CN87100186A - 在陶瓷材料上粘附金属沉积层的方法 - Google Patents
在陶瓷材料上粘附金属沉积层的方法 Download PDFInfo
- Publication number
- CN87100186A CN87100186A CN198787100186A CN87100186A CN87100186A CN 87100186 A CN87100186 A CN 87100186A CN 198787100186 A CN198787100186 A CN 198787100186A CN 87100186 A CN87100186 A CN 87100186A CN 87100186 A CN87100186 A CN 87100186A
- Authority
- CN
- China
- Prior art keywords
- salt
- ceramic
- solution
- alkali
- stupalith
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/53—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone involving the removal of at least part of the materials of the treated article, e.g. etching, drying of hardened concrete
- C04B41/5338—Etching
- C04B41/5361—Etching with molten material
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/91—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics involving the removal of part of the materials of the treated articles, e.g. etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0227—Pretreatment of the material to be coated by cleaning or etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1862—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by radiant energy
- C23C18/1865—Heat
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
- C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Structural Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemically Coating (AREA)
- Ceramic Products (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
本发明涉及一种为进行化学粘附金属镀层的陶瓷材料实施预处理的方法。其特点在于该陶瓷制品在化学金属化之前先用一种盐溶液对其进行糙化,该盐溶液的粘度用加入添加剂来提高,随后再把陶瓷制品干燥和加热。
Description
本发明涉及一种为进行化学粘附金属涂层的陶瓷材料的预处理方法。
在化学镀槽中对导电材料的金属化方法已为人们所知。这类物品的表面化须用机械或化学方法进行糙化,以使镀层具有足够的涂层粘附性。
鉴于陶瓷材料的介电性质和热传导性能,它在电子工程中的使用日益扩大,并且一般采用印刷、熔烧含金属的膏剂或用真空气相沉积法使其金属化。化学镀金属是一种非常简便的方法,但它要求基片表面预先进行糙化。由于要求凸凹不平的表面上峰谷点之间相差尽所能小,以便获得精细的导体结构,同时也有电学上的原因,因此这意味着机械糙化方法是不实用的。
化学糙化方法可适用于尽可能多的陶瓷材料,例如:氧化铝,氮化铝,氧化铍,钛酸钡,铁氧体,氮化硅,碳化硅,硅酸盐。氧化镁,氧化锆等。
例如,一种已知的氧化铝陶瓷表面糙化的方法是将其在熔融的碱金属氢氧化物中处理。当把此陶瓷制品浸在该熔体中时,其表面即被浸蚀并因此而糙化。再经适当的活化之后,通过金属晶粒的沉积进行化学粘附金属化就能够实现。
这种方法的缺点表现在:当把陶瓷制品的熔体中移出时,大量的碱金属氢氧化物被带出来损失了。此外,从外部带进的杂质或遗落的陶瓷碎粒都有把熔体污染的危险,所说的这类污染有可能使产品质量降低。
在德国专利申请3150339A1号中叙述的方法中,将氧化铝陶瓷制品浸没于碱金属氢氧化物溶液中,而后干燥并加热到该氢氧化物的熔点温度以上,这种方法被公认省去了复杂的加工循环,但缺点在于在多数情沉下留存在陶瓷表面上碱金属氢氧化物的量不足以形成足够均匀的糙化表面。
本发明的目的是提出一种可形成均匀粘附金属化的方法。此方法甚至对复杂形状的各种陶瓷材料制件都适用,并可减小能耗,且避免了由于移出制品而造成材料不必要的损失。
按照本发明,这一问题是通过这样一种方法解决的,该方法的特征在于在金属化学涂层之前,用某种盐溶液对该陶瓷制件的表面进行糙化,盐溶液的粘度通过加入一定量添加剂而被提高,然而,将制品干燥并加热。
本方法一些特殊实施方案由以下组成:
(a)随所要处理的材料不同,熔解的盐类对陶瓷制品有酸或碱反应和侵蚀作用;
(b)这种盐以浓缩状态,最好以饱和溶液的形式存在;
(c)这种盐是碱金属的硫酸氢盐或硫酸氢铵、碱金属的氟氢化物或氟化氢铵、碱金属的碳酸盐、硼砂或磷酸氢铵钠等,碱金属的氢氧化物也在本发明的范围内。
(d)为降低其熔点,溶液中还要加入某些另外的盐类;
(e)通过加入粉末状可溶性物质,最好是某些聚合物(如聚乙烯醇)或触变剂(如膨润土),使这种盐的粘度调节到粘稠触变胶或浆糊状态,或是使盐类以粉末状存在于饱和溶液中,
