CN2925004Y - Welded body and circuit board - Google Patents
Welded body and circuit board Download PDFInfo
- Publication number
- CN2925004Y CN2925004Y CN 200620061877 CN200620061877U CN2925004Y CN 2925004 Y CN2925004 Y CN 2925004Y CN 200620061877 CN200620061877 CN 200620061877 CN 200620061877 U CN200620061877 U CN 200620061877U CN 2925004 Y CN2925004 Y CN 2925004Y
- Authority
- CN
- China
- Prior art keywords
- pit
- scolder
- mother metal
- welding
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model provides a welding body, which comprises solder and mother metal welded by the solder. Crucially, the welding face of the mother metal and the solder is provided with pit. In practical process, the pit can be poroi shape, sulciform or other shape. In addition, the utility model also discloses a corresponding circuit board. Without changing the solder and the material of the welding face, the utility model can increase area of the welding face, improve the connection intension, and allow checking welding quality rapidly.
Description
Technical field
The utility model relates to solder technology, and in particular, the utility model relates to a kind of welding body and circuit board.
Background technology
Welding is the important content of Modern Manufacturing Technology, and welding refers generally to soldering, and promptly the welding material fusing point is lower than the welding manner of connected pad material melting point.Usually material (is commonly referred to as mother metal, be generally pad or electronic devices and components pin) when connecting with soldering, generally be to assemble with joint form, keep very little gap to each other, adopt fusing point, be lower than the mother metal fusing point, be higher than under the temperature of scolder fusing point than the low-melting packing material of mother metal (being scolder), borrow solder fusing to fill up gap between mother metal, condensation then forms intermetallic compound between scolder and mother metal, thereby forms firm joint.Because it is low that welding has expense, the efficient advantages of higher is so be widely adopted industrial.
Solder side is the key component that realizes welding, when welding, intermediate mediums such as scolder by with the combining closely of solder side, certain intensity is provided, welding is achieved..The bonding strength that welding realizes mainly guarantees by the bonding strength between scolder intensity and scolder and the solder side, and the bonding strength between scolder and the solder side is except outside the Pass the material character that adopts with intermediate medium and solder side has, with solder side surface appearance and design very big relation also arranged, generally solder side is not handled in the existing welding implementation, directly use scolder to weld. as shown in Figure 1, under the constant situation of scolder and solder side material structure composition and thickness, bonding strength is only relevant with the area that joint face contacts with intermediate medium.Because existing connected mode solder side area is limited, under the situation that does not change the solder side size, be difficult to further improve bonding strength, and the quality that existing connected mode can not the quick check welding.
The utility model content
The technical problem that the utility model solves provides a kind of welding body and circuit board, to increase the solder side area under the situation that does not change scolder and solder side material, improves the intensity that connects.
For addressing the above problem, welding body of the present utility model comprises scolder and the mother metal that welds by described scolder, and crucially, the solder side of described mother metal and described scolder is provided with pit.
Wherein, described pit is poroid pit.
Alternatively, described pit is the flute profile pit.
Alternatively, described pit is the alligatoring pit.
Wherein, described mother metal can be pad or electronic devices and components pin.
Correspondingly, a kind of circuit board of the present utility model comprises welding body and the electronic devices and components and the wiring board that connect together by described welding body, and described welding body comprises scolder and the mother metal that welds by described scolder, crucially, the solder side of described mother metal and described scolder is provided with pit.
Alternatively, described pit is poroid pit.
Alternatively, described pit is the flute profile pit.
Alternatively, described pit is the alligatoring pit.
Alternatively, described mother metal is pad or electronic devices and components pin.
Compared with prior art, the utlity model has following beneficial effect:
In the utility model under the situation that does not change scolder and solder side material, by improving the design of joint face, pit is set to increase the area of joint face on the solder side of mother metal and scolder, thereby improve the intensity that connects, poroid pit can be at pit described in the preferred embodiment of the present utility model, the quality of visual or microscopical method quick check connection can be adopted by described poroid pit.
Description of drawings
Fig. 1 is the schematic diagram of prior art welding body;
Fig. 2 is the schematic diagram of the utility model welding body first embodiment;
Fig. 3 is the schematic diagram of the utility model welding body second embodiment;
Fig. 4 is the schematic diagram of a kind of circuit board of the utility model application.
Embodiment
Welding body of the present utility model comprises scolder and the mother metal that welds by described scolder, crucially, the utility model is under the situation that does not change scolder and solder side material, by improving the design of joint face, on the solder side of mother metal and scolder, pit is set, for example modes such as perforate on solder side, fluting or alligatoring form the area of pit with the increase joint face, thereby improve the intensity that connects, and describe in detail below.
With reference to figure 2, this figure is the schematic diagram of the utility model welding body first embodiment.
Increased the area of joint face in the present embodiment by perforate on solder side, promptly form poroid pit by perforate on solder side, specifically as shown in the figure, the body of welding described in the present embodiment comprises scolder and the mother metal 12 that welds together by described scolder 11 equally, in addition, as shown in the figure, have hole 13 at described mother metal 12, by described hole 13, during welding, the solder side of scolder and mother metal forms a poroid pit, thereby can continue to increase the connection area on original basis.In addition, if described hole 13 is a through hole, then can adopt the quality of visual or microscopical method inspection connection in the present embodiment by described hole 13.
With reference to figure 3, this figure is the schematic diagram of the utility model welding body second embodiment.
