DE102007045525A8 - Bildsensor - Google Patents

Bildsensor Download PDF

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Publication number
DE102007045525A8
DE102007045525A8 DE102007045525A DE102007045525A DE102007045525A8 DE 102007045525 A8 DE102007045525 A8 DE 102007045525A8 DE 102007045525 A DE102007045525 A DE 102007045525A DE 102007045525 A DE102007045525 A DE 102007045525A DE 102007045525 A8 DE102007045525 A8 DE 102007045525A8
Authority
DE
Germany
Prior art keywords
image sensor
sensor
image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE102007045525A
Other languages
English (en)
Other versions
DE102007045525A1 (de
Inventor
Jacques Dr. Duparré
Frank Wippermann
Andreas Dr. Bräuer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Original Assignee
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV filed Critical Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Priority to DE102007045525A priority Critical patent/DE102007045525A1/de
Priority to JP2010525272A priority patent/JP5342557B2/ja
Priority to KR1020107006289A priority patent/KR101486617B1/ko
Priority to PCT/EP2008/008090 priority patent/WO2009040110A1/de
Priority to EP08802567A priority patent/EP2198458A1/de
Priority to US12/677,169 priority patent/US20100277627A1/en
Publication of DE102007045525A1 publication Critical patent/DE102007045525A1/de
Publication of DE102007045525A8 publication Critical patent/DE102007045525A8/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
    • H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics
    • H04N25/13—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements
    • H04N25/134—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements based on three different wavelength filter elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/61—Noise processing, e.g. detecting, correcting, reducing or removing noise the noise originating only from the lens unit, e.g. flare, shading, vignetting or "cos4"
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/61—Noise processing, e.g. detecting, correcting, reducing or removing noise the noise originating only from the lens unit, e.g. flare, shading, vignetting or "cos4"
    • H04N25/611—Correction of chromatic aberration
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/0025—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for optical correction, e.g. distorsion, aberration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14621—Colour filter arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14634—Assemblies, i.e. Hybrid structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
    • H04N1/04—Scanning arrangements, i.e. arrangements for the displacement of active reading or reproducing elements relative to the original or reproducing medium, or vice versa
    • H04N1/19—Scanning arrangements, i.e. arrangements for the displacement of active reading or reproducing elements relative to the original or reproducing medium, or vice versa using multi-element arrays
    • H04N1/195—Scanning arrangements, i.e. arrangements for the displacement of active reading or reproducing elements relative to the original or reproducing medium, or vice versa using multi-element arrays the array comprising a two-dimensional array or a combination of two-dimensional arrays

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
DE102007045525A 2007-09-24 2007-09-24 Bildsensor Ceased DE102007045525A1 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DE102007045525A DE102007045525A1 (de) 2007-09-24 2007-09-24 Bildsensor
JP2010525272A JP5342557B2 (ja) 2007-09-24 2008-09-24 イメージセンサ
KR1020107006289A KR101486617B1 (ko) 2007-09-24 2008-09-24 이미지 센서
PCT/EP2008/008090 WO2009040110A1 (de) 2007-09-24 2008-09-24 Bildsensor mit bildkompensation durch pixelanordnung
EP08802567A EP2198458A1 (de) 2007-09-24 2008-09-24 Bildsensor mit bildkompensation durch pixelanordnung
US12/677,169 US20100277627A1 (en) 2007-09-24 2008-09-24 Image Sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102007045525A DE102007045525A1 (de) 2007-09-24 2007-09-24 Bildsensor

Publications (2)

Publication Number Publication Date
DE102007045525A1 DE102007045525A1 (de) 2009-04-02
DE102007045525A8 true DE102007045525A8 (de) 2009-07-23

Family

ID=40348088

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102007045525A Ceased DE102007045525A1 (de) 2007-09-24 2007-09-24 Bildsensor

Country Status (6)

