DE10117404A1 - Wave soldering process used in the production of printed circuit boards comprises using a lead-free solder having a lower melting point than a usual tin-lead solder, and a fluxing agent having no-clean properties - Google Patents

Wave soldering process used in the production of printed circuit boards comprises using a lead-free solder having a lower melting point than a usual tin-lead solder, and a fluxing agent having no-clean properties

Info

Publication number
DE10117404A1
DE10117404A1 DE10117404A DE10117404A DE10117404A1 DE 10117404 A1 DE10117404 A1 DE 10117404A1 DE 10117404 A DE10117404 A DE 10117404A DE 10117404 A DE10117404 A DE 10117404A DE 10117404 A1 DE10117404 A1 DE 10117404A1
Authority
DE
Germany
Prior art keywords
wave soldering
lead
solder
flux
wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE10117404A
Other languages
German (de)
Inventor
Werner Kruppa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stannol GmbH and Co KG
Original Assignee
PAFF STANNOL LOETMITTEL
Stannol Loetmittelfabrik Wilhelm Paff GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PAFF STANNOL LOETMITTEL, Stannol Loetmittelfabrik Wilhelm Paff GmbH and Co KG filed Critical PAFF STANNOL LOETMITTEL
Priority to DE10117404A priority Critical patent/DE10117404A1/en
Publication of DE10117404A1 publication Critical patent/DE10117404A1/en
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Abstract

Wave soldering process comprises using a lead-free solder having a lower melting point than a usual tin-lead solder, and a fluxing agent having no-clean properties. Preferred Features: The lead-free solder is an alloy containing tin and bismuth as the main components containing 30-60, preferably 50-60% bismuth. The alloy further contains alloying additions of 0-4% silver, 0-4% antimony, 0-2% indium, 0-0.01% phosphorus and/or 0-0.2% nickel. The fluxing agent is ethanol or isopropanol with additions of carboxylic acid and/or dicarboxylic acid.

Description

Legierungen auf der Basis von Zinn-Bismut haben einen Schmelzbereich um 138°C, die Löttemperatur kann entsprechend abgesenkt werden, temperaturempfindliche Bauteile werden geschont.Tin-bismuth-based alloys have a melting range by 138 ° C, the soldering temperature can be reduced accordingly, temperature-sensitive components are protected.

Die vorliegende Erfindung dient der Lösung des Problems, daß es bisher nicht möglich war, mit niedrigschmelzenden Loten auf Basis von Zinn- Bismut einen No-Clean-Prozess durchzuführen.The present invention serves to solve the problem that so far was not possible with low-melting solders based on tin Bismuth to perform a no-clean process.

Bisher werden keine Wellenlötprozesse mit niedrigschmelzenden Legierungen durchgeführt, da korrosive Flußmittel eingesetzt werden müssen, deren Rückstände den Anforderungen an einen No-Clean Prozess in der Elektronikfertigung nicht genügen. In der Literatur wird ein Prozess mit organischen Sulfonsäuren als Flußmittel vorgeschlagen (G. Jaeckle Standard Elektronik Lorenz AG, Stuttgard). Die hierin vorgeschlagene Benzolsulfonsäure ist als gesundheitsschädlich und ätzend eingestuft und wirkt stark korrodierend, daher ist ein nachfolgender Reinigungsprozeß notwendig.So far, no wave soldering processes have been carried out with low-melting alloys, since corrosive fluxes must be used, the residues of which do not meet the requirements for a no-clean process in electronics production. In the literature, a process using organic sulfonic acids as a flux is proposed (G. Jaeckle Standard Elektronik Lorenz AG, Stuttgard). The benzenesulfonic acid proposed here is classified as harmful and corrosive and has a strong corrosive effect, which is why a subsequent cleaning process is necessary.

Artaki et al (Artaki et al. SMI Adv. Electronics Manuf. Tech. Proc. Tech. Prog., San Jose 1995) empfehlen die Anwendung stark aktivierter wasserlöslicher Flußmittel, deren Reste entfernt werden müssen. Herkömmliche halogenfreie No-Clean Flußmittel sind nicht wirksam genug, um eine gute Benetzung des Lotes zu bewerkstelligen.Artaki et al (Artaki et al. SMI Adv. Electronics Manuf. Tech. Proc. Tech. Prog., San Jose 1995 ) recommend the use of highly activated water-soluble fluxes, the residues of which must be removed. Conventional halogen-free no-clean fluxes are not effective enough to achieve good wetting of the solder.