此时在容器的底部存有一定量固体。最好使用极性有机溶剂(如醇类)如果需要则加入一些聚合物;
(f)用这种溶液通过浸没、喷射、滤网印刷、铸膜、辊涂或离心铸的方法处理陶瓷制品;
(g)将陶瓷制品进行干燥;
(h)将陶瓷制品加热到该种盐类或盐混合物的熔点温度以上。
本发明方法的优点,超过了迄今已知的各种方法。这表现在化学糙化工艺使有可能避免使用碱金属氢氧化物熔体的复杂技术。并且,与德国专利申请3150399A1号中描述的方法相比,向表面上施用足够量的浸蚀剂。这使糙化工艺节省了能耗和化学物质。而清洗水的节约可使经济效益进一步提高。与已知的陶瓷金属化工艺相反,本方法不需要对陶瓷表面进行清洗或其他预处理。
因此,本发明的方法,实现了有特殊意义的技术改进,并且产生了极好的粘附性。因此,当把焊接在该金属镀层上的试验柱垂直拉开时,开裂一般发生在陶瓷内部。
碱性的和酸性的糙化方法都适合于氧化物陶瓷或AIN,而碱性糙化方法适合于硅酸盐、碳化硅和氮化硅,酸性糙化方法适合于钛酸钡。
使用的盐溶液最好是饱和的,也许还可以在容器底部保持有一定量的细分散固体以增大粘度。
钠盐和钾盐被推荐作为基础盐类,碱金属的碳酸盐和碱土金属的氢氧化物特别适于作粉末添加剂。当使用极性溶剂,特别当使用甲醇或乙醇时,碱金属氢氧化物本身可促使粘度的增高。酸蚀时,主要使用的是硫酸氢钠或硫酸氢铵或是氟化氢铵。硼砂或磷酸氢铵钠可能被用于具有较高热阻值的氧化物的或氮化物陶瓷。
聚乙烯醇特别适合于作聚合物增调剂,而膨润土特别适于作为触变剂。
按本发明的方法,在实际应用中,可以通过将本发明的溶液或膏剂用浸渍,喷涂,浇铸,滤网印刷,刷涂或绘涂等方式施用到待金属化的制品表面上,来实施本发明的方法。处理可以包括整个表面或仅是选择地处理要金属化的那部分。处理所持续的时间取决于该种材料的可润湿性。在浸渍的情况下,所需时间一般在10秒至2分钟之间。
随后的干燥包括加热待金属化的制品使溶剂蒸发。干燥之后,把制品加热到盐的熔点或分解点温度以上。在这方面,可以使蒸汽用作保护气体,以防止熔融的物质过早碳化并加速浸蚀过程。为方便起见,干燥和加热在一台具有适当温度没定装置的固定式炉中进行,或在一台连续式炉中,或是连续多室炉中进行。炉子的温度曲线则可视情况而定。
陶瓷表面的反应残留物可用冲洗的办法去除掉,在此方面已证明使用超声波能量是有很多优点的,特别当使用“惰性”粉末或聚乙烯醇作为添加剂时。
根据本发明处理的制品是根据在技术上已知的方法进行的,并使用普通的镀槽进行活化和化学金属化的。
金属化的陶瓷材料作为本发明的对象被应用到了电子工程中,例如,用作电子学电源差动件的基片,半导体组件陶瓷集成电路原件,陶瓷电容器,陶瓷滤波器等。此种金属化的陶瓷制品可以用焊接和低温焊接方法进行粘接。
如下的实例可以解释本发明:
例1:
将一表面具有厚度为200μm的等离子喷涂氧化铝膜的不锈钢板用氢氧化钠乙醇饱和溶液制成的膏剂涂敷,并用作为反应填充剂的细粉状氢氧化钠填充,然后在室温下干燥,并加热到350℃长达10分钟,通过铝酸钠的形成使其侵蚀。然后,该不锈钢板用水清洗,用含有钯活化剂的溶液活化并用化学铜溶液使其金属化。
沉积的金属涂层和氧化铝间的粘结比氧化铝与钢之间的粘结要好。
例2:
将氮化铝陶瓷体浸于150克氢氧化钾溶液中,在该溶液中100克水中含有1克作为添加剂的聚乙烯醇。在120℃温度下将其干燥,而后在400℃温度下加热15分钟。冷却后,用水冲洗陶瓷体,并用如例1中所述的方法进行活化和金属化。
金属镀层的剥离强度达1.5N/mm。
例3:
由100g/L硫酸氢钾和含有200g/L膨润土粉的水溶液,用辊涂工艺在95℃温度下施于用氧化锆增强的氧化铝陶瓷体上,在120℃下干燥,在280℃下加热20分钟后,在冷水中,用超声波技术处理5分钟。而后用例1叙述的方法镀金属。
金属镀层的剥离强度达2N/mm。
例4:
将钛酸钡板浸于含有20g/L聚乙烯醇的氟化氢铵饱和溶液中,并以20K/分钟的度加热到200℃,冷却后,用水进行冲洗并用常规方法使其金属化。
此金属膜的粘附强度达0.8N/mm。
例5:
在氧化铝陶瓷板的一侧,用一种由3份重量触变胶糊和1份重量的的氢氧化钠组成的混合物以滤网印刷法制成理想结构的涂膜。触变胶糊由3%的膨润土的水悬浮液组成。
瓷板继而被干燥,加热,活化,并在通常组份的化学铜镀槽中使其金属化。
此金属涂层的粘附强度达0.89N/mm。通过特殊的热处理可高达1.8N/mm。
例6:
用氢氧化钠和一种如例5中所叙述的触变剂通过加热的方法使陶瓷板糙化,然后用四价锡-二价锡的盐溶液体系进行敏化,再将瓷板在氯化钯溶液中活化,并在以镍作为还原剂的一化学镍镀槽中使其金属化。其粘附强度达1.1N/mm。
Claims (10)
1、为进行化学粘附金属涂层陶瓷材料的预处理方法,其特征在于在化学金属沉积之前,先用盐溶液对陶瓷制品表面进行糙化,所用的盐溶液的粘度靠加入一定的添加剂而使其提高的,而后将陶瓷制品干燥和加热。
2、根据权利要求1所述的方法,其特征在于取决于处理的材料,溶融盐对陶瓷材料具有酸性或碱性反应和侵蚀作用。
3、根据权利要求1所述的方法,其特征在于其中的盐是以浓缩的,最好是饱和溶液状态存在。
4、根据权利要求1所述的方法,其特征在于其中的盐为碱金属的硫酸氢盐或硫酸氢铵、碱金属的氟氢化物或氟化氩铵、碱金属的碳酸盐、硼砂酸氢铵钠。
5、根据权利要求1所述的方法,其特征在于向溶液中加入另外的盐类以降低熔点。
6、根据权利要求1所述的方法,其特征在于通过加入粉未状的或可溶性物质,最好是诸如聚乙烯醇之类的聚合物或诸如膨润土之类的触变剂,使盐溶液的粘度调节到粘稠触变物或浆糊状态,或使盐以粉末状存在于饱和溶液中,在容器的底部存在一些固体,最好使用极性有机溶剂(如醇类),如果需要的话可加入聚合物。
7、根据权利要求1所述的方法,其特征在于用这种溶液以浸没、喷涂、滤网印刷、铸膜、辊涂或离心铸膜的方法处理陶瓷制品。
8、根据权利要求1所述的方法,其特征在于干燥其陶瓷制品。
9、根据权利要求1所述的方法,其特征在于将陶瓷制品加热到高于盐或盐的混合物熔点的温度。
