CN2809880Y - Mid-power LED - Google Patents
Mid-power LED Download PDFInfo
- Publication number
- CN2809880Y CN2809880Y CNU2005200116733U CN200520011673U CN2809880Y CN 2809880 Y CN2809880 Y CN 2809880Y CN U2005200116733 U CNU2005200116733 U CN U2005200116733U CN 200520011673 U CN200520011673 U CN 200520011673U CN 2809880 Y CN2809880 Y CN 2809880Y
- Authority
- CN
- China
- Prior art keywords
- cathode terminal
- frame
- terminal rack
- rack
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model provides a medium power LED, which comprises a transparent epoxide resin sealant for encapsulating an LED chip, a cathode terminal rack, an anode terminal rack, a leading wire and a metal leading wire rack, wherein the transparent epoxide resin sealant is used for encapsulating an LED chip; the cathode terminal rack is provided with a light reflecting cup; the anode terminal rack is corresponding to the cathode terminal rack; the leading wire is used for connecting the chip, the cathode terminal rack and the anode terminal rack; the metal leading wire rack is connected to the cathode terminal rack and the anode terminal rack. The utility model is characterized in that the cathode terminal rack and the anode terminal rack are respectively the cathode terminal rack of enlarged surface area and the anode terminal rack of enlarged surface area. The utility model which continues to use the exterior shape of the existing LED light-emitting body can not bring inconvenience to use. The utility model has favorable heat radiation effect and prolongs service life.
Description
Technical field
The utility model relates in a kind of power led, particularly lead frame special in power led.
Background technology
The basic structure of LED be one can be luminous chip, place on the leaded framework, use epoxy sealing around then, play inside chip and the support bracket fastened effect protected.So the anti-seismic performance of LED is good, be widely used in traffic indication, instrument and meter, general lighting, information demonstration and light of stage etc., its appearance progressively replaces incandescent source, compare with incandescent source, LED has many good qualities: LED uses low-tension supply, consumed energy is low with the incandescent lamp of light efficiency, luminous good stability, long service life.But, than high-power LED certain defective is arranged when dispelling the heat, as shown in Figure 1, but its interior cathode terminal frame, anode tap frame of existing LED also plays certain thermolysis can not get good solution, it is little with contacting of reflector, the stem of the two poles of the earth bar is also very tiny, simultaneously, space in the reflector is narrow and small, be unfavorable for distributing or transmitting of heat, this all is to cause the bad reason of high-power LED heat radiation, has influenced the useful life of LED, people have also been influenced more, the interior use of wider scope to LED.
Summary of the invention
In order to solve the deficiency of above-mentioned technology, the purpose of this utility model provide a kind of improved special frames in power led, the chip of luminescent tube of middle power can access good heat radiation in special tank bracket, improve light efficiency, increases the service life.
In order to achieve the above object, the following technical scheme that the utility model adopts: power led in a kind of, comprise the transparent epoxy resin sealing of packaging LED chips, the cathode terminal frame that has reflector, with the corresponding anode tap frame of this cathode rod, the lead-in wire that connects described chip and yin, yang two extreme framves, and be connected metal lead frame on cathode terminal hack lever and the anode tap hack lever, wherein, described cathode terminal hack lever and anode tap hack lever are respectively cathode terminal hack lever and the anode tap hack lever that adds high surface area.
The utility model has been continued to use the external shape of existing light-emitting diode, can not make troubles to use, has better heat radiating effect, has prolonged useful life, has reached energy-conservation economical good result, has good economic benefits and social benefit.
Description of drawings
Fig. 1 is the structure chart of existing LED;
Fig. 2 is a structure chart of the present utility model.
Embodiment
With reference to the accompanying drawings, and in conjunction with the embodiments, the utility model is done detailed description and explanation.
