CN2831714Y - Modular mains assembly - Google Patents

Modular mains assembly Download PDF

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Publication number
CN2831714Y
CN2831714Y CN 200520064295 CN200520064295U CN2831714Y CN 2831714 Y CN2831714 Y CN 2831714Y CN 200520064295 CN200520064295 CN 200520064295 CN 200520064295 U CN200520064295 U CN 200520064295U CN 2831714 Y CN2831714 Y CN 2831714Y
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CN
China
Prior art keywords
heat
printed circuit
radiating substrate
power source
modular power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN 200520064295
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Chinese (zh)
Inventor
朱崇才
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Astec Power Supply Shenzhen Co Ltd
Original Assignee
Emerson Network Power Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Emerson Network Power Co Ltd filed Critical Emerson Network Power Co Ltd
Priority to CN 200520064295 priority Critical patent/CN2831714Y/en
Application granted granted Critical
Publication of CN2831714Y publication Critical patent/CN2831714Y/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model relates to a modular power supply assembly and comprises a printed circuit plate assembly, a heat radiation base plate and a heat conduction insulation rubber pad, wherein the printed circuit plate assembly is connected with the heat radiation base plate through a plastic connecting component. The plastic connecting component is provided with upper and lower clamping grooves and first and second positioning bosses, the assembly rim of the heat radiation base plate is provided with a counter hole and the assembly rim of the printed circuit plate assembly is provided with a groove. The printed circuit plate assembly and the heat radiation base plate are respectively inserted in the upper and lower clamping grooves. The first positioning boss is inserted in the counter hole, and the second positioning boss is clamped in the groove. One surface of the heat radiation base plate facing the printed circuit plate assembly is provided with a step surface, and the position of the step surface is corresponding to the position of a device needing the heat radiation on the printed circuit plate assembly. The heat conduction insulation rubber pad is arranged between the step surface and the device needing the heat radiation. The modular power supply assembly has the advantages of more simple and reliable structure, low cost and convenient use compared with the proposal of the prior art.

