CN2847278Y - Heat conductivity in-site detecting probe - Google Patents
Heat conductivity in-site detecting probe Download PDFInfo
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- CN2847278Y CN2847278Y CN 200520124954 CN200520124954U CN2847278Y CN 2847278 Y CN2847278 Y CN 2847278Y CN 200520124954 CN200520124954 CN 200520124954 CN 200520124954 U CN200520124954 U CN 200520124954U CN 2847278 Y CN2847278 Y CN 2847278Y
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Abstract
The utility model relates to an original-position probe for measuring heat conductivity. One end of a cylinder gas-tight silo is fixedly provided with a heat source probe and a temperature-sensing probe in parallel, wherein the heat source probe is filled with heat conducting insulating materials in a sealed stainless steel tube and is supported by a heat source heating wire, and the heating wire is electrically connected with a heat emission circuit; the temperature-sensing probe is filled with heat conducting insulating materials in a sealed stainless steel tube and is supported by a thermosensitive resistor, and the resistor is electrically connected with a temperature receiving circuit. The middle section of the gas-tight silo is provided with a circuit board composed of the heat emission circuit, the temperature receiving circuit and a main control circuit, a USB interface of the circuit board is externally positioned at the other end of the gas-tight silo, the other end is also screwed and blocked with a protective end-sealing cover, and a battery group box is also arranged in the gas-tight silo. The error range of the heat conductivity measured by the probe is less than 2 percent, and the single measurement time is shorter than 2 minutes; the utility model has the advantages of simple structure, small size, light weight, and convenient transportation and laboratory storage, and can be communicated with an external PC conveniently.
Description
Technical field
The utility model relates to the improvement of ocean measuring instrument, specifically is a kind of thermal conductivity in-situ probe.It is the probe that the thermal conductivity of oceanic sediment is accurately measured under the original position state in seabed, and it belongs to the marine physics field of measuring technique.
Background technology
In the prior art, the thermal conductivity of oceanic sediment is an important parameter that characterizes its macroscopic property.In modern marine geothermy, by the sedimental thermal conductivity of Measuring Oceanic, and then utilize the Fourier law to determine the seabed geothermal heat flow, and it is analyzed and calculates, be the hot status information of obtaining oceanic crust, and study one of the structural evolution in seabed and important means of resource situation in view of the above.The oceanic sediment thermal conductivity in-situ instrument requires to measure sedimental thermal conductivity under the original position state in seabed, this method can reduce to the full extent to sedimental physical perturbation, and the result who obtains can reflect sedimental thermal property more accurate, more realistically.There is a kind of Lister technology to be based on the diffusivity equation of transient heat pulse in the cylindric medium of endless at present, the built-in temperature sensor more than the length 3m is arranged in requirement and the seeker of heating wire inserts in the sediment, calculates sedimental thermal conductivity by the temperature variation of temperature sensor senses behind the observation heating wire heating power.The problem that this technology exists comprises: (1) probe length is excessive, is unfavorable for safeguarding, stores and transportation; (2) Instrument Manufacturing Technique complexity, cost height are unfavorable for widespread use and popularization; (3) time of single measurement longer, surpass 5 minutes, be unfavorable for reducing marine task difficulty and the cost of surveying.
Summary of the invention
The purpose of this utility model is, overcome the above-mentioned shortcoming of prior art, and a kind of thermal conductivity in-situ probe is provided.This probe can carry out fast oceanic sediment thermal conductivity, and accurately original position is measured in real time, and its probe length is short and small, is convenient to safeguard, stores and transportation, and its manufacturing process is simple, and cost is low, is beneficial to widespread use and popularization; Single uses the time of measuring to be no more than 2 minutes, can reduce marine task difficulty and the cost of surveying.
