CN2901582Y - Integrated circuit new surface sticking device - Google Patents
Integrated circuit new surface sticking device Download PDFInfo
- Publication number
- CN2901582Y CN2901582Y CN 200520077868 CN200520077868U CN2901582Y CN 2901582 Y CN2901582 Y CN 2901582Y CN 200520077868 CN200520077868 CN 200520077868 CN 200520077868 U CN200520077868 U CN 200520077868U CN 2901582 Y CN2901582 Y CN 2901582Y
- Authority
- CN
- China
- Prior art keywords
- integrated circuit
- feet
- utility
- terminal pin
- blasting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a novel integrated circuit surface applicator comprising a plastic packaging body and blasting fuse feet among which a short one is next to a long one. This utility model changes the extending length of the blasting fuse feet on the surface applicator, whereby in the precondition of the guarantee of the performance of the surface applicator, the number of the blasting fuse feet is increased as much as possible, the distance between blasting fuse feet is shortened, the difficulty of welding the blasting fuses is reduced, and the unexpressive effect of crystal whisker growth is lowered.
Description
Technical field:
The utility model relates to a kind of leaded surface mount device of integrated circuit.
Background technology:
At present, conventional leaded surface mount device such as QFP (LQFP, TQFP), SOIC products such as (SOP, TSOP, SSOP), its terminal pin shape and tip length are consistent, when the thin space of these leaded devices is of a size of 0.5mm (20mil) or more hour, the difficulty of its welding increases thereupon.And the unleaded product that adopts pure tin to electroplate and weld, ashbury metal on the terminal solder joint of outer lead pin can grow the filament that is called as the tin whisker, if the tin whisker of these conductions is long, may link on the All other routes, cause electric short circuit, this is that the unleaded product of pure tin is difficult to one of problem that thoroughly solves always.
Summary of the invention
It is a kind of rational in infrastructure that the purpose of this utility model is to provide, can be of a size of 0.5mm (20mil) or more hour at leaded device thin space, reduce the difficulty of welding, can slow down growth of tin crystal whisker simultaneously circuit is produced dysgenic integrated circuit surface mounting device.
Technical solution of the present utility model is:
A kind of integrated circuit novel surface mounts device, and plastic-sealed body, terminal pin are arranged, and it is characterized in that: terminal pin adopts the form that one is long and the other is short is intervally arranged.
The terminal pin spacing is not more than 0.5mm.
The utility model increases distance between the pin end by the length that changes the terminal outreach of leaded surface mount device terminal pin, can be under the prerequisite that guarantees leaded surface mount device performance, increase terminal pin quantity as far as possible, reduce the terminal pin spacing dimension, reduce the wire bonds difficulty simultaneously, alleviate the harmful effect of growth of tin crystal whisker circuit.
Description of drawings:
The utility model is described in further detail below in conjunction with drawings and Examples.
Accompanying drawing is the configuration diagram of an embodiment of the utility model.
Embodiment:
A kind of integrated circuit novel surface mounts device, and plastic-sealed body 1, terminal pin 2 are arranged, and terminal pin 2 adopts the form that one is long and the other is short is intervally arranged.Terminal pin 2 spacings are not more than 0.5mm.
Claims (2)
1, a kind of integrated circuit novel surface mounts device, and plastic-sealed body, terminal pin are arranged, and it is characterized in that: terminal pin adopts the form that one is long and the other is short is intervally arranged.
2, integrated circuit novel surface according to claim 1 mounts device, it is characterized in that: the terminal pin spacing is not more than 0.5mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200520077868 CN2901582Y (en) | 2005-11-15 | 2005-11-15 | Integrated circuit new surface sticking device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200520077868 CN2901582Y (en) | 2005-11-15 | 2005-11-15 | Integrated circuit new surface sticking device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2901582Y true CN2901582Y (en) | 2007-05-16 |
Family
ID=38085746
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200520077868 Expired - Fee Related CN2901582Y (en) | 2005-11-15 | 2005-11-15 | Integrated circuit new surface sticking device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2901582Y (en) |
-
2005
- 2005-11-15 CN CN 200520077868 patent/CN2901582Y/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070516 Termination date: 20141115 |
|
EXPY | Termination of patent right or utility model |