Description

A kind of modular power source assembly
Technical field
The utility model relates to electronic equipment power source, more particularly, relates to a kind of modular power source assembly that has heat-radiating substrate.
Background technology
At present, brick shape (Brick) modular power source has been extensive use of the version of the plug-in radiator base plate of printed circuit-board assembly (PCBA) veneer (Single Board), and this structure can solve high thermal device heat dissipation problem effectively, improves the power density of module.In the higher application scenario of ambient temperature, modular power source also needs attached heat sinks to improve heat-sinking capability.This just needs to solve the reliable connectivity problem of modular power source PCBA veneer and radiator installation base plate, so that the user can select suitable radiator to be installed on the PCBA veneer according to concrete applied environment.
The part that structurally also comes with some shortcomings that is connected of PCBA veneer and plug-in heat-radiating substrate in the brick shape modular power source of prior art.For example, the structure of a kind of brick shape modular power source shown in Figure 1A since the tie-beam of bindiny mechanism 401 be arranged on PCBA veneer 101 above, contact pin 103 passes the through hole on the tie-beam, tie-beam covers the assembling limit of PCBA veneer.In addition, for the bigger pcb board of thickness, the thickness of pcb board itself has certain margin of tolerance, and the fixed size of bindiny mechanism 401 relevant positions, the PCBA veneer of installing may rock in groove.For addressing this problem, prior art adopts the structure shown in Figure 1B, between need radiating element 141 and heat-radiating substrate 301, add cushion block 202,, realize compressing between PCBA veneer 101 and the heat-radiating substrate 301 by all adopting heat conductive insulating rubber cushion 201 on the cushion block two sides.According to above description, this brick shape modular power source complex structure of prior art as can be known, plastic cement connector Material Cost height; Assembling is complicated, the assembly cost height; And it is big that structural member takies the cloth board space, is unfavorable for PCB design fabric swatch.
The utility model content
The technical problems to be solved in the utility model is, said structure complexity, cost at prior art be higher, take the bigger defective of cloth board space, a kind of power module assembly is provided, and it can effectively solve the reliable connectivity problem between modular power source PCBA veneer and the radiator installation base plate (abbreviation heat-radiating substrate).
In addition, the structure at adding cushion block between complicated pcb board of manufacturing process and the heat-radiating substrate also provides a kind of power module assembly, and it can solve need radiating element on the PCBA veneer and the heat conduction problem between the heat-radiating substrate, improves heat-sinking capability.
The technical scheme that its technical problem that solves the utility model adopts is: construct a kind of modular power source assembly, comprise printed circuit-board assembly, heat-radiating substrate and heat conductive insulating rubber cushion, described heat-radiating substrate and described printed circuit-board assembly link together by bindiny mechanism, and described heat conductive insulating rubber cushion is arranged between printed circuit-board assembly and the heat-radiating substrate; Described bindiny mechanism comprises the plastic cement connector that has upper and lower draw-in groove, the width of described upper and lower draw-in groove is complementary with the thickness on printed circuit-board assembly and heat-radiating substrate assembling limit respectively, and printed circuit-board assembly and heat-radiating substrate are inserted in respectively in the described upper and lower draw-in groove; Described bindiny mechanism also comprises and is used for positioner that described heat-radiating substrate, described printed circuit-board assembly are positioned.
As preferably, in the modular power source assembly described in the utility model, described plastic cement connector is that  shape is rectangular, comprises beam portion and end, the assembling edge lengths of the length of beam portion and printed circuit-board assembly and heat-radiating substrate is complementary, and described upper and lower draw-in groove is arranged on the inboard, end; Described plastic cement connector is arranged on two relative assembling limits of printed circuit-board assembly and heat-radiating substrate, and the end on assembling limit is inserted in the described draw-in groove.
As preferably, in the modular power source assembly described in the utility model, the location counterbore of the corresponding position on the assembling limit that described positioner comprises first positioning boss that is arranged on described plastic cement connector beam portion, be arranged on described heat-radiating substrate, described first positioning boss is inserted in the counterbore of described location.
As preferably, in the modular power source assembly described in the utility model, described positioner also comprises second positioning boss in the last draw-in groove that is arranged on described plastic cement connector end, is arranged on the detent at the two ends, assembling limit of described printed circuit-board assembly, and described second positioning boss is stuck in the described detent.