Increase the area of solder side in the present embodiment by fluting on solder side, promptly form the flute profile pit by fluting on solder side, specifically as shown in the figure, the body of welding described in the present embodiment comprises scolder and the mother metal 12 that welds together by described scolder 1 equally, in addition, and as shown in the figure, have groove 14 at described mother metal 12, by described groove 14, during welding, the solder side of scolder and mother metal forms a flute profile pit.
Need illustrate, in the utility model except to the solder side perforate, the fluting, can also adopt the mode that solder side is carried out alligatoring to increase the area (for example the pit of solder side of the present utility model is set to the pit of alligatoring) of joint face, thereby significantly improve bonding strength.
In addition, the welding body in the utility model specifically can be applicable in the circuit board, and with reference to figure 4, this figure is a kind of circuit board schematic diagram of using the utility model welding body.
Anticipate as shown, circuit board of the present utility model comprises welding body and the electronic devices and components 1 and wiring board 2 that connect together by described welding body weldering, described welding body comprises 11 scolders and the mother metal 12 by the welding of described scolder, and described mother metal can be welding pin on the electronic devices and components and the pad on the wiring board.With reference to above stated specification, the solder side of mother metal described in the utility model and described scolder is provided with pit, to increase the solder side area, improve bonding strength, pit described in the schematic diagram of this circuit board is an example with poroid pit, need illustrate, equally other forms of pit can be set on the described solder side during specific implementation, repeat no more here.
The above only is a preferred implementation of the present utility model; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the utility model principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection range of the present utility model.
Claims (10)
1, a kind of welding body comprises scolder and the mother metal that welds by described scolder, it is characterized in that the solder side of at least one mother metal and described scolder is provided with pit.
2, welding body according to claim 1 is characterized in that, described pit is poroid pit.
3, welding body according to claim 1 is characterized in that, described pit is the flute profile pit.
4, welding body according to claim 1 is characterized in that, described pit is the alligatoring pit.
According to each described welding body of claim 1-4, it is characterized in that 5, described mother metal is pad or electronic devices and components pin.
6, a kind of circuit board, comprise welding body and the electronic devices and components and the wiring board that connect together by described welding body, described welding body comprises scolder and the mother metal that welds by described scolder, it is characterized in that the solder side of at least one mother metal and described scolder is provided with pit.
7, circuit board according to claim 6 is characterized in that, described pit is poroid pit.
8, circuit board according to claim 6 is characterized in that, described pit is the flute profile pit.
9, circuit board according to claim 6 is characterized in that, described pit is the alligatoring pit.
According to each described circuit board of claim 6-9, it is characterized in that 10, described mother metal is pad or electronic devices and components pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620061877 CN2925004Y (en) | 2006-07-20 | 2006-07-20 | Welded body and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620061877 CN2925004Y (en) | 2006-07-20 | 2006-07-20 | Welded body and circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2925004Y true CN2925004Y (en) | 2007-07-18 |
Family
ID=38261429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620061877 Expired - Fee Related CN2925004Y (en) | 2006-07-20 | 2006-07-20 | Welded body and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2925004Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116079423A (en) * | 2023-03-10 | 2023-05-09 | 东莞市天喜电子元件有限公司 | Full-automatic contact element production line |
-
2006
- 2006-07-20 CN CN 200620061877 patent/CN2925004Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116079423A (en) * | 2023-03-10 | 2023-05-09 | 东莞市天喜电子元件有限公司 | Full-automatic contact element production line |
| CN116079423B (en) * | 2023-03-10 | 2024-01-30 | 东莞市天喜电子元件有限公司 | Full-automatic contact element production line |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101439460B (en) | Technique for processing liquid cold plate | |
| CN103152996B (en) | A kind of through hole reflux technique of close the gold-plated contact pin of distance | |
| CN104507271A (en) | Plug-in component technology and surface mount technology combination based PCBA (printed circuit board assembly) machining method and PCBA | |
| CN102142411B (en) | Chip packaging component of printed circuit board assembly (PCBA) and welding component | |
| CN101179034A (en) | Tin paste printed steel mesh opening method of pin-free flat pack type dense feet type component | |
| CN2925004Y (en) | Welded body and circuit board | |
| CN101179035A (en) | Tin paste printed steel mesh opening method of pin-free flat pack type dense-feet-free type component | |
| CN202242290U (en) | Printing steel screen with combined openings | |
| CN202364474U (en) | PCB structure for handset | |
| CN202475939U (en) | Packaging structure of board-to-board connector | |
| CN208608129U (en) | The Hermetical connecting structure of D.C. contactor | |
| CN102102861A (en) | Surface mounted light emitting diode (LED) light strip | |
| CN202043385U (en) | Modified LED welding structure | |
| CN204392693U (en) | The ultra dense pitch welded plate of a kind of high density | |
| CN205793605U (en) | A kind of printed wiring board component | |
| CN201438791U (en) | Weld assembly | |
| CN204482164U (en) | A kind of novel I C plate link | |
| CN2773945Y (en) | Fixed structure and electric connector therewith | |
| CN201239841Y (en) | Apparatus for preventing tin connection in wave soldering | |
| CN209824136U (en) | SMT component welding additional strengthening | |
| CN109996396A (en) | A kind of stable operation pad for electronic circuit board welding | |
| CN207990259U (en) | The FPC structures of LED light bar | |
| CN203590609U (en) | Steel plate structure | |
| CN206879230U (en) | A kind of pcb board is reliably connected structure with component's feet and outer lead | |
| CN211828754U (en) | Lead frame of SMB diode |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070718 Termination date: 20100720 |