CN86105831A - Cyanida free imitative electrogilding solution - Google Patents

Cyanida free imitative electrogilding solution Download PDF

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Publication number
CN86105831A
CN86105831A CN86105831.3A CN86105831A CN86105831A CN 86105831 A CN86105831 A CN 86105831A CN 86105831 A CN86105831 A CN 86105831A CN 86105831 A CN86105831 A CN 86105831A
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grams per
salt
per liter
electrolytic solution
per liters
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CN86105831.3A
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CN1004010B (en
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方景礼
庄瑞舫
周伯和
孙仁甫
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Nanjing University
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Nanjing University
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Priority to CN86105831.3A priority Critical patent/CN1004010B/en
Publication of CN86105831A publication Critical patent/CN86105831A/en
Publication of CN1004010B publication Critical patent/CN1004010B/en
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Abstract

A kind of non-cyanide imitating gold electroplating electrolytic solution, be mixed with cyanide-free electrolyte with mantoquita, pink salt, zinc salt, salt of wormwood, inorganic toner, organic phospho acid (or salt) and tartrate, copper powder inhibitor, low-foaming surfactant, plating bath has very high stability and good covering power and dispersive ability, environmentally safe can obtain the various imitation gold deposits of 18~22K.

Description

A kind of non-cyanide imitating gold electroplating electrolytic solution.Involved in the present invention is a kind of non-cyanide alkali aqueous solution that the cu-zn-sn ternary alloy imitation gold deposit is used of electroplating.
Usually the electrolytic solution used of gold simulating electroplating process is prussiate electrolytic solution (referring to United States Patent (USP) 4,364,804 and the clear 51-17946 of Japan's special permission).Prussiate is highly toxic product, and environmental pollution is serious, must carry out strict wastewater treatment.In recent years, make electroplate liquid with pyrophosphate salt and organic phospho acid and replace the research of prussiate to make progress to some extent, but this electroplate liquid stability is bad, the coating color and luster is relatively poor, the coating color maldistribution.
The objective of the invention is with very little organic phospho acid of toxicity (or salt) and tartrate preparation Cyanida free imitative electrogilding solution.
The present invention realizes by the electrolytic solution that adopts following composition:
Mantoquita 10-40 grams per liter
Zinc salt 5-30 grams per liter
Pink salt 5-15 grams per liter
Tartrate 10-60 grams per liter
Organic phospho acid (or salt) 80-160 grams per liter
Salt of wormwood 30-80 grams per liter
Low-foaming surfactant 0.00001 grams per liter-1 grams per liter
Inorganic toner 0.0001 grams per liter-1 grams per liter
Copper powder inhibitor 0.01 grams per liter-10 grams per liter
Processing parameter:
PH 11-14
Cathode current density 1-3 peace/decimetre 2
Sedimentation velocity 15-20 micron/hour
50 ℃-60 ℃ of temperature
In above-mentioned prescription, mantoquita is copper sulfate or copper carbonate, and zinc salt is zinc chloride or zinc sulfate.Pink salt is sodium stannate or potassium stannate.Tartrate is soluble tartrate or sodium tartrate or Seignette salt.The molecular structural formula of organic phospho acid (or salt) is:
Figure 86105831_IMG2
M=H wherein +Or Na +Or K +Or NH + 4
R=C 1-C 3Aliphatic alkyl
In this class organic phospho acid (or salt), with R=CH 3Organic phospho acid (or salt) use morely because its low price.
Low-foaming surfactant commonly used is alkyl alcohol Soxylat A 25-7 or alkyl alcohol polyoxyethylene poly-oxygen propylene aether, and its consumption is at 0.00001 grams per liter-1 grams per liter.Used inorganic toner can be the inorganic salt of nickel, cobalt, indium, silver, lead etc., and wherein the inorganic salt of lead, indium, nickel are better, and consumption is between 0.0001 grams per liter-1 grams per liter.Copper powder inhibitor is Potassium monofluoride, Sodium Fluoride or Neutral ammonium fluoride, and its consumption is at 0.01 grams per liter-10 grams per liter.Copper powder inhibitor is mainly used in generation monovalence copper when preventing anode and catholyte and forms copper powder.
The obtained effect of the present invention compared with prior art has following characteristics:
1. the electroplate liquid that replaces the preparation of hypertoxic prussiate with organic phospho acid (or salt) and tartrate, the prussic acid gas that makes electroplating process no longer include severe toxicity are separated out and cyanide wastewater is discharged, and have improved working conditions significantly and to the pollution of environment.
2. plating bath is very stable, and sediment-free is separated out in the long-term production process, does not also have copper powder and separates out, and can guarantee stably to obtain the various imitation gold deposits of 18~22K, the consisting of of imitation gold deposit: copper 72-80%; Zn12-20%; Sn6-10%.
3. plating bath has good dispersive ability and covering power, and the plating that is suitable for complicated shape also is suitable for as the very golden intermediate deposit of plating, to save the consumption of gold.
Example one
Copper carbonate 25 grams per liters
Zinc chloride 15 grams per liters
Sodium stannate 10 grams per liters
Sodium tartrate 20 grams per liters
1-hydroxy ethylidene-11-di 2 ethylhexyl phosphonic acid 120 grams per liters
Salt of wormwood 50 grams per liters
Potassium monofluoride 0.01 grams per liter
Dodecyl alcohol polyoxyethylene ether 0.5 grams per liter
Single nickel salt 0.2 grams per liter
PH 13.5
50 ℃-60 ℃ of temperature
Cathode current density 1.5 peace/decimetres 2
The electroplate liquid of above-mentioned composition can stably obtain 18K golden coating.
Example two
Copper carbonate 20 grams per liters
Zinc chloride 15 grams per liters
Sodium stannate 10 grams per liters
Seignette salt 50 grams per liters
1-hydroxyl fourth fork-11-di 2 ethylhexyl phosphonic acid 110 grams per liters
Salt of wormwood 40 grams per liters
Sodium Fluoride 0.2 grams per liter
Dodecyl alcohol polyoxyethylene polyethenoxy ether 0.5 grams per liter
Plumbic acetate 0.1 grams per liter
PH 13.5
50 ℃-60 ℃ of temperature
Cathode current density 1.5 peace/decimetres 2
The electrolytic solution of above-mentioned composition can stably obtain 20-22K golden coating.
Example three
Copper sulfate 15 grams per liters
Zinc sulfate 10 grams per liters
Potassium stannate 10 grams per liters
Soluble tartrate 40 grams per liters
1-hydroxyl propylidene-11-di 2 ethylhexyl phosphonic acid potassium (or sodium or ammonium salt) 130 grams per liters
Salt of wormwood 60 grams per liters
Neutral ammonium fluoride 1.0 grams per liters
Eight alkyl alcohol Soxylat A 25-7s, 0.5 grams per liter
Indium chloride 0.5 grams per liter
PH 13.0
50 ℃-60 ℃ of temperature
Cathode current density 1.5 peace/decimetres 2
The electrolytic solution of above-mentioned composition can stably obtain 20-22K golden coating.