As preferably, in the modular power source assembly described in the utility model, first positioning boss of described plastic cement connector beam portion is two.
As preferably, in the modular power source assembly described in the utility model, described heat-radiating substrate is provided with at least one step surface towards the one side of printed circuit-board assembly; Need the position of radiating element corresponding on the position of described step surface and the printed circuit-board assembly, described heat conductive insulating rubber cushion is arranged on step surface and needs between the radiating element, the height of described step surface, describedly needs radiating element to protrude printed substrate to be complementary towards the height of heat-radiating substrate one side and the thickness sum of described heat conductive insulating rubber cushion and the height of described Riveted screw pole bottom.
As preferably, in the modular power source assembly described in the utility model, the another side of described heat-radiating substrate is the plane.
As preferably, in the modular power source assembly described in the utility model, the two ends on the assembling limit of described printed circuit board (PCB) and heat-radiating substrate are equipped with rectangular indentation, detent on the described printed circuit board (PCB) is located at the long limit of described rectangular indentation, the width of the length of described rectangular indentation and plastic cement connector end is suitable, and the width of described rectangular indentation and the bottom land of upper and lower draw-in groove are suitable to the thickness in the outside, end.
As preferably, in the modular power source assembly described in the utility model, be provided with a step between the assembling limit of described heat-radiating substrate and the outerplanar side of heat-radiating substrate, the thickness of the height of described step and plastic cement connector beam portion is suitable.
Implement modular power source of the present utility model, has following beneficial effect: adopt locating groove+locator card platform mode to be connected between plastic cement connector and PCBA plate and the heat-radiating substrate, by the elastic compression of heat conduction rubber cushion, can effectively prevent to get loose between pcb board and heating panel, connect reliable.Adopt the plastic cement connector to connect, and PCB only needs open sulculus on four angles, be convenient to the design of product safety and can effectively reduce syndeton taking PCB cloth board space.Employing elasticity clamps, easy installation and removal.
Description of drawings
The utility model is described in further detail below in conjunction with drawings and Examples, in the accompanying drawing:
Figure 1A is the structural representation of a kind of modular power source assembly of prior art;
Figure 1B is the right view of structure of the modular power source assembly of prior art shown in Figure 1A;
Fig. 2 A is the structural representation of the utility model embodiment modular power source assembly;
Fig. 2 B is the left view of Fig. 2 A;
Fig. 2 C is the vertical view of Fig. 2 A;
Fig. 3 A is the schematic diagram of plastic cement connector in the utility model embodiment modular power source assembly;
Fig. 3 B be among Fig. 3 A the plastic cement connector along the cutaway view of B-B;
Fig. 3 C is the perspective view of plastic cement connector in the utility model embodiment modular power source assembly;
Fig. 4 A is the perspective view of heat-radiating substrate in the utility model embodiment modular power source assembly;
Fig. 4 B is the schematic diagram of heat-radiating substrate in the utility model embodiment modular power source assembly;
Fig. 4 C be among Fig. 4 B heat-radiating substrate along the cutaway view of A-A.
Embodiment
The utility model provides a kind of new modular power source PCBA veneer and the syndeton form of plug-in radiator base plate, and more simple and reliable with prior art scheme structure compared, cost is low, and it is convenient to use.
Shown in Fig. 2 A, the utility model embodiment modular power source assembly comprises printed circuit-board assembly (PCBA) veneer 10, heat-radiating substrate 30 and heat conductive insulating rubber cushion 20, heat conductive insulating rubber cushion 20 is arranged between PCBA veneer 10 and the heat-radiating substrate 30, and wherein PCBA veneer 10 links together by plastic cement connector 40 with heat-radiating substrate 30.
Fig. 2 B is the left view of Fig. 2 A, and Fig. 2 C is the vertical view of Fig. 2 A, and this two width of cloth figure has clearly illustrated the assembly structure of the utility model embodiment modular power source assembly, will describe in detail in conjunction with the accompanying drawing of back.
Elder generation describes the structure of the plastic cement connector in the bindiny mechanism of the modular power source assembly of the utility model embodiment.Fig. 3 A to Fig. 3 C has shown the structure of plastic cement connector 40 from different perspectives.As shown in Figure 3A, plastic cement connector 40 is  shape, comprises beam portion 41 and end 45.Beam portion 41 is provided with first positioning boss 43.45 inboards, end are provided with draw-in groove 47, lower bayonet slot 48.Shown in Fig. 3 B and 3C, also be provided with second positioning boss 42 on the last draw-in groove 47.
