberhalb der Oberseite des Suszeptors befindet sich die Prozesskammer, deren Decke von einem Gaseinlassorgan ausgebildet wird. Die zum Suszeptor weisende Gasaustrittsfläche des Gaseinlassorgans besitzt eine Temperatur, die von der Oberflächentemperatur des Suszeptors abweicht. Der Temperaturunterschied zwischen Gasaustrittsfläche und Suszeptoroberseite kann mehrere 100°C betragen, so dass es aufgrund des zwischen Suszeptor und Gaseinlassorgan bestehenden Temperaturgradienten zu einem sehr hohen Wärmefluss vom Suszeptor zum Gaseinlassorgan kommt. Zufolge dieses Wärmeflusses bildet sich innerhalb des Suszeptors ein vertikaler Temperaturgradient, aber auch im Bereich der Lagertasche ein vertikaler Temperaturgradient aus. Der Wärmefluss in dem Bereich, in dem das Substrat hohl über dem Boden der Lagertasche liegt und dem Bereich, in dem es auf Tragflächen der Tragvorsprünge aufliegt, ist verschieden. Darüber hinaus gibt es einen vertikalen Wärmezufluss von der Positionierflanke in das Substrat.A generic susceptor is used in particular in a CVD reactor where it forms the bottom of a process chamber. The susceptor is heated from below, for example by thermal radiation. By heat conduction, the radiant heat reaches the top of the susceptor, on which the substrates einliegen in the bearing pockets arranged there. Above the top of the susceptor is the process chamber, the ceiling of which is formed by a gas inlet member. The gas outlet surface of the gas inlet member facing the susceptor has a temperature that deviates from the surface temperature of the susceptor. The temperature difference between the gas outlet surface and the upper side of the susceptor can amount to several 100 ° C., so that a very high heat flow from the susceptor to the gas inlet element occurs due to the temperature gradient existing between the susceptor and gas inlet element. As a result of this heat flow, a vertical temperature gradient is formed within the susceptor, but also a vertical temperature gradient in the region of the bearing pocket. The heat flow in the region in which the substrate is hollow above the bottom of the bearing pocket and the region in which it rests on the bearing surfaces of the supporting projections is different. In addition, there is a vertical heat flow from the positioning edge into the substrate.
Zusammenfassung der ErfindungSummary of the invention
Der Erfindung liegt die Aufgabe zugrunde, Maßnahmen anzugeben, um den horizontalen Temperaturgradienten auf der Oberfläche eines zu beschichtenden Substrates zu minimieren, mithin das laterale Temperaturprofil zu homogenisieren.The invention has for its object to provide measures to minimize the horizontal temperature gradient on the surface of a substrate to be coated, thus homogenizing the lateral temperature profile.
Gelöst wird die Aufgabe durch die in den Ansprüchen angegebene Erfindung. Die Unteransprüche stellen nicht nur vorteilhafte Weiterbildungen der im Hauptanspruch angegebenen Erfindung dar. Die Unteransprüche bilden auch eigenständige Lösungen der Aufgabe.The object is achieved by the invention specified in the claims. The dependent claims represent not only advantageous developments of the invention specified in the main claim. The dependent claims also form independent solutions to the problem.