The purpose of this utility model is realized by following technical scheme, has developed a kind of thermal conductivity in-situ probe, and it comprises gas-tight silo and probe.Hold row level with both hands at one of cylinder gas-tight silo and be installed with two probes: one is the thermal source probe, and one is the temperature-sensitive probe; Described thermal source probe, it is to be supported with the thermal source heating wire by the filling of high heat conductive insulating material in the stainless-steel tube that at one end seals, this heating wire is electrically connected in the heat emission circuit by lead; Described temperature-sensitive probe, it is to be supported with thermistor by the filling of high heat conductive insulating material in the stainless-steel tube that at one end seals, this thermistor is electrically connected in the temperature receiving circuit by lead; Be provided with by the heat emission circuit in the gas-tight silo stage casing, the circuit board that temperature receiving circuit and governor circuit are formed, the USB interface of this circuit board is by the external other end at the cylinder gas-tight silo of lead, have USB interface the sealing storehouse the other end also the screw thread shutoff tamper seal end cap is arranged; Between external USB interface and circuit board, also be provided with battery box in the gas-tight silo.
Described thermal source probe, the thermal source heating wire that it is provided with in this stainless-steel tube is at least the heating wire in two loops, and wherein the heating wire length in single loop slightly equals the length of this probe.
Described temperature-sensitive probe, its thermistor that is provided with in this stainless-steel tube is the high-sensitivity miniature bead termistor, this thermistor is positioned at the stage casing of this stainless-steel tube inner probe tube
Described governor circuit, it comprises: the microprocessor (MCU) that is connected with storer (RAM) and clock circuit (CLOCK) respectively, this microprocessor (MCU) is also connecting by A/D converter (ADC), amplifier (AMP), traffic pilot (MUX) are connected successively with attitude sensor and the attitude detection circuit formed; This microprocessor (MCU) also is electrically connected on heat emission circuit and temperature receiving circuit respectively.
Described attitude sensor, its for and be connected in acceleration transducer and obliquity sensor on the traffic pilot (MUX).
Described heat emission circuit, it comprises power source special and direct current regulation circuit and the amplifier AMP that connects successively.
Described temperature receiving circuit, it is that signal amplifier (AMP) and A/D converter (ADC) are formed by the thermometric conversion electric bridge that connects successively.
The described probe that includes gas-tight silo and two probes, it is equipped on the load-carrying metal lance, promptly is installed with a plurality of outriggers on this lance outer wall, and clamping has this probe on this support; Arrange with a plurality of these supports and probe thereof or along the equidistant axial screw of lance outer wall and to be provided with.
Advantage of the present utility model is: owing to be installed with two probes that spacing is fixed, is arranged in parallel at an end of cylinder gas-tight silo: one is the thermal source probe, and one is the temperature-sensitive probe; Described thermal source probe, it is to be supported with the thermal source heating wire by the filling of high heat conductive insulating material in the stainless-steel tube that at one end seals, this heating wire is electrically connected in the heat emission circuit by lead; Described temperature-sensitive probe, it is to be supported with thermistor by the filling of high heat conductive insulating material in the stainless-steel tube that at one end seals, this thermistor is electrically connected in the temperature receiving circuit by lead; The circuit board that temperature receiving circuit and governor circuit are formed is set by the heat emission circuit in the gas-tight silo stage casing; When inserting two probes in the sediment, by the circuit board control that heat emission circuit and governor circuit are formed the thermal source heating wire is carried out the short time heating power, thermistor writes down sedimental temperature variation by the temperature receiving circuit simultaneously, and governor circuit just can calculate sedimental thermal conductivity according to time and amplitude that the temperature maximal value occurs then.Because it is very short that the required time appears in the temperature maximal value, therefore shortened the time of finishing a thermal conductivity measurement, improved efficiency of measurement.The thermal conductivity error range of this probe measurement is little＜and 2%, short＜2 minutes of single measurement time.Because this probe structurally is divided into two parts: probe portion and gas-tight silo part, therefore, it is simple in structure, and is not high to manufacture process requirement, and volume is little, in light weight, is convenient to transportation and laboratory storage.This probe measurement purposes is many: except that being used for that the thermal conductivity of oceanic sediment is carried out the in site measurement, its single probe can also be used for the thermal conductivity of experiments of measuring chamber sample.Because the USB interface of this circuit board is by the external other end at the cylinder gas-tight silo of lead; have USB interface the sealing storehouse the other end also the screw thread shutoff tamper seal end cap is arranged; after making this probe measure in position to finish, dried uply be connected with outer computer again, make communication security convenient.