Claims (6)

1, a kind of non-cyanide imitating gold electroplating electrolytic solution, with mantoquita 10~40 grams per liters, pink salt 5~15 grams per liters, zinc salt 5~30 grams per liters, salt of wormwood 30~80 grams per liters, inorganic toner 0.0001 grams per liter~1 grams per liter, and organic phospho acid (or salt) 80~160 grams per liters, electroplating technological parameter is PH=11~14,1~3 ampere/decimeter of cathode current density 2, 15~20 microns/hour of sedimentation velocities, 50 ℃~60 ℃ of temperature the invention is characterized in to add tartrate 10~60 grams per liters, low-foaming surfactant 0.00001 grams per liter~1 grams per liter, copper powder inhibitor 0.01 grams per liter~10 grams per liters are mixed with electrolytic solution.
2, according to the described electrolytic solution of claim 1, said inorganic toner is nickel, cobalt, indium, lead or silver-colored inorganic salt, and wherein the inorganic salt with lead, indium, nickel are good.
3, according to the described electrolytic solution of claim 1, the molecular structural formula of said organic phospho acid (or salt) is:
Figure 86105831_IMG1
R=C in formula 1-C 3Aliphatic alkyl
M=H +Or Na +Or K +Or NH + 4
In the organic phospho acid with R=CH 3For good.
4, according to the described electrolytic solution of claim 1, low-foaming surfactant is alkyl alcohol Soxylat A 25-7 or alkyl alcohol polyoxyethylene poly-oxygen propylene aether, and consumption is 0.00001 grams per liter-1 grams per liter.
5, according to the described electrolytic solution of claim 1, said tartrate is soluble tartrate or sodium tartrate or Seignette salt, and consumption is 10~60 grams per liters.
6, according to the described electrolytic solution of claim 1, wherein said mantoquita is copper sulfate or copper carbonate, and consumption is the 10-40 grams per liter, and pink salt is sodium stannate or potassium stannate, and consumption is the 5-15 grams per liter, and zinc salt is zinc sulfate or zinc chloride, and consumption is the 5-30 grams per liter.
CN86105831.3A 1986-07-11 1986-07-11 Cyanida free imitative electrogilding solution Expired CN1004010B (en)