Es ist also ein Lötverfahren erwünscht, das einen Einsatz niedrigschmelzender bleifreier Lote ermöglicht und bei dem auf einen nachfolgenden Reinigungsschritt verzichtet werden kann.So a soldering process that uses it is desirable low-melting lead-free solders enables and on one subsequent cleaning step can be dispensed with.

Die hier zum Einsatz kommenden Legierungen auf der Basis von Zinn und Bismut haben in Verbindung mit den herkömmlichen Flußmitteln eine im Vergleich zu Zinn-Blei-Legierungen wesentlich schlechtere Benetzungseigenschaften.The tin-based alloys used here and bismuth have one in connection with conventional fluxes compared to tin-lead alloys much worse Wetting properties.

Anhand von Benetzungsversuchen mittels einer Benetzungskraftmessung wurde die Wirksamkeit der Flußmittel in Kombination mit Zinn-Bismut- Legierungen nachgewiesen Diese Versuche zur Messung der Benetzungskraft haben ergeben, daß neue halogenfreie Flußmittel, die Wasser enthalten, geeignet sind, das Problem der schlechter Benetzbarkeit zu eliminieren. Diese Flußmittel auf Wasserbasis sind nicht korrosiv und die verbleibenden Rückstände weisen eine hohe Oberflächenisolation auf. Die oxidlösende Wirkung dieser Flußmittel ist stärker, so daß die Eignung für den Wellenlötprozess gegeben ist.Using wetting tests using a wetting force measurement the effectiveness of the flux in combination with tin bismuth Alloys demonstrated These attempts to measure the Wetting power has shown that new halogen-free fluxes, the Contain water, are likely to make the problem worse Eliminate wettability. These water-based fluxes are not corrosive and the remaining residues are high  Surface insulation. The oxide dissolving effect of these fluxes is stronger, so that the suitability for the wave soldering process is given.

Die der Erfindung zugrundeliegende Aufgabe wird dadurch gelöst, daß eine Legierung aus Zinn und Bismut zum Wellenlöten benutzt wird, mit einem Anteil von mindestens 30% Bi und höchstens 60% Bi, vorzugsweise 55-60% Bi, sowie ein halogenfreies Flußmittel auf Basis organischer Säuren, das nach dem Löten nicht gereinigt werden muß. Die aktiven Bestandteile des Flußmittels sind aus der Gruppe der Carbonsäuren gewählt, vorzugsweise Dicarbonsäuren. Diese Flußmittel enthalten als Lösungsmittel Alkohol-Wasser Gemische oder sind gänzlich frei von niedrigsiedenden Alkoholen, wie z. B. Isopropanol oder Ethanol. Da diese Art Flußmittel nur einen geringen Teil an flüchtigen organischen Verbindungen enthalten, sind diese sog. VOC-freien oder VOC-armen Flußmittel besonders geeignet, Emissionen organischer Lösungsmittel zu vermeiden. Ein zusätzlicher Aspekt zum Schutze der Umwelt.The object on which the invention is based is achieved in that an alloy of tin and bismuth is used for wave soldering, with a proportion of at least 30% Bi and at most 60% Bi, preferably 55-60% Bi, and a halogen-free flux based organic acids that do not need to be cleaned after soldering. The active components of the flux are from the group of Carboxylic acids selected, preferably dicarboxylic acids. These fluxes contain alcohol-water mixtures as solvents or are wholly free of low-boiling alcohols, such as B. isopropanol or ethanol. Because this type of flux contains only a small amount of volatile organic Containing compounds, these are so-called VOC-free or low-VOC Fluxes are particularly suitable for emissions of organic solvents avoid. An additional aspect to protect the environment.

Die Benetzungskurven (Abb. 1) belegen die verbesserte Lötbarkeit, gemessen mit Kupfersubstraten bei 170°C.The wetting curves ( Fig. 1) demonstrate the improved solderability, measured with copper substrates at 170 ° C.