Mit den in den Ansprüchen angegebenen und den im Folgenden beschriebenen technischen Merkmalen wird die Temperaturhomogenität auf der Substratoberfläche verbessert. Die Differenz einer tiefsten auf der Substratoberfläche gemessenen Temperatur von einer höchsten auf derselben Substratoberfläche gemessenen Temperatur wird durch die im Folgenden vorgeschlagenen Maßnahmen gegenüber dem Stand der Technik vermindert. Zunächst und im Wesentlichen wird vorgeschlagen, dass die Nut, aus der der Tragvorsprung entspringt, selbst wiederum in einer Vertiefung angeordnet ist. Die Vertiefung erstreckt sich auf einem Vertikalniveau unterhalb des Bodens der Lagerfläche, aber oberhalb des Bodens der Nut, so dass das Vertikalniveau der Vertiefung zwischen dem Boden der Nut und dem Lagertaschenboden liegt. Der Lagertaschenboden verläuft im Wesentlichen flach in einer Ebene. Zur Erhöhung der Temperaturhomogenität auf der Substratoberfläche ist jedoch auch vorgesehen, dass der Lagertaschenboden vertikale Strukturen, bspw. gegenüber einem Lagertaschenniveau erhöhte Bereiche und gegenüber einem Lagertaschenniveau vertiefte Bereiche aufweist. Es ist insbesondere vorgesehen, dass der Tragvorsprung einen Abstand von der Positionierflanke besitzt. Es ist auch vorgesehen, dass die den Tragvorsprung umgebende Nut einen Abstand zur Positionierflanke besitzt. Die Vertiefung kann einen ersten Vertiefungsabschnitt besitzen, der den Abstandsraum zwischen der Nut und der Positionierflanke ausfüllt. Die Vertiefung grenzt somit bis an die Positionierflanke, so dass die Positionierflanke auf dem Rand des ersten Vertiefungsabschnittes verläuft. An den ersten Vertiefungsabschnitt kann sich ein zweiter Vertiefungsabschnitt anschließen. Bevorzugt schließen sich an den ersten Vertiefungsabschnitt in Umfangsrichtung der Randbegrenzung des Lagerplatzes zwei zweite Vertiefungsabschnitte an, die jeweils an die Positionierflanke angrenzen. Es kann ein dritter Vertiefungsabschnitt vorgesehen sein, der dem ersten Vertiefungsabschnitt – bezogen auf den Tragvorsprung – gegenüberliegt. Der erste, zweite und dritte Vertiefungsabschnitt sind bevorzugt so angeordnet, dass sie die Nut, welche wiederum den Tragvorsprung umgibt, vollständig umgeben. Der Tragvorsprung liegt somit mitsamt der ihn umgebenden Nut als Insel in einer gegenüber dem Lagerflächenniveau vertieften Ebene, die den Vertiefungsboden bildet. Der Tragvorsprung ist insbesondere derart von der Positionierflanke beabstandet, dass er vom Rand des Substrates vollständig überdeckt wird. Auf der Auflagezone des Tragvorsprungs liegt somit ein vom Rand des Substrates in Richtung auf das Zentrum des Substrates beabstandeter Flächenabschnitt der Unterseite des Substrates auf. Die Auflagezone ist eine nahezu punktförmige Fläche. Sie hat bevorzugt einen Durchmesser von maximal 0,7 mm, 0,5 mm oder maximal 0,3 mm. Der Mittelpunkt der Auflagezone ist bevorzugt mindestens 4 mm von der Positionierflanke beabstandet. Die Auflagezone kann knickstellenfrei in die im Querschnitt gerundete Seitenwand des Tragvorsprungs übergehen. Die Seitenwand kann sich auf einer gewölbten Fläche erstrecken, die im Querschnitt auf einer Kreisbogenlinie verläuft. Auch der Querschnitt der Nut kann auf einer Kreisbogenlinie verlaufen. Sie bildet einen den Tragvorsprung umgebenden Ringgraben. Die beiden Kreisbogenlinien sind entgegengesetzt gekrümmt und gehen im Bereich eines Querschnittwendepunktes ineinander über. Der Boden der Nut verläuft auf einer Scheitellinie einer von der Nut ausgebildeten Kehle. Der radial äußere Rand der Nut kann gerundet oder unter Ausbildung einer Fase in den Vertiefungsboden übergehen. Der Vertiefungsboden erstreckt sich bevorzugt auf einer Ebene, die parallel zum Lagerflächenniveau und parallel zur Auflageebene sich erstreckt. Der Vertiefungsrand, an dem der Vertiefungsboden endet, wird bevorzugt von einer Stufe ausgebildet. Unter Ausbildung dieser Stufe geht der Vertiefungsrand in die Lagertaschen-Bodenfläche über. Eine Lagertasche ist bevorzugt von mindestens sechs, bevorzugt voneinander beabstandeten Sockeln umgeben, die jeweils eine Positionierflanke ausbilden. Die Positionierflanken können auf einer gemeinsamen Kreisbogenlinie verlaufen. Jede Positionierflanke kann aber auch insbesondere in ihrer Mitte einen geradlinig verlaufenden Abschnitt aufweisen. Bevorzugt verläuft die Positionierflanke dort, wo sie an die Vertiefung angrenzt, geradlinig. Es sind bevorzugt sechs Tragvorsprünge mit jeweils einer Auflagefläche vorgesehen, die in Umfangsrichtung entlang einer Kreisbogenlinie innerhalb des bevorzugt kreisförmigen Begrenzungsrandes der Lagertasche in gleichmäßiger Winkelverteilung angeordnet sind. Sämtliche Auflageflächen der Tragvorsprünge liegen in der Auflageebene. Der vertikale Abstand der Auflageebene vom Lagertaschenboden beträgt bevorzugt 400 μm. Der Abstand kann in einem Bereich zwischen 300 und 500 μm liegen. Der vertikale Abstand des Nutbodens von der Auflageebene kann in einem Bereich zwischen 500 und 900 μm liegen. Der vertikale Abstand der Auflageebene vom Vertiefungsboden beträgt bevorzugt 500 μm, so dass die Stufe zwischen Vertiefung und Lagertaschenboden etwa 100 μm beträgt. Dieser