CN2842747Y - 发光二极管引线架 - Google Patents
发光二极管引线架 Download PDFInfo
- Publication number
- CN2842747Y CN2842747Y CNU2005201290582U CN200520129058U CN2842747Y CN 2842747 Y CN2842747 Y CN 2842747Y CN U2005201290582 U CNU2005201290582 U CN U2005201290582U CN 200520129058 U CN200520129058 U CN 200520129058U CN 2842747 Y CN2842747 Y CN 2842747Y
- Authority
- CN
- China
- Prior art keywords
- bowl
- base material
- substrate
- shape base
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 claims abstract description 35
- 239000002184 metal Substances 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims description 33
- 230000004308 accommodation Effects 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 22
- 230000000694 effects Effects 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 238000000465 moulding Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Led Device Packages (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2005201290582U CN2842747Y (zh) | 2005-11-07 | 2005-11-07 | 发光二极管引线架 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2005201290582U CN2842747Y (zh) | 2005-11-07 | 2005-11-07 | 发光二极管引线架 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2842747Y true CN2842747Y (zh) | 2006-11-29 |
Family
ID=37446618
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2005201290582U Expired - Fee Related CN2842747Y (zh) | 2005-11-07 | 2005-11-07 | 发光二极管引线架 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2842747Y (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008106847A1 (en) * | 2007-03-08 | 2008-09-12 | He Shan Lide Electronic Enterprise Company Ltd. | Heat dissipating structure of led |
KR200452842Y1 (ko) * | 2007-03-08 | 2011-03-25 | 허 샨 라이드 일렉트로닉 엔터프라이즈 컴퍼니 엘티디. | 고출력 엘이디 |
-
2005
- 2005-11-07 CN CNU2005201290582U patent/CN2842747Y/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008106847A1 (en) * | 2007-03-08 | 2008-09-12 | He Shan Lide Electronic Enterprise Company Ltd. | Heat dissipating structure of led |
KR200452842Y1 (ko) * | 2007-03-08 | 2011-03-25 | 허 샨 라이드 일렉트로닉 엔터프라이즈 컴퍼니 엘티디. | 고출력 엘이디 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: CHEN YONGHUA Free format text: FORMER OWNER: TATO PRECISION INDUSTRIAL CO., LTD. Effective date: 20100122 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20100122 Address after: Postcode of Taiwan County, Taipei, china: Patentee after: Chen Yonghua Address before: Postcode of Taipei County, Taiwan province: Patentee before: Daduo Precision Ind Co., Ltd. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20061129 Termination date: 20111107 |