Secondly the structure to heat-radiating substrate 30 in the utility model embodiment modular power source assembly describes.Fig. 4 A to Fig. 4 C has shown the structure of heat-radiating substrate 30 from different perspectives.Shown in Fig. 4 A to 4C, heat-radiating substrate 30 one sides are designed to the plane, can install radiator in addition additional and strengthen heat-sinking capability, and be designed to the different step surface 36 of height, upward need the differing heights of radiating element 14 and the thickness of heat conduction rubber cushion 20 to adapt to PCBA with PCBA veneer faying face.Can see also that from figure heat-radiating substrate 30 is provided with two assembling limits 38, respectively is provided with two counterbores 33 on it.
Get back to Fig. 2 C, as shown in the figure, PCBA veneer 10 has two assembling limits 17, the assembling limit 17 termination (being on four angles of PCBA 10) respectively be provided with a groove 12 (seeing the part of analysing and observe in the upper right corner), the shape of the shape of groove 12 and second positioning boss 42 is complementary, for example, both can be semicircular.
In design, assembling limit 38 length of the assembling limit 17 of the length of plastic cement connector 40 beam portions 41 and printed circuit-board assembly and heat-radiating substrate are complementary; The thickness of the width of last draw-in groove 47 and PCBA veneer 10 is complementary, and the thickness on the assembling limit 38 of the width of lower bayonet slot 48 and heat-radiating substrate 30 is complementary; The undersized of first positioning boss 43 in or equal the size of counterbore 33.The undersized of second positioning boss 42 in or equal the size of detent 12.
During assembling, plastic cement connector 40 connects on two relative assembling limits of PCBA veneer 10 and heat-radiating substrate 30; Insert respectively in the upper and lower draw-in groove 47,48 of plastic cement connector 40 at the two ends on the assembling limit 17,38 of PCBA veneer 10 and heat-radiating substrate 30, and first positioning boss 43 inserts in the counterbore 33, with heat-radiating substrate 30 location; Second positioning boss 42 snaps in the detent 12, and the PCBA veneer is located.The modular power source assembly that assembles is shown in Fig. 2 B and Fig. 2 C.
Also can be designed to the assembling limit 38 of heat-radiating substrate 30 step-like, a rectangle small gap is respectively opened at the two ends on assembling limit 38, correspondingly a rectangle small gap is also respectively opened at the two ends on PCBA veneer assembling limit, detent is located in this small gap, like this, behind fit on plastic cement connector 40, plastic cement connector 40 beam portions 41 bottom surfaces are concordant substantially with the lateral surface of heat-radiating substrate 30, and the outside of end 45 is concordant substantially with other two limits of PCBA veneer 10 and heat-radiating substrate 30.The outline of modular power source assembly integral body sees it is a rectangle from PCBA veneer 10 (or from heat-radiating substrate 30) one side, shown in Fig. 2 C.
In illustrated embodiment of the present utility model, the positioning boss 43 of plastic cement connector 40 beam portions 41 is two, and the counterbore 33 on the heat-radiating substrate 30 also is two.In the practical application, also can use one or three, also can play positioning action, and counterbore 33 also can be substituted by through hole.In addition, also can adopt the plastic cement connector with upper and lower draw-in groove of other shape and structure, as angle shape glue connector with upper and lower draw-in groove, be arranged on four angles of PCBA veneer and heat-radiating substrate, the contact-making surface of bottom side and heat-radiating substrate is provided with alignment pin (or positioning table) in the contact-making surface of top side and PCBA, the lower bayonet slot in last draw-in groove, establish through hole or counterbore on PCBA veneer and the heat-radiating substrate, also the PCBA veneer can be located, is connected with heat-radiating substrate.Again for example, the plastic cement connector of said structure does not adopt the angle type and is made into straight type, can be linked and packed by a plurality of points on each bar limit of PCBA veneer and heat-radiating substrate.
In addition, for better heat radiating effect is arranged, main heater members on heat-radiating substrate 30 and the PCBA 10 should have excellent contact, between thermal resistance as far as possible little, main heater members (promptly needing radiating element 14) and heat-radiating substrate 30 middle employing thermal conductive insulation glue heat conduction as power tube, transformer, inductance etc.The utility model modular power source assembly needs the position of radiating element 14 corresponding in design on the position of step surface 36 and the PCBA 10.And the design gaps of assurance radiating element 14 and heat-radiating substrate 30 step surfaces 36, heat conduction are filled with insulating heat-conductive rubber cushion 20 in the gap, that is to say that the height of step surface 36 will be complementary with the height of need radiating element 14 and the thickness of heat conductive insulating rubber cushion 20.