Abstand kann in einem Bereich zwischen 300 und 700 μm liegen, so dass die Stufe auch kleiner als 100 μm, aber auch größer als 100 μm sein kann.With the specified in the claims and the technical features described below, the temperature homogeneity on the Substrate surface improved. The difference between a lowest temperature measured on the substrate surface and a highest temperature measured on the same substrate surface is reduced by the measures proposed below in comparison with the prior art. First and foremost, it is proposed that the groove from which springs the support projection, in turn, is arranged in a depression. The recess extends at a vertical level below the bottom of the bearing surface but above the bottom of the groove so that the vertical level of the recess lies between the bottom of the groove and the bearing pocket bottom. The storage bag bottom is essentially flat in one plane. However, in order to increase the temperature homogeneity on the substrate surface, it is also provided that the bearing pocket bottom has vertical structures, for example elevated areas relative to a bearing pocket level and areas recessed relative to a bearing pocket level. It is provided in particular that the supporting projection has a distance from the positioning edge. It is also envisaged that the groove surrounding the support projection has a distance to the positioning edge. The recess may have a first recess portion which fills the clearance space between the groove and the positioning edge. The depression thus adjoins the positioning flank so that the positioning flank extends on the edge of the first depression section. A second recess section may adjoin the first recess section. Preferably, two second recessed sections adjoin the first recessed section in the circumferential direction of the edge boundary of the storage location, each adjoining the positioning flank. There may be provided a third recess portion opposite to the first recess portion - with respect to the support projection. The first, second and third recessed portions are preferably arranged so that they completely surround the groove, which in turn surrounds the supporting projection. The support projection thus lies together with the groove surrounding it as an island in a relation to the bearing surface level recessed level, which forms the well bottom. The supporting projection is in particular spaced from the positioning flank so that it is completely covered by the edge of the substrate. On the support zone of the support projection is thus a distance from the edge of the substrate in the direction of the center of the substrate spaced surface portion of the underside of the substrate. The contact zone is a nearly punctiform surface. It preferably has a diameter of at most 0.7 mm, 0.5 mm or a maximum of 0.3 mm. The center of the support zone is preferably spaced at least 4 mm from the positioning edge. The support zone can pass without kinks in the cross-sectionally rounded side wall of the support projection. The side wall may extend on a curved surface which extends in cross section on a circular arc line. The cross section of the groove can also run on a circular arc. It forms a ring trench surrounding the supporting projection. The two circular arc lines are curved in opposite directions and merge into each other in the area of a cross-section turning point. The bottom of the groove extends on a crest line of a groove formed by the groove. The radially outer edge of the groove may be rounded or merge into the recess bottom to form a chamfer. The recess bottom preferably extends on a plane which extends parallel to the bearing surface level and parallel to the support plane. The recess edge at which the recess bottom ends is preferably formed by a step. Under formation of this stage, the recess edge merges into the bearing pocket bottom surface. A bearing pocket is preferably surrounded by at least six, preferably spaced, sockets, each forming a positioning edge. The positioning edges can run on a common circular arc line. However, each positioning edge can also have a rectilinear section, especially in its center. Preferably, the positioning edge is where it adjoins the recess, straight. There are preferably six support projections each provided with a support surface, which are arranged in the circumferential direction along a circular arc line within the preferably circular boundary edge of the bearing pocket in a uniform angular distribution. All bearing surfaces of the supporting projections lie in the support plane. The vertical distance of the support plane from the bearing pocket bottom is preferably 400 μm. The distance can be in a range between 300 and 500 microns. The vertical distance of the groove bottom from the support plane can be in a range between 500 and 900 microns. The vertical distance between the support plane and the recess bottom is preferably 500 μm, so that the step between the recess and the bearing pocket bottom is approximately 100 μm. This distance can be in a range between 300 and 700 microns, so that the stage can also be less than 100 microns, but also greater than 100 microns.
