DE102006037084A1 - Method for treating printed circuit boards by means of an etching solution - Google Patents

Method for treating printed circuit boards by means of an etching solution Download PDF

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Publication number
DE102006037084A1
DE102006037084A1 DE200610037084 DE102006037084A DE102006037084A1 DE 102006037084 A1 DE102006037084 A1 DE 102006037084A1 DE 200610037084 DE200610037084 DE 200610037084 DE 102006037084 A DE102006037084 A DE 102006037084A DE 102006037084 A1 DE102006037084 A1 DE 102006037084A1
Authority
DE
Germany
Prior art keywords
circuit boards
etching
printed circuit
etching solution
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE200610037084
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EVE RECYCLING SARL
Original Assignee
EVE RECYCLING SARL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EVE RECYCLING SARL filed Critical EVE RECYCLING SARL
Publication of DE102006037084A1 publication Critical patent/DE102006037084A1/en
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34—Chemical or biological purification of waste gases
    • B01D53/46—Removing components of defined structure
    • B01D53/54—Nitrogen compounds
    • B01D53/58—Ammonia
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/068—Apparatus for etching printed circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Biomedical Technology (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

Bei einem Verfahren zum Behandeln von Leiterplatten (2) mittels einer Prozesslösung (4), insbesondere Ätzlösung in einer Ätzmaschine (1), in welcher die Leiterplatten (2) mit einer Prozesslösung (4), insbesondere Ätzlösung, besprüht werden, wobei an die Ätzmaschine (1) ein Flüssigkeitsregenerator (9) mit ggf. zwischengeschalteter Elektrolysezelle (20) angeschlossen wird, soll die Prozesslösung (4), insbesondere die Ätzlösung, einen ein- oder mehrstufigen Komplexer durchlaufen und anschließend wieder der Ätzmaschine (1) zum erneuten Abätzen der Leiterplatte zugeführt werden.In a method for treating printed circuit boards (2) by means of a process solution (4), in particular etching solution in an etching machine (1), in which the circuit boards (2) with a process solution (4), in particular etching solution, are sprayed, wherein the etching machine (1) a liquid regenerator (9) with possibly interposed electrolytic cell (20) is connected to the process solution (4), in particular the etching solution, a single or multi-stage complexer and then back to the etching machine (1) for re-etching the circuit board be supplied.

DE200610037084 2005-11-11 2006-08-07 Method for treating printed circuit boards by means of an etching solution Withdrawn DE102006037084A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TN05284 2005-11-11

Publications (1)

Publication Number Publication Date
DE102006037084A1 true DE102006037084A1 (en) 2007-05-16

Family

ID=37982806

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200610037084 Withdrawn DE102006037084A1 (en) 2005-11-11 2006-08-07 Method for treating printed circuit boards by means of an etching solution

Country Status (2)

Country Link
DE (1) DE102006037084A1 (en)
WO (1) WO2007055670A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015150448A1 (en) * 2014-04-01 2015-10-08 Sigma Engineering Ab Oxidation of copper in a copper etching solution by the use of oxygen and/or air as an oxidizing agent
CN111644036A (en) * 2020-05-28 2020-09-11 深圳市祺鑫环保科技有限公司 Treatment method and treatment system for tail gas in acid etching electrolysis copper extraction system

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3738022A1 (en) * 1987-11-09 1989-05-18 Holzer Walter Process for regenerating alkaline etchants and apparatus for carrying out the process
DE3936363A1 (en) * 1989-11-02 1991-05-08 Hoellmueller Maschbau H Etching unit esp. for printed copper circuit boards - in which used rinsing water is distilled to recover pure water and ammoniacal etchant to which ammonia is added prior to recycling
CA2029444A1 (en) * 1990-03-21 1991-09-22 Raymond A. Letize System and process for etching with and regenerating, alkaline ammoniacal etchant solution
FR2662616B1 (en) * 1990-05-31 1994-07-08 Anjou Rech INSTALLATION FOR THE TREATMENT OF LIQUID FLOWS WITH SINGLE-PHASE CONTACTOR, AND RECIRCULATOR-DEGASSER DEVICE FOR SUCH AN INSTALLATION.

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015150448A1 (en) * 2014-04-01 2015-10-08 Sigma Engineering Ab Oxidation of copper in a copper etching solution by the use of oxygen and/or air as an oxidizing agent
CN106661738A (en) * 2014-04-01 2017-05-10 西格玛工程集团 Oxidation of copper in a copper etching solution by the use of oxygen and/or air as an oxidizing agent
US9920434B2 (en) 2014-04-01 2018-03-20 Sigma Engineering Ab Oxidation of copper in a copper etching solution by the use of oxygen and/or air as an oxidizing agent
CN106661738B (en) * 2014-04-01 2019-11-19 西格玛工程集团 By using oxygen and/or air as oxidant the copper oxide in copper etching solution
CN111644036A (en) * 2020-05-28 2020-09-11 深圳市祺鑫环保科技有限公司 Treatment method and treatment system for tail gas in acid etching electrolysis copper extraction system

Also Published As

Publication number Publication date
WO2007055670A1 (en) 2007-05-18

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Legal Events

Date Code Title Description
8181 Inventor (new situation)

Inventor name: KARIM, NAHDI DRIDI, MONTPLAISIR, TN

8139 Disposal/non-payment of the annual fee