Herkömmliche Flußmittel zeigen in Verbindung mit Zinn-Bismut Legierungen eine vergleichsweise schlechte Lötbarkeit. (Abb. 2).Conventional fluxes show a comparatively poor solderability in connection with tin-bismuth alloys. ( Fig. 2).

Beschreibung des Prozesses (Abb. 3)Description of the process ( Fig. 3)

Mit einem Transportband (1) wird die mit elektronischen Bauteilen bestückte Leiterplatte( 2) durch die Lötmaschine (3) gefördert. Zunächst wird das Flußmittel entweder mittels Sprüh- oder Schaumauftrag (4) auf die Lötseite der Leiterplatte (2) aufgetragen. Es erfolgt anschließend eine Vortrocknung der Leiterplatte über der Vorheizung (5), wobei das Lösungsmittel verflüchtigt wird. Die Temperatur der Leiterplatte soll danach ca. 130°C betragen, damit sichergestellt ist, daß das Lösungsmittel abgetrocknet ist. Nach der Vorheizstrecke wird die Leiterplatte über die Lotwellen (6) gezogen, wobei die Unterseite der Leiterplatte (Lötseite) vollständig mit flüssigen Lot aus der Welle in Kontakt kommt. Dabei haftet das Lot an allen metallisierten Oberflächen der Leiterplatte und der Bauteile. Die metallisierten Teile sind mit Lot benetzt und die Lötstellen haben sich voll ausgebildet. Die gelötete Leiterplatte kann nach Verlassen der Lötmaschine ohne einen Reinigungsschritt weiterverarbeitet werden.With a conveyor belt (1) equipped with electronic components printed circuit board (2) is conveyed through the soldering machine (3). First, the flux is applied to the soldering side of the circuit board ( 2 ) either by spray or foam application ( 4 ). The circuit board is then predried over the preheater ( 5 ), the solvent being evaporated. The temperature of the circuit board should then be approx. 130 ° C to ensure that the solvent has dried. After the preheating section, the circuit board is drawn over the solder waves ( 6 ), the underside of the circuit board (solder side) coming completely into contact with liquid solder from the shaft. The solder adheres to all metallized surfaces of the circuit board and the components. The metallized parts are wetted with solder and the solder joints have fully developed. After leaving the soldering machine, the soldered circuit board can be processed without a cleaning step.

Claims (13)