Kurze Beschreibung der ZeichnungenBrief description of the drawings
Ein Ausführungsbeispiel der Erfindung wird nachfolgend anhand beigefügter Zeichnung erläutert. Es zeigen:An embodiment of the invention will be explained below with reference to the accompanying drawings. Show it:
Beschreibung der AusführungsformenDescription of the embodiments
Die
Auf der Oberseite des Suszeptors
Die
Innerhalb der Vertiefung
Die radial nach innen weisende Wand der Nut
Der Tragvorsprung
Die Nut
Der Durchmesser der Auflagezone
Der dritte Vertiefungsabschnitt
Die
Die vorstehenden Ausführungen dienen der Erläuterung der von der Anmeldung insgesamt erfassten Erfindungen, die den Stand der Technik zumindest durch die folgenden Merkmalskombinationen jeweils auch eigenständig weiterbilden, nämlich:The above explanations serve to explain the inventions as a whole, which further develop the state of the art independently, at least by the following feature combinations, namely:
Eine Vorrichtung, die dadurch gekennzeichnet ist, dass sich die Nut
Eine Vorrichtung, die dadurch gekennzeichnet ist, dass der Tragvorsprung
Eine Vorrichtung, die dadurch gekennzeichnet ist, dass der horizontale Abstand zwischen Nut
Eine Vorrichtung, die gekennzeichnet ist durch sich an den ersten Vertiefungsabschnitt
Eine Vorrichtung, die dadurch gekennzeichnet ist, dass der erste Vertiefungsabschnitt
Eine Vorrichtung, die dadurch gekennzeichnet ist, dass der Tragvorsprung
Eine Vorrichtung, die dadurch gekennzeichnet ist, dass der Mittelpunkt der Auflagezone
Eine Vorrichtung, die dadurch gekennzeichnet ist, dass die Auflagezone
Eine Vorrichtung, die dadurch gekennzeichnet ist, dass die im Querschnitt gerundete Seitenwand
Eine Vorrichtung, die dadurch gekennzeichnet ist, dass der Vertiefungsboden
Eine Vorrichtung, die dadurch gekennzeichnet ist, dass die Lagertasche
Eine Vorrichtung, die dadurch gekennzeichnet ist, dass ein Vertikalabstand D1 zwischen der Auflagezone
Alle offenbarten Merkmale sind (für sich, aber auch in Kombination untereinander) erfindungswesentlich. In die Offenbarung der Anmeldung wird hiermit auch der Offenbarungsinhalt der zugehörigen/beigefügten Prioritätsunterlagen (Abschrift der Voranmeldung) vollinhaltlich mit einbezogen, auch zu dem Zweck, Merkmale dieser Unterlagen in Ansprüche vorliegender Anmeldung mit aufzunehmen. Die Unteransprüche charakterisieren mit ihren Merkmalen eigenständige erfinderische Weiterbildungen des Standes der Technik, insbesondere um auf Basis dieser Ansprüche Teilanmeldungen vorzunehmen.All disclosed features are essential to the invention (individually, but also in combination with one another). The disclosure of the associated / attached priority documents (copy of the prior application) is hereby also incorporated in full in the disclosure of the application, also for the purpose of including features of these documents in claims of the present application. The subclaims characterize with their features independent inventive developments of the prior art, in particular to make on the basis of these claims divisional applications.