10、按权利要求1-9中所述方法生产的印刷电路板。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEP3601834.1 | 1986-01-20 | ||
DE19863601834 DE3601834A1 (de) | 1986-01-20 | 1986-01-20 | Verfahren zur haftfesten metallisierung von keramischen materialien |
Publications (1)
Publication Number | Publication Date |
---|---|
CN87100186A true CN87100186A (zh) | 1987-08-12 |
Family
ID=6292382
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN198787100186A Pending CN87100186A (zh) | 1986-01-20 | 1987-01-15 | 在陶瓷材料上粘附金属沉积层的方法 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0229915B1 (zh) |
JP (1) | JPH0755872B2 (zh) |
CN (1) | CN87100186A (zh) |
DE (2) | DE3601834A1 (zh) |
ES (1) | ES2020657B3 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100343189C (zh) * | 2000-04-28 | 2007-10-17 | 默克专利有限公司 | 用于无机表面的蚀刻糊 |
CN110114326A (zh) * | 2016-10-14 | 2019-08-09 | 沃思电子埃索斯有限责任两合公司 | 用于使铁氧体陶瓷金属化的方法以及具有金属化的铁氧体陶瓷的结构元件 |
CN112584627A (zh) * | 2020-12-24 | 2021-03-30 | 四会富仕电子科技股份有限公司 | 一种用石墨烯对陶瓷表面粗化的方法及覆铜板的制作方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3814224C1 (en) * | 1988-04-27 | 1989-07-13 | W.C. Heraeus Gmbh, 6450 Hanau, De | Process for pretreating aluminium nitride ceramic to be metallised |
DE10101926A1 (de) * | 2000-04-28 | 2001-10-31 | Merck Patent Gmbh | Ätzpasten für anorganische Oberflächen |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2232276C3 (de) * | 1971-08-20 | 1980-10-23 | International Business Machines Corp., Armonk, N.Y. (V.St.A.) | Verfahren zum Aktivieren von Oberflächen vor der stromlosen Metallisierung |
DE3150399A1 (de) * | 1981-12-15 | 1983-07-21 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Verfahren zur haftfesten metallisierung von keramischen materialien |
US4604299A (en) * | 1983-06-09 | 1986-08-05 | Kollmorgen Technologies Corporation | Metallization of ceramics |
DE3345353A1 (de) * | 1983-12-15 | 1985-08-29 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren und metallisierung einer keramikoberflaeche |
-
1986
- 1986-01-20 DE DE19863601834 patent/DE3601834A1/de not_active Withdrawn
- 1986-11-15 EP EP19860115906 patent/EP0229915B1/de not_active Expired - Lifetime
- 1986-11-15 DE DE8686115906T patent/DE3677177D1/de not_active Expired - Lifetime
- 1986-11-15 ES ES86115906T patent/ES2020657B3/es not_active Expired - Lifetime
-
1987
- 1987-01-15 CN CN198787100186A patent/CN87100186A/zh active Pending
- 1987-01-19 JP JP837487A patent/JPH0755872B2/ja not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100343189C (zh) * | 2000-04-28 | 2007-10-17 | 默克专利有限公司 | 用于无机表面的蚀刻糊 |
CN110114326A (zh) * | 2016-10-14 | 2019-08-09 | 沃思电子埃索斯有限责任两合公司 | 用于使铁氧体陶瓷金属化的方法以及具有金属化的铁氧体陶瓷的结构元件 |