1. Verfahren zum Wellenlöten mit einem bleifreien Lot, bei dem nachfolgend auf einen Reinigungsprozess verzichtet werden kann, dadurch gekennzeichnet, dass das bleifreie Lot einen niedrigeren Schmelzpunkt besitzt, als das übliche Zinn-Blei Lot und unter Verwendung von Flussmitteln mit no-clean Eigenschaften.1. A method for wave soldering with a lead-free solder, in which a cleaning process can subsequently be dispensed with, characterized in that the lead-free solder has a lower melting point than the conventional tin-lead solder and using fluxes with no-clean properties. 2. Verfahren zum Wellenlöten nach Anspruch 1, dadurch gekennzeichnet, dass das bleifreie Lot eine Legierung ist, die als Hauptbestandteile Zinn und Wismut enthält, mit Bi-Gehalten von 30-­ 60%, vorzugsweise von 50-60%2. A method for wave soldering according to claim 1, characterized characterized in that the lead-free solder is an alloy, which as Main contains tin and bismuth, with bi contents of 30- 60%, preferably from 50-60% 3. Verfahren zum Wellenlöten nach Anspruch 2, dadurch gekennzeichnet, dass die Legierung Zusätze von 0-4% Silber und /oder 0-4%Antimon und/oder 0-2%Indium und /oder 0-0,01% Phosphor und/oder 0-0,2% Nickel enthält.3. A method for wave soldering according to claim 2, characterized characterized that the alloy additives from 0-4% silver and / or 0-4% antimony and / or 0-2% indium and / or 0-0.01% Contains phosphorus and / or 0-0.2% nickel. 4. Verfahren zum Wellenlöten nach Anspruch 1-3, dadurch gekennzeichnet, dass ein Flußmittel verwendet wird, das nicht korrodierend wirkt und halogenfrei ist.4. A method for wave soldering according to claims 1-3, characterized characterized in that a flux is used that is not has a corrosive effect and is halogen-free. 5. Verfahren zum Wellenlöten nach Anspruch 4, dadurch gekennzeichnet, dass ein Flußmittel verwendet wird dessen Lösungsmittelanteil ein niedrigsiedender Alkohol, vorzugsweise Ethanol oder Isopropanol, ist.5. A method for wave soldering according to claim 4, characterized characterized in that a flux is used Solvent content is a low-boiling alcohol, preferably Ethanol or isopropanol. 6. Verfahren zum Wellenlöten nach Anspruch 4, dadurch gekennzeichnet, dass ein Flußmittel verwendet wird dessen Lösungsmittelanteil aus Wasser besteht.6. A method for wave soldering according to claim 4, characterized characterized in that a flux is used Solvent content consists of water. 7. Verfahren zum Wellenlöten nach Anspruch 4, dadurch gekennzeichnet, dass der Lösungsmittelanteil des Flußmittels ein Wasser-Alkohol Gemisch ist.7. A method for wave soldering according to claim 4, characterized characterized in that the solvent content of the flux There is a water-alcohol mixture. 8. Verfahren zum Wellenlöten nach Anspruch 1-5, dadurch gekennzeichnet, dass ein Flußmittel verwendet wird, dessen lötwirksame Komponenten aus der Gruppe der Carbonsäuren und/oder Dicarbonsäuren bestehen, mit oder ohne Beimengungen von natürlichen, modifizierten und synthetischen Harzen.8. A method for wave soldering according to claims 1-5, characterized characterized in that a flux is used, the soldering components from the group of carboxylic acids and / or dicarboxylic acids exist, with or without admixtures of natural, modified and synthetic resins. 9. Verfahren zum Wellenlöten nach Anspruch 6, dadurch gekennzeichnet, dass das verwendete Flussmittel Harze in Form einer Emulsion enthält.9. A method for wave soldering according to claim 6, characterized characterized that the flux used resins in the form of a Contains emulsion. 10. Verfahren zum Wellenlöten nach Anspruch 1-9, dadurch gekennzeichnet, dass der Lötprozess in normaler Luft ausgeführt wird. 10. A method for wave soldering according to claims 1-9, characterized characterized that the soldering process is carried out in normal air.   11. Verfahren zum Wellenlöten nach Anspruch 1-9, dadurch gekennzeichnet, dass der Lötprozess unter einem Schutzgas durchgeführt wird.11. A method for wave soldering according to claims 1-9, characterized characterized that the soldering process under a protective gas is carried out. 12. Verfahren zum Wellenlöten nach Anspruch 1-11, dadurch gekennzeichnet, dass der Lötprozess mit einer Einfach- oder Doppelwellenlötmaschine durchgeführt wird.12. A method for wave soldering according to claims 1-11, characterized characterized that the soldering process with a simple or Double wave soldering machine is carried out. 13. Verfahren zum Wellenlöten nach Anspruch 1-11, dadurch gekennzeichnet, dass der Lötprozess mit einer Miniwelle zum selektiven Löten von Leiterplatten durchgeführt.13. A method for wave soldering according to claims 1-11, characterized characterized that the soldering process with a mini wave to selective soldering of printed circuit boards.
DE10117404A 2001-04-06 2001-04-06 Wave soldering process used in the production of printed circuit boards comprises using a lead-free solder having a lower melting point than a usual tin-lead solder, and a fluxing agent having no-clean properties Ceased DE10117404A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE10117404A DE10117404A1 (en) 2001-04-06 2001-04-06 Wave soldering process used in the production of printed circuit boards comprises using a lead-free solder having a lower melting point than a usual tin-lead solder, and a fluxing agent having no-clean properties

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10117404A DE10117404A1 (en) 2001-04-06 2001-04-06 Wave soldering process used in the production of printed circuit boards comprises using a lead-free solder having a lower melting point than a usual tin-lead solder, and a fluxing agent having no-clean properties

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DE10117404A1 true DE10117404A1 (en) 2002-10-17

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DE10117404A Ceased DE10117404A1 (en) 2001-04-06 2001-04-06 Wave soldering process used in the production of printed circuit boards comprises using a lead-free solder having a lower melting point than a usual tin-lead solder, and a fluxing agent having no-clean properties