Because described governor circuit, it comprises: the microprocessor (MCU) that is connected with storer (RAM) and clock circuit (CLOCK) respectively, this microprocessor (MCU) is also connecting by A/D converter (ADC), amplifier (AMP), traffic pilot (MUX) are connected successively with attitude sensor and the attitude detection circuit formed; This microprocessor (MCU) also is electrically connected on heat emission circuit and temperature receiving circuit respectively.Described attitude sensor, its for and be connected in acceleration transducer and obliquity sensor on the traffic pilot (MUX).Because the core of governor circuit is a microprocessor (MCU), the writing time of launch time, duration and the thermistor of its control heat emission circuit, and the storage inside of control data and outside exchange etc.The foundation of wherein judging thermal source launch time and thermistor writing time is from attitude sensor.The attitude information of attitude sensor receiving transducer determines whether to be fit to the emission of thermal source and the reception of temperature.This microprocessor (MCU) is except depositing the data from the temperature receiving circuit in storer (RAM), can also be connected with outer computer (PC) by USB interface, parameters such as the main control software input pulse width by computing machine (PC), heat source strength, and finish the back data in the storer are exported on the hard disk of computing machine (PC) measuring.When this microprocessor (MCU) is confirmed to discharge thermal source by attitude sensor, connect power source special, after the heat emission circuit amplifies, discharge heat energy, and be delivered in the sediment rapidly by heating wire.Heating wire is determined by the initial input parameter-pulse width of storage in the microprocessor (MCU) conduction time.Described temperature receiving circuit, it is that signal amplifier (AMP) and A/D converter (ADC) are formed by the thermometric conversion electric bridge that connects successively.When the sediment temperature changed, the resistance of thermistor correspondingly changed, and was converted to voltage signal through thermometric conversion electric bridge, then through amplifier and A/D converter, become discernible digital signal,, be kept in the storer (RAM) through microprocessor (MCU).
Description of drawings and embodiment thereof
Embodiment of the present utility model further specifies as follows in conjunction with the accompanying drawings:
Fig. 1 is the structural representation of thermal conductivity in-situ probe.
Fig. 2 is the circuit block diagram of this probe.
Fig. 3 is used to carry the lance structural representation that this probe enters oceanic sediment.
Fig. 4 is the circuit diagram of this probe.
Referring to Fig. 1-4, probe of the present utility model structurally comprises three parts, is respectively thermal source probe 1, temperature-sensitive probe 2 and gas-tight silo 3.Hold row level with both hands at one of cylinder gas-tight silo 3 and be installed with two probes: one is temperature-sensitive probe 2 for 1, one of thermal source probe; Described thermal source probe 1 is a stainless-steel tube, end sealing, and the other end is welded on the gas-tight silo 3.This probe 1 external diameter is not more than 1mm, and length is not less than 20mm.At least two loops of a diameter less than nickel heating wire 4 formations of 0.15mm are arranged, so that after energising, send enough heats in this probe 1.The length in this single loop and probe 1 length are about equally; This heating wire 4 links to each other with the heat emission circuit 29 of circuit board 6 in the gas-tight silo 3 by lead 5.Insulating material 7 fillings by high heat conductance between this heating wire 4 and lead 5 and this probe 1 inwall are being supported, and for example a kind of 5082A/B type epoxy resin makes the heat that sends can pass to sediment fast.This heating wire 4 is electrically connected in the heat emission circuit 29 by lead 5; Described temperature-sensitive probe 2 also is the stainless-steel tube of end sealing, and the other end is welded on the gas-tight silo 3.These probe 2 external diameters are not more than 1mm, with thermal source probe 1 parallel to each other, equal in length, between the two apart from being not more than 10mm.A highly sensitive miniature bead termistor 8 is arranged in this temperature-sensitive probe 2, and as a kind of YSI31A401A type thermistor, the temperature receiving circuit 30 by the circuit board 6 in lead 9 and the gas-tight silo 3 links to each other.Described thermistor 8 is positioned at probe 2 stage casings, to weaken the influence of heat conduction edge effect.Have insulating material 10 fillings of high heat conductance supporting between this thermistor 8 and lead 9 and probe 2 inwalls, for example a kind of 5082A/B type epoxy resin makes thermistor 8 can in time sense sedimental temperature variation.