BezugszeichenlisteLIST OF REFERENCE NUMBERS
- 11
- Suszeptorsusceptor
- 22
- Lagertasche, -platzStorage bag, place
- 33
- PositionierflankePositionierflanke
- 44
- LagertaschenbodenStorage pocket base
- 55
- Nutgroove
- 66
- Nutbodengroove bottom
- 77
- Nutrandslot edge
- 8 8th
- Tragvorsprungsupport boss
- 99
- Auflageflächebearing surface
- 1010
- SeitenwandSide wall
- 1111
- Vertiefungdeepening
- 1212
- Vertiefungsbodenwell bottom
- 1313
- Vertiefungsrandgroove edge
- 1414
- Wendepunktturning point
- 1515
- Fasechamfer
- 1616
- Vertiefungsabschnittrecess portion
- 1717
- Vertiefungsabschnittrecess portion
- 1818
- Vertiefungsabschnittrecess portion
- 1919
- Sockelbase
- 2020
- Substratsubstratum
- Ee
- Auflageebene support plane
- D1 D 1
- Abstand distance
- D2 D 2
- Abstand distance
- D3 D 3
- Abstand distance
- R1 R 1
- Radius radius
- R2 R 2
- Radius radius
ZITATE ENTHALTEN IN DER BESCHREIBUNG QUOTES INCLUDE IN THE DESCRIPTION
Diese Liste der vom Anmelder aufgeführten Dokumente wurde automatisiert erzeugt und ist ausschließlich zur besseren Information des Lesers aufgenommen. Die Liste ist nicht Bestandteil der deutschen Patent- bzw. Gebrauchsmusteranmeldung. Das DPMA übernimmt keinerlei Haftung für etwaige Fehler oder Auslassungen.This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.
Zitierte PatentliteraturCited patent literature
- US 2003/0209326 A1 [0002] US 2003/0209326 A1 [0002]
- US 2014/0287142 A1 [0003] US 2014/0287142 A1 [0003]
- US 5645647 [0004] US 5645647 [0004]
- DE 102012108986 A1 [0005] DE 102012108986 A1 [0005]
- DE 202015118215 [0006] DE 202015118215 [0006]
- DE 102011055061 A1 [0017] DE 102011055061 A1 [0017]
Claims (13)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102016103530.0A DE102016103530A1 (en) | 2016-02-29 | 2016-02-29 | Substrate holding device with projecting from an annular groove supporting projections |
TW105209612U TWM545140U (en) | 2016-02-29 | 2016-06-27 | Device for holding the substrate used in the process chamber of a CVD or PVD reactor |
CN201620924056.0U CN206232802U (en) | 2016-02-29 | 2016-08-23 | Equipment for holding at least one base material in the process room of CVD or PVD reactors |
CN201780022255.XA CN108884565A (en) | 2016-02-29 | 2017-02-21 | With the substrate holding apparatus from annular groove supporting projection outstanding |
PCT/EP2017/053862 WO2017148734A1 (en) | 2016-02-29 | 2017-02-21 | Substrate holding device with support protrusions which originate from an annular groove |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102016103530.0A DE102016103530A1 (en) | 2016-02-29 | 2016-02-29 | Substrate holding device with projecting from an annular groove supporting projections |
Publications (1)
Publication Number | Publication Date |
---|---|
DE102016103530A1 true DE102016103530A1 (en) | 2017-08-31 |
Family
ID=58162538
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102016103530.0A Pending DE102016103530A1 (en) | 2016-02-29 | 2016-02-29 | Substrate holding device with projecting from an annular groove supporting projections |
Country Status (4)
Country | Link |
---|---|
CN (2) | CN206232802U (en) |
DE (1) | DE102016103530A1 (en) |
TW (1) | TWM545140U (en) |
WO (1) | WO2017148734A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019233965A1 (en) | 2018-06-06 | 2019-12-12 | Aixtron Se | Cvd reactor with carrying ring for substrate handling, and use of a carrying ring on a cvd reactor |
DE102018131987A1 (en) | 2018-12-12 | 2020-06-18 | Aixtron Se | Substrate holder for use in a CVD reactor |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220262658A1 (en) * | 2021-02-17 | 2022-08-18 | Applied Materials, Inc. | Flat pocket susceptor design with improved heat transfer |
Citations (8)
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US5645647A (en) | 1989-01-26 | 1997-07-08 | Pfizer Inc. | Modified polydextrose and process therefor |