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CN86105831.3A CN1004010B (en) 1986-07-11 1986-07-11 Cyanida free imitative electrogilding solution

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CN86105831.3A CN1004010B (en) 1986-07-11 1986-07-11 Cyanida free imitative electrogilding solution

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CN86105831A true CN86105831A (en) 1988-02-24
CN1004010B CN1004010B (en) 1989-04-26

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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010518260A (en) * 2007-02-14 2010-05-27 ユミコア ガルヴァノテヒニク ゲゼルシャフト ミット ベシュレンクテル ハフツング Method of depositing copper-tin electrolyte and bronze layer
CN101624714B (en) * 2009-08-18 2010-12-29 杜强 Cu-Sn-Zn plating solution containing organic addition agent and electroplating technique utilizing same
US20110174631A1 (en) * 2008-07-10 2011-07-21 Umicore Galvanotechnik Gmbh Copper-tin electrolyte and process for the deposition of bronze layers
CN101373651B (en) * 2007-08-23 2011-12-07 北京中科三环高技术股份有限公司 Surface pretreating method of wet method spray sand type neodymium iron boron permanent magnetic material
CN103789803A (en) * 2014-01-13 2014-05-14 孙松华 Cyanide-free copper-tin alloy electroplate liquid and preparation method thereof
CN103882486A (en) * 2014-03-10 2014-06-25 苏州捷德瑞精密机械有限公司 Archaistic bronze electroplating solution as well as preparation method and application thereof
CN104388988A (en) * 2014-11-13 2015-03-04 无锡伊佩克科技有限公司 Electric and heat conduction electroplating solution and preparation method thereof
CN104550938A (en) * 2015-02-04 2015-04-29 湖南师范大学 Nanometer flake-like Cu-Sn-P alloy and preparation method thereof
CN105256346A (en) * 2015-11-25 2016-01-20 武汉奥邦表面技术有限公司 Cyanide-free quaternary alloy plating solution
CN106676594A (en) * 2016-06-10 2017-05-17 太原工业学院 Low-cost cyanide-free copper-zinc-tin alloy electroplating solution and copper-zinc-tin alloy electroplating technology thereof
CN107383870A (en) * 2017-06-23 2017-11-24 苏州艾酷玛赫设备制造有限公司 A kind of manufacture method of mould
CN110592627A (en) * 2019-10-31 2019-12-20 四川轻化工大学 Cyanide-free imitation gold electroplating solution and magnesium alloy electroplating process thereof

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010518260A (en) * 2007-02-14 2010-05-27 ユミコア ガルヴァノテヒニク ゲゼルシャフト ミット ベシュレンクテル ハフツング Method of depositing copper-tin electrolyte and bronze layer
CN101373651B (en) * 2007-08-23 2011-12-07 北京中科三环高技术股份有限公司 Surface pretreating method of wet method spray sand type neodymium iron boron permanent magnetic material
US20110174631A1 (en) * 2008-07-10 2011-07-21 Umicore Galvanotechnik Gmbh Copper-tin electrolyte and process for the deposition of bronze layers
CN101624714B (en) * 2009-08-18 2010-12-29 杜强 Cu-Sn-Zn plating solution containing organic addition agent and electroplating technique utilizing same
CN103789803A (en) * 2014-01-13 2014-05-14 孙松华 Cyanide-free copper-tin alloy electroplate liquid and preparation method thereof
CN103882486A (en) * 2014-03-10 2014-06-25 苏州捷德瑞精密机械有限公司 Archaistic bronze electroplating solution as well as preparation method and application thereof
CN104388988A (en) * 2014-11-13 2015-03-04 无锡伊佩克科技有限公司 Electric and heat conduction electroplating solution and preparation method thereof
CN104550938A (en) * 2015-02-04 2015-04-29 湖南师范大学 Nanometer flake-like Cu-Sn-P alloy and preparation method thereof
CN105256346A (en) * 2015-11-25 2016-01-20 武汉奥邦表面技术有限公司 Cyanide-free quaternary alloy plating solution
CN106676594A (en) * 2016-06-10 2017-05-17 太原工业学院 Low-cost cyanide-free copper-zinc-tin alloy electroplating solution and copper-zinc-tin alloy electroplating technology thereof
CN107383870A (en) * 2017-06-23 2017-11-24 苏州艾酷玛赫设备制造有限公司 A kind of manufacture method of mould
CN110592627A (en) * 2019-10-31 2019-12-20 四川轻化工大学 Cyanide-free imitation gold electroplating solution and magnesium alloy electroplating process thereof

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