Be provided with by heat emission circuit 29 in gas-tight silo 3 stage casings, the circuit board 6 that temperature receiving circuit 30 and governor circuit 31 are formed, the usb 11 of this circuit board 6 makes probe to communicate easily by interface 11 and outer computer (PC) by the lead 16 external other ends at cylinder gas-tight silo 3.The end that gas-tight silo 3 has usb 11 has spiral cover sealing 13, and probe screws on capping 13 with protection usb 11 when idle.Gas-tight silo 3 external diameters are 15～25mm, length 100～120mm.Gas-tight silo 3 inside comprise three parts: near sound end is a right cylinder stopper 14, is used to separate probe 1,2 and gas-tight silo 3.Between external usb 11 and circuit board 6, also be provided with battery box 15 in the gas-tight silo 3.This battery box 15 is connected to circuit board 6 by lead 16, and circuit running and the required electric energy of heating wire 4 heatings are provided.
The structure of the circuit board 6 of this probe such as Fig. 2 and shown in Figure 4.It comprises three parts: governor circuit 31, heat emission circuit 29 and temperature receiving circuit 30.
Described governor circuit 31 comprises a microprocessor (MCU) 17, a storer (RAM) 18, clock circuit (CLOCK) 22 and by an A/D converter (ADC) 21, the attitude detection circuit that 27 and one groups of attitude sensors of 25, one traffic pilots of an amplifier (AMP) (MUX) 28 are formed.Annexation wherein is: the microprocessor 17 that is connected with storer 18 and clock circuit 22 respectively, this microprocessor 17 is also connecting by A/D converter 21, amplifier 25, traffic pilot 27 are connected successively with attitude sensor 28 and the attitude detection circuit formed; This microprocessor 17 also is electrically connected on heat emission circuit 29 and temperature receiving circuit 30 respectively.Wherein, microprocessor 17 adopts MC68HC908JB8 type single-chip microcomputer, and it is 8 single-chip microcomputers based on the USB technology, has a USB interface, link to each other with the usb 11 of probe, can be data and the command parameter transmission of 1.5Mbps to the maximum with outer computer.Storer 18 adopts SSF1101 type Flash storeies to can be microprocessor 17, and capacity is provided is the data storage of 4MB.Clock circuit 22 provides timing for the connection of heat emission circuit.In the attitude detection circuit, attitude sensor 28 comprises an acceleration transducer (MMA6260Q) and an obliquity sensor (SCA100T-D02), the attitude information of receiving transducer, through traffic pilot 27 (ISL43640), amplifier 25 (Ad524) and A/D converter 21 (ADS1210) are sent into microprocessor 17 after handling, to determine whether triggering heat emission circuit 29 and temperature receiving circuit 30 by microprocessor 17.
It comprises power source special and direct current regulation circuit 20 and the amplifier 24 that connects successively described heat emission circuit 29.When microprocessor 17 is confirmed to discharge thermal source by the attitude detection circuit, connect direct current regulation circuit 20, electric current amplifies after lead 5 discharges heat energy by heating wire 4, and is delivered in the sediment rapidly through amplifier 24 (Ad524).Determine by the initial input parameter of storage in the microprocessor 17 conduction time.
Described temperature receiving circuit 30 is by the thermometric conversion electric bridge 26 that connects successively, and signal amplifier (AMP) 23 and A/D converter (ADC) 19 are formed.When the sediment temperature changes, the resistance of thermistor 8 correspondingly changes, be converted to voltage signal through thermometric conversion electric bridge 26, then through signal amplifier 23 (Ad524) and A/D converter 19 (ADS1210), become discernible digital signal, in microprocessor 17, be scaled temperature value and in storer 18, store.