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102896435A (en) * 2011-07-28 2013-01-30 北京有色金属研究总院 In-suit reaction type high-temperature lead-free solder paste
CN105583547A (en) * 2016-03-11 2016-05-18 深圳市同方电子新材料有限公司 SnBi lead-free solder and preparation method thereof

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1468973A (en) * 1975-07-18 1977-03-30 Atomic Energy Authority Uk Microcircuit packages
DE4235575A1 (en) * 1992-10-22 1994-04-28 Degussa Soft solder paste for soldering electronic device under protective gas - contg synthetic hydrocarbon resin with low acid no which does not leave corrosive residue, in contrast to rosin-based solder.
DE4302996A1 (en) * 1993-02-03 1994-08-04 Sel Alcatel Ag Flux for producing residue-free soldered joints
EP0629467A1 (en) * 1993-06-16 1994-12-21 International Business Machines Corporation Lead free, tin-bismuth solder alloys
DE4338418A1 (en) * 1993-11-10 1995-05-11 Alfred Suttner Flux for soldering process
DE4415517A1 (en) * 1994-05-04 1995-11-09 Thaelmann Schwermaschbau Veb Copper@ wire cable shrouding and reinforcement with steel wires
EP0711629A1 (en) * 1994-11-08 1996-05-15 AT&T Corp. Lead-free low melting solder with improved mechanical properties and articles bonded therewith
DE19542043A1 (en) * 1995-01-31 1996-08-01 Hewlett Packard Co Lead-free, low temperature alloy and method of forming a mechanically superior joint using this alloy
WO1998048069A1 (en) * 1997-04-22 1998-10-29 Ecosolder International Pty Limited Lead-free solder
DE69409795T2 (en) * 1993-02-05 1998-12-03 Krystyna Stefanowski LOW RESIDUE, FREE OF VOLATILE ORGANIC COMPOUNDS AND NO CLEANING REQUIRED FLUID AND METHOD FOR USE THEREOF
DE69323321T2 (en) * 1992-11-19 1999-06-02 Fry Metals Inc FLUID WITHOUT DETERGENT AND ITS USE

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1468973A (en) * 1975-07-18 1977-03-30 Atomic Energy Authority Uk Microcircuit packages
DE4235575A1 (en) * 1992-10-22 1994-04-28 Degussa Soft solder paste for soldering electronic device under protective gas - contg synthetic hydrocarbon resin with low acid no which does not leave corrosive residue, in contrast to rosin-based solder.
DE69323321T2 (en) * 1992-11-19 1999-06-02 Fry Metals Inc FLUID WITHOUT DETERGENT AND ITS USE
DE4302996A1 (en) * 1993-02-03 1994-08-04 Sel Alcatel Ag Flux for producing residue-free soldered joints
DE69409795T2 (en) * 1993-02-05 1998-12-03 Krystyna Stefanowski LOW RESIDUE, FREE OF VOLATILE ORGANIC COMPOUNDS AND NO CLEANING REQUIRED FLUID AND METHOD FOR USE THEREOF
EP0629467A1 (en) * 1993-06-16 1994-12-21 International Business Machines Corporation Lead free, tin-bismuth solder alloys
DE4338418A1 (en) * 1993-11-10 1995-05-11 Alfred Suttner Flux for soldering process
DE4415517A1 (en) * 1994-05-04 1995-11-09 Thaelmann Schwermaschbau Veb Copper@ wire cable shrouding and reinforcement with steel wires
EP0711629A1 (en) * 1994-11-08 1996-05-15 AT&T Corp. Lead-free low melting solder with improved mechanical properties and articles bonded therewith
DE19542043A1 (en) * 1995-01-31 1996-08-01 Hewlett Packard Co Lead-free, low temperature alloy and method of forming a mechanically superior joint using this alloy
WO1998048069A1 (en) * 1997-04-22 1998-10-29 Ecosolder International Pty Limited Lead-free solder

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102896435A (en) * 2011-07-28 2013-01-30 北京有色金属研究总院 In-suit reaction type high-temperature lead-free solder paste
CN102896435B (en) * 2011-07-28 2015-01-21 北京有色金属研究总院 In-suit reaction type high-temperature lead-free solder paste
CN105583547A (en) * 2016-03-11 2016-05-18 深圳市同方电子新材料有限公司 SnBi lead-free solder and preparation method thereof

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