DD112145A1 - - Google Patents
Info
- Publication number
- DD112145A1 DD112145A1 DD17736474A DD17736474A DD112145A1 DD 112145 A1 DD112145 A1 DD 112145A1 DD 17736474 A DD17736474 A DD 17736474A DD 17736474 A DD17736474 A DD 17736474A DD 112145 A1 DD112145 A1 DD 112145A1
- Authority
- DD
- German Democratic Republic
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DD17736474A DD112145B1 (en) | 1974-03-22 | 1974-03-22 | METHOD AND DEVICE FOR PRODUCING WIPE-RESISTANT COATINGS ON METAL FOILS, IN PARTICULAR ON COPPER FOILS |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DD17736474A DD112145B1 (en) | 1974-03-22 | 1974-03-22 | METHOD AND DEVICE FOR PRODUCING WIPE-RESISTANT COATINGS ON METAL FOILS, IN PARTICULAR ON COPPER FOILS |
Publications (2)
Publication Number | Publication Date |
---|---|
DD112145A1 true DD112145A1 (en) | 1975-03-20 |
DD112145B1 DD112145B1 (en) | 1986-10-29 |
Family
ID=5495097
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DD17736474A DD112145B1 (en) | 1974-03-22 | 1974-03-22 | METHOD AND DEVICE FOR PRODUCING WIPE-RESISTANT COATINGS ON METAL FOILS, IN PARTICULAR ON COPPER FOILS |
Country Status (1)
Country | Link |
---|---|
DD (1) | DD112145B1 (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3012168A1 (en) * | 1980-03-27 | 1981-10-01 | Schering Ag Berlin Und Bergkamen, 1000 Berlin | METHOD FOR GALVANIC DEPOSITION OF COPPER DEPOSITS |
DE3307748A1 (en) * | 1982-03-05 | 1983-09-15 | Olin Corp., 62024 East Alton, Ill. | METHOD FOR TREATING A METAL FILM IN ORDER TO IMPROVE YOUR ADHESION |
US4532014A (en) * | 1984-11-13 | 1985-07-30 | Olin Corporation | Laser alignment system |
US4549950A (en) * | 1984-11-13 | 1985-10-29 | Olin Corporation | Systems for producing electroplated and/or treated metal foil |
US4549941A (en) * | 1984-11-13 | 1985-10-29 | Olin Corporation | Electrochemical surface preparation for improving the adhesive properties of metallic surfaces |
US4552627A (en) * | 1984-11-13 | 1985-11-12 | Olin Corporation | Preparation for improving the adhesion properties of metal foils |
US4568431A (en) * | 1984-11-13 | 1986-02-04 | Olin Corporation | Process for producing electroplated and/or treated metal foil |
DE3427554A1 (en) * | 1984-07-26 | 1986-02-06 | Dornier System Gmbh, 7990 Friedrichshafen | Process for generating an adhesion-promoting metal film |
US4692221A (en) * | 1986-12-22 | 1987-09-08 | Olin Corporation | In-situ dendritic treatment of electrodeposited foil |
EP0709494A3 (en) * | 1994-10-06 | 1997-03-12 | Circuit Foil Japan | Method of surface-roughening treatment of copper foil |
DE10357174B3 (en) * | 2003-12-06 | 2005-02-03 | Vipem Hackert Gmbh | Continuous deposition of adherent coatings on e.g. smooth copper foil comprises passing foil through bath containing copper ions and applying double pulses consisting of short, steep pulse followed by longer, flatter pulse |
-
1974
- 1974-03-22 DD DD17736474A patent/DD112145B1/en unknown
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3012168A1 (en) * | 1980-03-27 | 1981-10-01 | Schering Ag Berlin Und Bergkamen, 1000 Berlin | METHOD FOR GALVANIC DEPOSITION OF COPPER DEPOSITS |
DE3307748A1 (en) * | 1982-03-05 | 1983-09-15 | Olin Corp., 62024 East Alton, Ill. | METHOD FOR TREATING A METAL FILM IN ORDER TO IMPROVE YOUR ADHESION |
US4468293A (en) * | 1982-03-05 | 1984-08-28 | Olin Corporation | Electrochemical treatment of copper for improving its bond strength |
DE3427554A1 (en) * | 1984-07-26 | 1986-02-06 | Dornier System Gmbh, 7990 Friedrichshafen | Process for generating an adhesion-promoting metal film |
US4532014A (en) * | 1984-11-13 | 1985-07-30 | Olin Corporation | Laser alignment system |
US4549950A (en) * | 1984-11-13 | 1985-10-29 | Olin Corporation | Systems for producing electroplated and/or treated metal foil |
US4549941A (en) * | 1984-11-13 | 1985-10-29 | Olin Corporation | Electrochemical surface preparation for improving the adhesive properties of metallic surfaces |
US4552627A (en) * | 1984-11-13 | 1985-11-12 | Olin Corporation | Preparation for improving the adhesion properties of metal foils |
US4568431A (en) * | 1984-11-13 | 1986-02-04 | Olin Corporation | Process for producing electroplated and/or treated metal foil |
US4692221A (en) * | 1986-12-22 | 1987-09-08 | Olin Corporation | In-situ dendritic treatment of electrodeposited foil |
EP0709494A3 (en) * | 1994-10-06 | 1997-03-12 | Circuit Foil Japan | Method of surface-roughening treatment of copper foil |
DE10357174B3 (en) * | 2003-12-06 | 2005-02-03 | Vipem Hackert Gmbh | Continuous deposition of adherent coatings on e.g. smooth copper foil comprises passing foil through bath containing copper ions and applying double pulses consisting of short, steep pulse followed by longer, flatter pulse |
Also Published As
Publication number | Publication date |
---|---|
DD112145B1 (en) | 1986-10-29 |