The described probe that includes gas-tight silo 3 and two probes 1,2, it is equipped on the metal lance 33 of bringing onto load 32, promptly is installed with a plurality of outriggers 34 on these lance 33 outer walls, and clamping has this probe 35 on this support 34; With a plurality of these supports 34 and pop one's head in 35 or arrange along the equidistant axial screw of lance outer wall and to be provided with.
When using thermal conductivity in-situ of the present utility model probe, this probe 35 is equipped on the metal lance 33 of bringing onto load 32, with the vertical distribution of the thermal conductivity of measurement sediment 36, as shown in Figure 3.During work, hang lance 33 entry with wirerope 37, make probe 35 vertical insertions in the sediment, the battery box 15 in the gas-tight silo 3 is the 4 energising several seconds of heating wire, and the heat that this heating wire 4 discharges is delivered in the sediment 36 fast; Thermistor 8 in the temperature-sensitive probe 2 is started working simultaneously.The temperature variation of sediment 36 causes that the resistance of thermistor 8 changes, and handles through temperature receiving circuit 30, is converted to temperature value in microprocessor 17, and is kept in the storer 18.The temperature variation record of sediment 36 in a period of time constitutes temperature-time curve, according to the thermal field principle of the outer medium of the instantaneous wire thermal source of endless, utilizes this temperature-time curve to calculate sedimental thermal conductivity.In addition, can also in the laboratory, measure the thermal conductivity of sediment sample with single probe 35.
Those of ordinary skill in the art can understand, and in protection domain of the present utility model, makes amendment for the foregoing description, and it all is possible adding and replacing, and it does not all exceed protection domain of the present utility model.
Claims (8)
1, a kind of thermal conductivity in-situ probe, it comprises gas-tight silo and probe, it is characterized in that: hold row level with both hands at one of cylinder gas-tight silo and be installed with two probes: one is the thermal source probe, and one is the temperature-sensitive probe; Described thermal source probe, it is to be supported with the thermal source heating wire by the filling of high heat conductive insulating material in the stainless-steel tube that at one end seals, this heating wire is electrically connected in the heat emission circuit by lead; Described temperature-sensitive probe, it is to be supported with thermistor by the filling of high heat conductive insulating material in the stainless-steel tube that at one end seals, this thermistor is electrically connected in the temperature receiving circuit by lead; Be provided with by the heat emission circuit in the gas-tight silo stage casing, the circuit board that temperature receiving circuit and governor circuit are formed, the USB interface of this circuit board is by the external other end at the cylinder gas-tight silo of lead, have USB interface the sealing storehouse the other end also the screw thread shutoff tamper seal end cap is arranged; Between external USB interface and circuit board, also be provided with battery box in the gas-tight silo.
2, according to the described thermal conductivity in-situ probe of claim 1, it is characterized in that: described thermal source probe, the thermal source heating wire that it is provided with in this stainless-steel tube is at least the heating wire in two loops, and wherein the heating wire length in single loop slightly equals the length of this probe.
3, according to the described thermal conductivity in-situ probe of claim 1, it is characterized in that: described temperature-sensitive probe, its thermistor that is provided with in this stainless-steel tube is the high-sensitivity miniature bead termistor, and this thermistor is positioned at the stage casing of this stainless-steel tube inner probe tube
4, according to the described thermal conductivity in-situ probe of claim 1, it is characterized in that: described governor circuit, it comprises: the microprocessor (MCU) that is connected with storer (RAM) and clock circuit (CLOCK) respectively, this microprocessor (MCU) is also connecting by A/D converter (ADC), amplifier (AMP), traffic pilot (MUX) are connected successively with attitude sensor and the attitude detection circuit formed; This microprocessor (MCU) also is electrically connected on heat emission circuit and temperature receiving circuit respectively.
5, according to the described thermal conductivity in-situ of claim 4 probe, it is characterized in that: described attitude sensor, its for and be connected in acceleration transducer and obliquity sensor on the traffic pilot (MUX).
