DE102010046930A8 - Cleaning-free activated resin composition and surface-mounting method using the same - Google Patents

Cleaning-free activated resin composition and surface-mounting method using the same Download PDF

Info

Publication number
DE102010046930A8
DE102010046930A8 DE102010046930A DE102010046930A DE102010046930A8 DE 102010046930 A8 DE102010046930 A8 DE 102010046930A8 DE 102010046930 A DE102010046930 A DE 102010046930A DE 102010046930 A DE102010046930 A DE 102010046930A DE 102010046930 A8 DE102010046930 A8 DE 102010046930A8
Authority
DE
Germany
Prior art keywords
cleaning
resin composition
same
mounting method
activated resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE102010046930A
Other languages
German (de)
Other versions
DE102010046930A1 (en
DE102010046930B4 (en
Inventor
Kazunori Kitamura
Yasuhiro Takase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
San Ei Kagaku Co Ltd
Original Assignee
San Ei Kagaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2010056668A external-priority patent/JP5234029B2/en
Application filed by San Ei Kagaku Co Ltd filed Critical San Ei Kagaku Co Ltd
Publication of DE102010046930A1 publication Critical patent/DE102010046930A1/en
Publication of DE102010046930A8 publication Critical patent/DE102010046930A8/en
Application granted granted Critical
Publication of DE102010046930B4 publication Critical patent/DE102010046930B4/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4223—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/315—Compounds containing carbon-to-nitrogen triple bonds
    • C08K5/3155—Dicyandiamide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
DE102010046930.0A 2010-02-23 2010-09-29 Surface mounting method Active DE102010046930B4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010-056668 2010-02-23
JP2010-0566668 2010-02-23
JP2010056668A JP5234029B2 (en) 2009-08-05 2010-02-23 No-clean active resin composition and surface mounting technology

Publications (3)

Publication Number Publication Date
DE102010046930A1 DE102010046930A1 (en) 2011-08-25
DE102010046930A8 true DE102010046930A8 (en) 2011-12-15
DE102010046930B4 DE102010046930B4 (en) 2014-07-17

Family

ID=44356834

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102010046930.0A Active DE102010046930B4 (en) 2010-02-23 2010-09-29 Surface mounting method

Country Status (1)

Country Link
DE (1) DE102010046930B4 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5467469B2 (en) 2011-01-04 2014-04-09 山栄化学株式会社 Method of surface mounting on printed wiring board

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2103621A (en) * 1981-06-19 1983-02-23 Mitsui Toatsu Chemicals Thermosetting resin composition
US5620831A (en) * 1994-04-05 1997-04-15 Taiyo Ink Manufacturing Co., Ltd. Cyanoguanidine derivatives, and thermosetting or photocurable, thermosetting resin composition using the same
JP2002237676A (en) * 2001-02-08 2002-08-23 Denso Corp Method for assembling surface-mounting component

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004152936A (en) 2002-10-30 2004-05-27 Tamura Kaken Co Ltd Flux for soldering circuit board, solder paste and circuit board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2103621A (en) * 1981-06-19 1983-02-23 Mitsui Toatsu Chemicals Thermosetting resin composition
US5620831A (en) * 1994-04-05 1997-04-15 Taiyo Ink Manufacturing Co., Ltd. Cyanoguanidine derivatives, and thermosetting or photocurable, thermosetting resin composition using the same
JP2002237676A (en) * 2001-02-08 2002-08-23 Denso Corp Method for assembling surface-mounting component

Also Published As

Publication number Publication date
DE102010046930A1 (en) 2011-08-25
DE102010046930B4 (en) 2014-07-17

Similar Documents

Publication Publication Date Title
DE102011050837A8 (en) Sensor and method for producing the same
DE102011050839A8 (en) Sensor and method for producing the same
HK1177946A1 (en) Polyamide resin composition and method for producing polyamide resin composition
SG184290A1 (en) Actinic-ray- or radiation-sensitive resin composition and method of forming pattern using the same
SG2014010706A (en) Method and composition
EP2338918A4 (en) Water-absorbent resin manufacturing method and liquid permeability improvement method
GB201016001D0 (en) Composition and method
DE112010004835A5 (en) HEAT-DAMPING GLAZING ELEMENT AND METHOD FOR THE PRODUCTION THEREOF
EP2771397A4 (en) Silica-filled rubber composition and method for making the same
EP2662414A4 (en) Polymer microparticle-dispersed resin composition and method for producing same
EP2601235A4 (en) Epoxidized composition and methods for making the same
PL2828309T3 (en) Verfahren zur herstellung von polyurethan-hartschäumen und polyisocyanurat-hartschäumen
DE112010000715A5 (en) Component arrangement and method for its production
EP2730613A4 (en) Resin composition and method for producing same
EP2771398A4 (en) Silica-filled rubber composition and method for making the same
EP2297045A4 (en) Anti-biofouling materials and methods of making the same
EP2267075A4 (en) Polyacetal resin composition and method for producing the same
EP2716666A4 (en) Curing composition and polymer
GB2483469B (en) Resin curing kit and method
EP2644637A4 (en) Polyamide resin and method for molding same
DE102011000309B8 (en) Brushless motor and method of making the same
GB201003531D0 (en) Composition and method
PL2683664T3 (en) Verfahren und vorrichtung zur herstellung von dünnen hohlen glaswaren
ATE543383T1 (en) METHOD FOR DELAYING THE RUITENING OF CROPS
AT508863A3 (en) CONVEYING DEVICE AND METHOD FOR DETERMINING THE ORDER OF DRIVES

Legal Events

Date Code Title Description
R016 Response to examination communication
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: C08L0063000000

Ipc: B23K0001200000

R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: C08L0063000000

Ipc: B23K0001200000

Effective date: 20130930

R016 Response to examination communication
R018 Grant decision by examination section/examining division
R020 Patent grant now final