Claims (9)

1, a kind of modular power source assembly, comprise printed circuit-board assembly, heat-radiating substrate and heat conductive insulating rubber cushion, described heat-radiating substrate and described printed circuit-board assembly link together by bindiny mechanism, and described heat conductive insulating rubber cushion is arranged between printed circuit-board assembly and the heat-radiating substrate; Described bindiny mechanism comprises the plastic cement connector that has upper and lower draw-in groove, the width of described upper and lower draw-in groove is complementary with the thickness on printed circuit-board assembly and heat-radiating substrate assembling limit respectively, and printed circuit-board assembly and heat-radiating substrate are inserted in respectively in the described upper and lower draw-in groove; It is characterized in that described bindiny mechanism also comprises and is used for positioner that described heat-radiating substrate, described printed circuit-board assembly are positioned.
2, modular power source assembly according to claim 1, it is characterized in that described plastic cement connector is that  shape is rectangular, comprises beam portion and end, the assembling edge lengths of the length of beam portion and printed circuit-board assembly and heat-radiating substrate is complementary, and described upper and lower draw-in groove is arranged on the inboard, end; Described plastic cement connector is arranged on two relative assembling limits of printed circuit-board assembly and heat-radiating substrate, and the end on assembling limit is inserted in the described draw-in groove.
3, modular power source assembly according to claim 2, it is characterized in that, the location counterbore of the corresponding position on the assembling limit that described positioner comprises first positioning boss that is arranged on described plastic cement connector beam portion, be arranged on described heat-radiating substrate, described first positioning boss is inserted in the counterbore of described location.
4, modular power source assembly according to claim 3, it is characterized in that, described positioner also comprises second positioning boss in the last draw-in groove that is arranged on described plastic cement connector end, is arranged on the detent at the two ends, assembling limit of described printed circuit-board assembly, and described second positioning boss is stuck in the described detent.
5, modular power source assembly according to claim 3 is characterized in that, first positioning boss of described plastic cement connector beam portion is two.
6, according to each described modular power source assembly in the claim 1 to 5, it is characterized in that described heat-radiating substrate is provided with at least one step surface towards the one side of printed circuit-board assembly; Need the position of radiating element corresponding on the position of described step surface and the printed circuit-board assembly, described heat conductive insulating rubber cushion is arranged on step surface and needs between the radiating element, the height of described step surface, describedly needs radiating element to protrude printed substrate to be complementary towards the height of heat-radiating substrate one side and the thickness sum of described heat conductive insulating rubber cushion and the height of described Riveted screw pole bottom.
7, modular power source assembly according to claim 6 is characterized in that, the another side of described heat-radiating substrate is the plane.
8, modular power source assembly according to claim 7, it is characterized in that, the two ends on the assembling limit of described printed circuit board (PCB) and heat-radiating substrate are equipped with rectangular indentation, detent on the described printed circuit board (PCB) is located at the long limit of described rectangular indentation, the width of the length of described rectangular indentation and plastic cement connector end is suitable, and the width of described rectangular indentation and the bottom land of upper and lower draw-in groove are suitable to the thickness in the outside, end.
9, modular power source assembly according to claim 8 is characterized in that, is provided with a step between the assembling limit of described heat-radiating substrate and the outerplanar side of heat-radiating substrate, and the thickness of the height of described step and plastic cement connector beam portion is suitable.
CN 200520064295 2005-09-06 2005-09-06 Modular mains assembly Expired - Lifetime CN2831714Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200520064295 CN2831714Y (en) 2005-09-06 2005-09-06 Modular mains assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200520064295 CN2831714Y (en) 2005-09-06 2005-09-06 Modular mains assembly

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Publication Number Publication Date
CN2831714Y true CN2831714Y (en) 2006-10-25

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104284559A (en) * 2013-07-12 2015-01-14 Tdk株式会社 Power supply device and manufacturing method thereof
CN109104814A (en) * 2018-08-27 2018-12-28 陈赵军 Stepped groove wiring board
US11122714B2 (en) 2018-10-17 2021-09-14 Delta Electronics, Inc. Power module having metallic heat-dissipation substrate

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104284559A (en) * 2013-07-12 2015-01-14 Tdk株式会社 Power supply device and manufacturing method thereof
CN104284559B (en) * 2013-07-12 2017-09-22 Tdk株式会社 The manufacture method of supply unit and supply unit
CN109104814A (en) * 2018-08-27 2018-12-28 陈赵军 Stepped groove wiring board
US11122714B2 (en) 2018-10-17 2021-09-14 Delta Electronics, Inc. Power module having metallic heat-dissipation substrate
US11622475B2 (en) 2018-10-17 2023-04-04 Delta Electronics, Inc. Power module having metallic heat-dissipation substrate

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: POWER SUPPLY PRODUCTS (SHENZHEN) CO., LTD.

Free format text: FORMER OWNER: AIMOSHENG NETWORK ENERGY SOURCE CO LTD

Effective date: 20140904

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: 518057 SHENZHEN, GUANGDONG PROVINCE TO: 518101 SHENZHEN, GUANGDONG PROVINCE

TR01 Transfer of patent right

Effective date of registration: 20140904

Address after: 518101 Guangdong city of Shenzhen province Baoan District Xin'an road two North 68 Street office Honglang District Industrial Park plant

Patentee after: Astec power supply (Shenzhen) Co., Ltd.

Address before: 518057 Nanshan District science and Technology Industrial Park, Guangdong, Shenzhen Branch Road, No.

Patentee before: Aimosheng Network Energy Source Co., Ltd.

CX01 Expiry of patent term

Expiration termination date: 20150906

Granted publication date: 20061025

EXPY Termination of patent right or utility model