6, according to claim 1 or 4 described thermal conductivity in-situ probes, it is characterized in that: described heat emission circuit, it comprises power source special and direct current regulation circuit and the amplifier AMP that connects successively.
7, according to claim 1 or 4 described thermal conductivity in-situ probes, it is characterized in that: described temperature receiving circuit, it is that signal amplifier (AMP) and A/D converter (ADC) are formed by the thermometric conversion electric bridge that connects successively.
8, according to each described thermal conductivity in-situ probe of claim 1-7, it is characterized in that: the described probe that includes gas-tight silo and two probes, it is equipped on the load-carrying metal lance, promptly is installed with a plurality of outriggers on this lance outer wall, and clamping has this probe on this support; Arrange with a plurality of these supports and probe thereof or along the equidistant axial screw of lance outer wall and to be provided with.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520124954 CN2847278Y (en) | 2005-11-21 | 2005-11-21 | Heat conductivity in-site detecting probe |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520124954 CN2847278Y (en) | 2005-11-21 | 2005-11-21 | Heat conductivity in-site detecting probe |
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| CN2847278Y true CN2847278Y (en) | 2006-12-13 |
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| CN 200520124954 Expired - Fee Related CN2847278Y (en) | 2005-11-21 | 2005-11-21 | Heat conductivity in-site detecting probe |
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101852752A (en) * | 2010-06-10 | 2010-10-06 | 上海理工大学 | Device and method for measuring heat conductivity of poor heat conductive materials |
| CN102141528A (en) * | 2010-02-01 | 2011-08-03 | 陈怀峰 | In-situ soil layer heat conduction coefficient measuring apparatus |
| CN103713011A (en) * | 2013-11-25 | 2014-04-09 | 中国农业大学 | Double-probe heat-pulse thermal-property measure apparatus capable of realizing spacing in-field self correcting and method |
| CN103913481A (en) * | 2014-03-05 | 2014-07-09 | 中国农业大学 | Thermal pulse sap flow or water flux density measuring apparatus capable of correcting space and measuring method |
| CN104062692A (en) * | 2014-07-08 | 2014-09-24 | 广州海洋地质调查局 | High-precision seabed terrestrial heat flow detection device |
| CN104062691A (en) * | 2014-07-08 | 2014-09-24 | 广东工业大学 | High-precision seabed geothermal gradient detection device |
| CN104458797A (en) * | 2014-11-04 | 2015-03-25 | 大连理工大学 | In-situ test device of high-pressure and low-temperature heat conductivity coefficients and heat transfer coefficients |
| CN104713904A (en) * | 2015-03-30 | 2015-06-17 | 中国科学院南海海洋研究所 | Calculating method and detection device of seafloor in-situ thermal conductivity |
| WO2016192390A1 (en) * | 2015-06-03 | 2016-12-08 | 中国科学院南海海洋研究所 | Subsea heat flow long-term observation probe based on underwater robot platform |
| CN109997032A (en) * | 2016-11-29 | 2019-07-09 | 英弘精机株式会社 | Pyroconductivity measurement device, pyroconductivity measuring method and vacuum degree assess device |
| CN111044558A (en) * | 2018-10-12 | 2020-04-21 | 天津大学 | High-temperature probe and preparation method and application thereof |
| CN111122649A (en) * | 2020-01-07 | 2020-05-08 | 吉林大学 | Waterproof wireless type in-situ soil layer thermophysical property parameter measuring device |
| CN112179943A (en) * | 2019-07-02 | 2021-01-05 | 天津大学 | Probe for measuring heat conductivity coefficient and preparation method thereof |
| CN114199935A (en) * | 2021-12-28 | 2022-03-18 | 浙江大学 | Method and device for measuring heat conductivity coefficient of marine sediment |
