DD112145A1 - - Google Patents

Info

Publication number
DD112145A1
DD112145A1 DD17736474A DD17736474A DD112145A1 DD 112145 A1 DD112145 A1 DD 112145A1 DD 17736474 A DD17736474 A DD 17736474A DD 17736474 A DD17736474 A DD 17736474A DD 112145 A1 DD112145 A1 DD 112145A1
Authority
DD
German Democratic Republic
Application number
DD17736474A
Other versions
DD112145B1 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to DD17736474A priority Critical patent/DD112145B1/en
Publication of DD112145A1 publication Critical patent/DD112145A1/xx
Publication of DD112145B1 publication Critical patent/DD112145B1/en

Links

DD17736474A 1974-03-22 1974-03-22 METHOD AND DEVICE FOR PRODUCING WIPE-RESISTANT COATINGS ON METAL FOILS, IN PARTICULAR ON COPPER FOILS DD112145B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DD17736474A DD112145B1 (en) 1974-03-22 1974-03-22 METHOD AND DEVICE FOR PRODUCING WIPE-RESISTANT COATINGS ON METAL FOILS, IN PARTICULAR ON COPPER FOILS

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DD17736474A DD112145B1 (en) 1974-03-22 1974-03-22 METHOD AND DEVICE FOR PRODUCING WIPE-RESISTANT COATINGS ON METAL FOILS, IN PARTICULAR ON COPPER FOILS

Publications (2)

Publication Number Publication Date
DD112145A1 true DD112145A1 (en) 1975-03-20
DD112145B1 DD112145B1 (en) 1986-10-29

Family

ID=5495097

Family Applications (1)

Application Number Title Priority Date Filing Date
DD17736474A DD112145B1 (en) 1974-03-22 1974-03-22 METHOD AND DEVICE FOR PRODUCING WIPE-RESISTANT COATINGS ON METAL FOILS, IN PARTICULAR ON COPPER FOILS

Country Status (1)

Country Link
DD (1) DD112145B1 (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3012168A1 (en) * 1980-03-27 1981-10-01 Schering Ag Berlin Und Bergkamen, 1000 Berlin METHOD FOR GALVANIC DEPOSITION OF COPPER DEPOSITS
DE3307748A1 (en) * 1982-03-05 1983-09-15 Olin Corp., 62024 East Alton, Ill. METHOD FOR TREATING A METAL FILM IN ORDER TO IMPROVE YOUR ADHESION
US4532014A (en) * 1984-11-13 1985-07-30 Olin Corporation Laser alignment system
US4549950A (en) * 1984-11-13 1985-10-29 Olin Corporation Systems for producing electroplated and/or treated metal foil
US4549941A (en) * 1984-11-13 1985-10-29 Olin Corporation Electrochemical surface preparation for improving the adhesive properties of metallic surfaces
US4552627A (en) * 1984-11-13 1985-11-12 Olin Corporation Preparation for improving the adhesion properties of metal foils
US4568431A (en) * 1984-11-13 1986-02-04 Olin Corporation Process for producing electroplated and/or treated metal foil
DE3427554A1 (en) * 1984-07-26 1986-02-06 Dornier System Gmbh, 7990 Friedrichshafen Process for generating an adhesion-promoting metal film
US4692221A (en) * 1986-12-22 1987-09-08 Olin Corporation In-situ dendritic treatment of electrodeposited foil
EP0709494A3 (en) * 1994-10-06 1997-03-12 Circuit Foil Japan Method of surface-roughening treatment of copper foil
DE10357174B3 (en) * 2003-12-06 2005-02-03 Vipem Hackert Gmbh Continuous deposition of adherent coatings on e.g. smooth copper foil comprises passing foil through bath containing copper ions and applying double pulses consisting of short, steep pulse followed by longer, flatter pulse

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3012168A1 (en) * 1980-03-27 1981-10-01 Schering Ag Berlin Und Bergkamen, 1000 Berlin METHOD FOR GALVANIC DEPOSITION OF COPPER DEPOSITS
DE3307748A1 (en) * 1982-03-05 1983-09-15 Olin Corp., 62024 East Alton, Ill. METHOD FOR TREATING A METAL FILM IN ORDER TO IMPROVE YOUR ADHESION
US4468293A (en) * 1982-03-05 1984-08-28 Olin Corporation Electrochemical treatment of copper for improving its bond strength
DE3427554A1 (en) * 1984-07-26 1986-02-06 Dornier System Gmbh, 7990 Friedrichshafen Process for generating an adhesion-promoting metal film
US4532014A (en) * 1984-11-13 1985-07-30 Olin Corporation Laser alignment system
US4549950A (en) * 1984-11-13 1985-10-29 Olin Corporation Systems for producing electroplated and/or treated metal foil
US4549941A (en) * 1984-11-13 1985-10-29 Olin Corporation Electrochemical surface preparation for improving the adhesive properties of metallic surfaces
US4552627A (en) * 1984-11-13 1985-11-12 Olin Corporation Preparation for improving the adhesion properties of metal foils
US4568431A (en) * 1984-11-13 1986-02-04 Olin Corporation Process for producing electroplated and/or treated metal foil
US4692221A (en) * 1986-12-22 1987-09-08 Olin Corporation In-situ dendritic treatment of electrodeposited foil
EP0709494A3 (en) * 1994-10-06 1997-03-12 Circuit Foil Japan Method of surface-roughening treatment of copper foil
DE10357174B3 (en) * 2003-12-06 2005-02-03 Vipem Hackert Gmbh Continuous deposition of adherent coatings on e.g. smooth copper foil comprises passing foil through bath containing copper ions and applying double pulses consisting of short, steep pulse followed by longer, flatter pulse

Also Published As

Publication number Publication date
DD112145B1 (en) 1986-10-29

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