DE69619074T2 (en) * | 1995-12-05 | 2002-08-29 | Applied Materials Inc | Substrate carrier device for a coating chamber |
US20030209326A1 (en) | 2002-05-07 | 2003-11-13 | Mattson Technology, Inc. | Process and system for heating semiconductor substrates in a processing chamber containing a susceptor |
US20050092439A1 (en) * | 2003-10-29 | 2005-05-05 | Keeton Tony J. | Low/high temperature substrate holder to reduce edge rolloff and backside damage |
DE102011055061A1 (en) | 2011-11-04 | 2013-05-08 | Aixtron Se | CVD reactor or substrate holder for a CVD reactor |
DE102013103045A1 (en) * | 2012-03-30 | 2013-10-02 | Samsung Electronics Co., Ltd. | Device for chemical vapor deposition with susceptor |
DE102012108986A1 (en) | 2012-09-24 | 2014-03-27 | Aixtron Se | Substrate holder for use in process chamber of semiconductor substrate treatment device, has recess having bearing surfaces which lie in common plane, and wall in region of projections in plan view of top face is straight |
DE102015118215A1 (en) | 2014-11-28 | 2016-06-02 | Aixtron Se | Substrate holding device with isolated support projections for supporting the substrate |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3004846B2 (en) * | 1993-08-20 | 2000-01-31 | 東芝セラミックス株式会社 | Susceptor for vapor phase growth equipment |
US6634882B2 (en) * | 2000-12-22 | 2003-10-21 | Asm America, Inc. | Susceptor pocket profile to improve process performance |
-
2016
- 2016-02-29 DE DE102016103530.0A patent/DE102016103530A1/en active Pending
- 2016-06-27 TW TW105209612U patent/TWM545140U/en unknown
- 2016-08-23 CN CN201620924056.0U patent/CN206232802U/en active Active
-
2017
- 2017-02-21 CN CN201780022255.XA patent/CN108884565A/en active Pending
- 2017-02-21 WO PCT/EP2017/053862 patent/WO2017148734A1/en active Application Filing
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5645647A (en) | 1989-01-26 | 1997-07-08 | Pfizer Inc. | Modified polydextrose and process therefor |
DE69619074T2 (en) * | 1995-12-05 | 2002-08-29 | Applied Materials Inc | Substrate carrier device for a coating chamber |
US20030209326A1 (en) | 2002-05-07 | 2003-11-13 | Mattson Technology, Inc. | Process and system for heating semiconductor substrates in a processing chamber containing a susceptor |
US20050092439A1 (en) * | 2003-10-29 | 2005-05-05 | Keeton Tony J. | Low/high temperature substrate holder to reduce edge rolloff and backside damage |
DE102011055061A1 (en) | 2011-11-04 | 2013-05-08 | Aixtron Se | CVD reactor or substrate holder for a CVD reactor |
US20140287142A1 (en) | 2011-11-04 | 2014-09-25 | Aixtron Se | Cvd reactor and substrate holder for a cvd reactor |
DE102013103045A1 (en) * | 2012-03-30 | 2013-10-02 | Samsung Electronics Co., Ltd. | Device for chemical vapor deposition with susceptor |
DE102012108986A1 (en) | 2012-09-24 | 2014-03-27 | Aixtron Se | Substrate holder for use in process chamber of semiconductor substrate treatment device, has recess having bearing surfaces which lie in common plane, and wall in region of projections in plan view of top face is straight |
DE102015118215A1 (en) | 2014-11-28 | 2016-06-02 | Aixtron Se | Substrate holding device with isolated support projections for supporting the substrate |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019233965A1 (en) | 2018-06-06 | 2019-12-12 | Aixtron Se | Cvd reactor with carrying ring for substrate handling, and use of a carrying ring on a cvd reactor |
DE102018113400A1 (en) | 2018-06-06 | 2019-12-12 | Aixtron Se | CVD reactor with support ring for substrate handling |
DE102018131987A1 (en) | 2018-12-12 | 2020-06-18 | Aixtron Se | Substrate holder for use in a CVD reactor |
WO2020120578A1 (en) | 2018-12-12 | 2020-06-18 | Aixtron Se | Substrate holder for use in a cvd reactor |
Also Published As
Publication number | Publication date |
---|---|
WO2017148734A1 (en) | 2017-09-08 |
CN206232802U (en) | 2017-06-09 |
TWM545140U (en) | 2017-07-11 |
CN108884565A (en) | 2018-11-23 |
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