| CN114608724A (en) * | 2022-05-10 | 2022-06-10 | 杭州大祉机电有限公司 | Shallow sea real-time geothermal temperature gradient measuring device |
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2005
- 2005-11-21 CN CN 200520124954 patent/CN2847278Y/en not_active Expired - Fee Related
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102141528A (en) * | 2010-02-01 | 2011-08-03 | 陈怀峰 | In-situ soil layer heat conduction coefficient measuring apparatus |
| CN102141528B (en) * | 2010-02-01 | 2012-12-26 | 陈怀峰 | In-situ soil layer heat conduction coefficient measuring apparatus |
| CN101852752A (en) * | 2010-06-10 | 2010-10-06 | 上海理工大学 | Device and method for measuring heat conductivity of poor heat conductive materials |
| CN103713011A (en) * | 2013-11-25 | 2014-04-09 | 中国农业大学 | Double-probe heat-pulse thermal-property measure apparatus capable of realizing spacing in-field self correcting and method |
| CN103913481A (en) * | 2014-03-05 | 2014-07-09 | 中国农业大学 | Thermal pulse sap flow or water flux density measuring apparatus capable of correcting space and measuring method |
| CN104062692A (en) * | 2014-07-08 | 2014-09-24 | 广州海洋地质调查局 | High-precision seabed terrestrial heat flow detection device |
| CN104062691A (en) * | 2014-07-08 | 2014-09-24 | 广东工业大学 | High-precision seabed geothermal gradient detection device |
| CN104062692B (en) * | 2014-07-08 | 2017-02-15 | 广州海洋地质调查局 | High-precision seabed terrestrial heat flow detection device |
| CN104458797A (en) * | 2014-11-04 | 2015-03-25 | 大连理工大学 | In-situ test device of high-pressure and low-temperature heat conductivity coefficients and heat transfer coefficients |
| DE112015002036B4 (en) | 2015-03-30 | 2019-06-27 | South China Sea Institute Of Oceanology, Chinese Academy Of Sciences | Method for the in-situ measurement of the thermal conductivity of seabed sediments |
| CN104713904A (en) * | 2015-03-30 | 2015-06-17 | 中国科学院南海海洋研究所 | Calculating method and detection device of seafloor in-situ thermal conductivity |
| WO2016155383A1 (en) * | 2015-03-30 | 2016-10-06 | 中国科学院南海海洋研究所 | Calculation method for seafloor in-situ thermal conductivity and detection device using same |
| WO2016192390A1 (en) * | 2015-06-03 | 2016-12-08 | 中国科学院南海海洋研究所 | Subsea heat flow long-term observation probe based on underwater robot platform |
| CN109997032A (en) * | 2016-11-29 | 2019-07-09 | 英弘精机株式会社 | Pyroconductivity measurement device, pyroconductivity measuring method and vacuum degree assess device |
| CN111044558A (en) * | 2018-10-12 | 2020-04-21 | 天津大学 | High-temperature probe and preparation method and application thereof |
| CN111044558B (en) * | 2018-10-12 | 2020-09-29 | 天津大学 | High-temperature probe and preparation method and application thereof |
| CN112179943A (en) * | 2019-07-02 | 2021-01-05 | 天津大学 | Probe for measuring heat conductivity coefficient and preparation method thereof |
| CN112179943B (en) * | 2019-07-02 | 2021-12-21 | 天津大学 | Probe for measuring heat conductivity coefficient and preparation method thereof |
| CN111122649A (en) * | 2020-01-07 | 2020-05-08 | 吉林大学 | Waterproof wireless type in-situ soil layer thermophysical property parameter measuring device |
| CN114199935A (en) * | 2021-12-28 | 2022-03-18 | 浙江大学 | Method and device for measuring heat conductivity coefficient of marine sediment |
| CN114199935B (en) * | 2021-12-28 | 2024-02-09 | 浙江大学 | Ocean sediment heat conductivity coefficient measuring method and device |
| CN114608724A (en) * | 2022-05-10 | 2022-06-10 | 杭州大祉机电有限公司 | Shallow sea real-time geothermal temperature gradient measuring device |
| CN114608724B (en) * | 2022-05-10 | 2022-08-05 | 杭州大祉机电有限公司 | Shallow sea real-time geothermal temperature gradient measuring device |
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