Country Link
US (1) US20100277627A1 (de)
EP (1) EP2198458A1 (de)
JP (1) JP5342557B2 (de)
KR (1) KR101486617B1 (de)
DE (1) DE102007045525A1 (de)
WO (1) WO2009040110A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010031535A1 (de) 2010-07-19 2012-01-19 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Bildaufnahmevorrichtung und Verfahren zum Aufnehmen eines Bildes
JP6209308B2 (ja) * 2011-04-26 2017-10-04 ソニー株式会社 撮像装置および電子機器
ES2872927T3 (es) * 2013-05-21 2021-11-03 Photonic Sensors & Algorithms S L Integración monolítica de lentes plenópticas sobre sustratos fotosensores
CA2819956C (en) * 2013-07-02 2022-07-12 Guy Martin High accuracy camera modelling and calibration method
DE102015104208A1 (de) * 2015-03-20 2016-09-22 Osram Opto Semiconductors Gmbh Sensorvorrichtung
CN106161920A (zh) * 2015-04-22 2016-11-23 北京智谷睿拓技术服务有限公司 图像采集控制方法和装置
CN105245765A (zh) * 2015-07-20 2016-01-13 联想(北京)有限公司 图像传感阵列及其排布方法、图像采集部件、电子设备
US10917543B2 (en) 2017-04-24 2021-02-09 Alcon Inc. Stereoscopic visualization camera and integrated robotics platform
US10299880B2 (en) * 2017-04-24 2019-05-28 Truevision Systems, Inc. Stereoscopic visualization camera and platform
US11083537B2 (en) 2017-04-24 2021-08-10 Alcon Inc. Stereoscopic camera with fluorescence visualization
US11467100B2 (en) * 2017-08-08 2022-10-11 General Electric Company Imaging element for a borescope
KR102183003B1 (ko) * 2018-08-01 2020-11-27 (주)엘디스 광통신 광원용 광파장 감시기
JP7377082B2 (ja) 2019-11-29 2023-11-09 株式会社ジャパンディスプレイ 検出装置及び検出装置の製造方法
WO2023102421A1 (en) * 2021-11-30 2023-06-08 Georgia State University Research Foundation, Inc. Flexible and miniaturized compact optical sensor

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01119178A (ja) * 1987-10-30 1989-05-11 Nikon Corp 撮像装置
JPH05207383A (ja) * 1992-01-29 1993-08-13 Toshiba Corp 固体撮像装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6201574B1 (en) * 1991-05-13 2001-03-13 Interactive Pictures Corporation Motionless camera orientation system distortion correcting sensing element
EP0786814A1 (de) 1996-01-26 1997-07-30 Hewlett-Packard Company Photodetektor-Matrix mit Kompensation von Abbildungsfehlern und ungleichmässiger Beleuchtung
JP3461275B2 (ja) * 1997-12-25 2003-10-27 キヤノン株式会社 光電変換装置及びこれを用いたカメラ
JP2000036587A (ja) * 1998-07-21 2000-02-02 Sony Corp 固体撮像素子
US6563101B1 (en) * 2000-01-19 2003-05-13 Barclay J. Tullis Non-rectilinear sensor arrays for tracking an image
JP2004221657A (ja) 2003-01-09 2004-08-05 Fuji Photo Film Co Ltd 撮像装置
JP4656393B2 (ja) * 2005-02-23 2011-03-23 横河電機株式会社 光源装置
KR100710208B1 (ko) * 2005-09-22 2007-04-20 동부일렉트로닉스 주식회사 씨모스 이미지 센서 및 그 제조방법
JP2007194500A (ja) * 2006-01-20 2007-08-02 Fujifilm Corp 固体撮像素子およびその製造方法
DE102006004802B4 (de) 2006-01-23 2008-09-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Bilderfassungssystem und Verfahren zur Herstellung mindestens eines Bilderfassungssystems

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01119178A (ja) * 1987-10-30 1989-05-11 Nikon Corp 撮像装置
JPH05207383A (ja) * 1992-01-29 1993-08-13 Toshiba Corp 固体撮像装置

Also Published As

Publication number Publication date
KR101486617B1 (ko) 2015-02-04
US20100277627A1 (en) 2010-11-04
EP2198458A1 (de) 2010-06-23
KR20100059896A (ko) 2010-06-04
DE102007045525A1 (de) 2009-04-02
WO2009040110A1 (de) 2009-04-02
JP2010541197A (ja) 2010-12-24
JP5342557B2 (ja) 2013-11-13

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8181 Inventor (new situation)

Inventor name: WIPPERMANN, FRANK, 07743 JENA, DE

Inventor name: DUPARRE, JACQUES, DR., 07745 JENA, DE

Inventor name: BRAEUER, ANDREAS, DR., 07646 SCHLOEBEN, DE

8196 Reprint of faulty title page (publication) german patentblatt: part 1a6
OP8 Request for examination as to paragraph 44 patent law
R002 Refusal decision in examination/registration proceedings
R003 Refusal decision now final