DE10148864A1 - Adhäsionsverminderte mikromechanische Bauelemente - Google Patents

Adhäsionsverminderte mikromechanische Bauelemente

Info

Publication number
DE10148864A1
DE10148864A1 DE2001148864 DE10148864A DE10148864A1 DE 10148864 A1 DE10148864 A1 DE 10148864A1 DE 2001148864 DE2001148864 DE 2001148864 DE 10148864 A DE10148864 A DE 10148864A DE 10148864 A1 DE10148864 A1 DE 10148864A1
Authority
DE
Germany
Prior art keywords
semiconductor material
micromechanical
tempering
gas
defects
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE2001148864
Other languages
German (de)
English (en)
Inventor
Frank Fischer
Arnold Rump
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Max Planck Gesellschaft zur Foerderung der Wissenschaften eV
Original Assignee
Robert Bosch GmbH
Max Planck Gesellschaft zur Foerderung der Wissenschaften eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH, Max Planck Gesellschaft zur Foerderung der Wissenschaften eV filed Critical Robert Bosch GmbH
Priority to DE2001148864 priority Critical patent/DE10148864A1/de
Priority to PCT/DE2002/003317 priority patent/WO2003031319A2/fr
Publication of DE10148864A1 publication Critical patent/DE10148864A1/de
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0002—Arrangements for avoiding sticking of the flexible or moving parts
    • B81B3/0008—Structures for avoiding electrostatic attraction, e.g. avoiding charge accumulation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/016—Passivation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
DE2001148864 2001-10-04 2001-10-04 Adhäsionsverminderte mikromechanische Bauelemente Ceased DE10148864A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE2001148864 DE10148864A1 (de) 2001-10-04 2001-10-04 Adhäsionsverminderte mikromechanische Bauelemente
PCT/DE2002/003317 WO2003031319A2 (fr) 2001-10-04 2002-09-06 Composants micromecaniques a friction statique reduite

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2001148864 DE10148864A1 (de) 2001-10-04 2001-10-04 Adhäsionsverminderte mikromechanische Bauelemente

Publications (1)

Publication Number Publication Date
DE10148864A1 true DE10148864A1 (de) 2003-04-17

Family

ID=7701310

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2001148864 Ceased DE10148864A1 (de) 2001-10-04 2001-10-04 Adhäsionsverminderte mikromechanische Bauelemente

Country Status (2)

Country Link
DE (1) DE10148864A1 (fr)
WO (1) WO2003031319A2 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006127776A1 (fr) * 2005-05-25 2006-11-30 Northrop Grumman Corporation Electrodes metalliques pour elimination des effets de charge parasite dans des accelerometres et autres dispositifs mems
US7417784B2 (en) 2006-04-19 2008-08-26 Qualcomm Mems Technologies, Inc. Microelectromechanical device and method utilizing a porous surface
JP2010525379A (ja) 2007-04-04 2010-07-22 クォルコム・メムズ・テクノロジーズ・インコーポレーテッド 犠牲層における界面改変によるリリースエッチアタックの排除
US7738158B2 (en) 2007-06-29 2010-06-15 Qualcomm Mems Technologies, Inc. Electromechanical device treatment with water vapor
US7851239B2 (en) 2008-06-05 2010-12-14 Qualcomm Mems Technologies, Inc. Low temperature amorphous silicon sacrificial layer for controlled adhesion in MEMS devices

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5476691A (en) * 1994-01-21 1995-12-19 International Business Machines, Inc. Surface treatment of magnetic recording heads
US6096149A (en) * 1997-04-21 2000-08-01 Ford Global Technologies, Inc. Method for fabricating adhesion-resistant micromachined devices
US6328903B1 (en) * 2000-03-07 2001-12-11 Sandia Corporation Surface-micromachined chain for use in microelectromechanical structures

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5025346A (en) * 1989-02-17 1991-06-18 Regents Of The University Of California Laterally driven resonant microstructures
US5694740A (en) * 1996-03-15 1997-12-09 Analog Devices, Inc. Micromachined device packaged to reduce stiction
US6290859B1 (en) * 1999-11-12 2001-09-18 Sandia Corporation Tungsten coating for improved wear resistance and reliability of microelectromechanical devices
EP1258035A4 (fr) * 2000-02-01 2008-12-24 Analog Devices Inc Procede de traitement sur tranche destine a reduire le frottement statique et a passiver les surfaces micro-usinees et composes utilises a cet effet

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5476691A (en) * 1994-01-21 1995-12-19 International Business Machines, Inc. Surface treatment of magnetic recording heads
US6096149A (en) * 1997-04-21 2000-08-01 Ford Global Technologies, Inc. Method for fabricating adhesion-resistant micromachined devices
US6328903B1 (en) * 2000-03-07 2001-12-11 Sandia Corporation Surface-micromachined chain for use in microelectromechanical structures

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
ABE, T. et al.: Effects of Elevated Temperature Treatments in Microstructure Release Procedures. In: J. Microelectromechanical Systems Vol. 4, No. 2, June 1995, pp. 66-75 *

Also Published As

Publication number Publication date
WO2003031319A3 (fr) 2003-10-09
WO2003031319A2 (fr) 2003-04-17

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8131 Rejection