US11236024B2 (en) | 2016-10-14 | 2022-02-01 | Würth Elektronik eiSos Gmbh & Co. KG | Method of metallizing ferrite ceramics and component comprising a metallized ferrite ceramic |
CN112584627A (zh) * | 2020-12-24 | 2021-03-30 | 四会富仕电子科技股份有限公司 | 一种用石墨烯对陶瓷表面粗化的方法及覆铜板的制作方法 |
CN112584627B (zh) * | 2020-12-24 | 2023-01-06 | 四会富仕电子科技股份有限公司 | 一种用石墨烯对陶瓷表面粗化的方法及覆铜板的制作方法 |
Also Published As
Publication number | Publication date |
---|---|
ES2020657B3 (es) | 1991-09-01 |
EP0229915A1 (de) | 1987-07-29 |
JPH0755872B2 (ja) | 1995-06-14 |
DE3601834A1 (de) | 1987-07-23 |
EP0229915B1 (de) | 1991-01-23 |
JPS62176975A (ja) | 1987-08-03 |
DE3677177D1 (de) | 1991-02-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3690921A (en) | Method for strongly adhering a metal film on ceramic substrates | |
JP6478982B2 (ja) | 基材表面を金属化するための新規の密着性促進方法 | |
US4576689A (en) | Process for electrochemical metallization of dielectrics | |
KR870001779B1 (ko) | 세라믹기질을 금속 피복하는 방법 | |
US3978252A (en) | Method of improving the adhesion between a molded resin substrate and a metal film deposited thereon | |
EP2823084B1 (en) | Method for promoting adhesion between dielectric substrates and metal layers | |
US5509557A (en) | Depositing a conductive metal onto a substrate | |
US4374876A (en) | Process for the immersion deposition of gold | |
EP0035626A1 (en) | Improved electroless plating process for glass or ceramic bodies | |
US4832988A (en) | Process for chemically metallizing an inorganic substrate | |
US4964923A (en) | Method of forming a copper film on a ceramic body | |
US4428986A (en) | Method of preparing a beryllia substrate for subsequent autocatalytic deposition of a metallized film directly thereon | |
CA1284576C (en) | Conditioner for the treatment of base materials | |
CN87100186A (zh) | 在陶瓷材料上粘附金属沉积层的方法 | |
GB2112023A (en) | Pretreating ceramics for metal coating | |
US4100312A (en) | Method of making metal-plastic laminates | |
US20050224461A1 (en) | Method for metallizing titanate-based ceramics | |
US20040154929A1 (en) | Electroless copper plating of electronic device components | |
JPH05160551A (ja) | 電子部品実装窒化アルミニウム基板の製造方法 | |
US4842899A (en) | Process for forming metallic film on inorganic material | |
JPS6345191A (ja) | セラミック基板のメタライジング方法 | |
JPS627688A (ja) | 無機材料から成る不良導電性基板の金属化法 | |
JP3554349B2 (ja) | セラミックスの金属化方法 | |
JPS61183191A (ja) | セラミツク基材の無電解メツキにおけるふくれの形成を避ける方法 | |
CN113751404A (zh) | 提升金属与AlN陶瓷结合力的前处理方式及处理后制品 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C01 | Deemed withdrawal of patent application (patent law 1993) | ||
WD01 | Invention patent application deemed withdrawn after publication |