As shown in Figure 1, existing LED light-emitting diode, one transparent epoxy resin 1 is arranged, two appropriate positions of its inside are provided with a cathode terminal frame 2 and an anode tap frame 3, connect the lead-in wire 212 of yin, yang two extreme framves, have a taper reflector 21 on cathode terminal frame 2, positioned inside in glow cup has led chip 211, stretch out the outside, bottom of transparent sealing sealing 1, and with cathode terminal frame 2, what anode tap frame 3 connected is metal lead frame 4.
As shown in Figure 2, power led in a kind of, comprise the transparent epoxy resin sealing 1 of packaging LED chips 211, the cathode terminal frame 2 that has reflector 21,212 be connected corresponding anode tap frame 3 by going between with this cathode terminal frame, and be connected on cathode terminal hack lever and the anode tap frame and be in the metal copper material lead frame 4 of transparent sealing outer end, wherein, described reflector 21 is " bowl " shape, inner face is concavity, and its space is increased, and the lead end bottom of described anode tap frame 3 and cathode terminal frame 2 is the rectangular strip that adds high surface area, and draw described transparent epoxy resin glue outside, and to the outstanding boss that forms in both sides, be connected to metal copper material lead frame 4, increased the volume and the surface area of anode tap frame 3 and cathode terminal frame 2 in described boss lower end, help the derivation of heat, described boss is beneficial to distributing of heat.
The utility model has been continued to use the external shape of existing light-emitting diode, can not make troubles to use, has better heat radiating effect, prolonged useful life, reached energy-conservation economical good result, particularly, have good economic benefits and social benefit for the relatively large led chip of power.
Claims (3)
1, power led in a kind of, comprise the transparent epoxy resin sealing of packaging LED chips, the cathode terminal frame that has reflector, with the corresponding anode tap frame of this cathode terminal frame, the lead-in wire that connects described chip and yin, yang two extreme framves, and be connected metal lead frame on cathode terminal frame and the anode tap frame, it is characterized in that described cathode terminal frame and anode tap frame are respectively cathode terminal frame and the anode tap frame that adds high surface area.
2, power led in according to claim 1, the lead end bottom that it is characterized in that the extreme frame of described yin, yang is the rectangular strip that adds high surface area, and draw the outside of described transparent sealing, and, be connected to metal lead frame in described boss lower end to the outstanding boss that forms in both sides.
3, power led in described according to any one claim of claim 1 to 2, it is characterized in that described reflector is a bowl-type, and should " bowl " inner surface for can increase the concave surface in space.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2005200116733U CN2809880Y (en) | 2005-04-07 | 2005-04-07 | Mid-power LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2005200116733U CN2809880Y (en) | 2005-04-07 | 2005-04-07 | Mid-power LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2809880Y true CN2809880Y (en) | 2006-08-23 |
Family
ID=36926064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2005200116733U Expired - Fee Related CN2809880Y (en) | 2005-04-07 | 2005-04-07 | Mid-power LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2809880Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010102511A1 (en) * | 2009-03-10 | 2010-09-16 | 上海威廉照明电气有限公司 | Vertical structure type led |
| WO2011091569A1 (en) * | 2010-01-29 | 2011-08-04 | Cree Huizhou Opto Limited | Wide angle oval light emitting diode package |
| US11210971B2 (en) | 2009-07-06 | 2021-12-28 | Cree Huizhou Solid State Lighting Company Limited | Light emitting diode display with tilted peak emission pattern |
-
2005
- 2005-04-07 CN CNU2005200116733U patent/CN2809880Y/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010102511A1 (en) * | 2009-03-10 | 2010-09-16 | 上海威廉照明电气有限公司 | Vertical structure type led |
| US11210971B2 (en) | 2009-07-06 | 2021-12-28 | Cree Huizhou Solid State Lighting Company Limited | Light emitting diode display with tilted peak emission pattern |
| WO2011091569A1 (en) * | 2010-01-29 | 2011-08-04 | Cree Huizhou Opto Limited | Wide angle oval light emitting diode package |
| CN102169947A (en) * | 2010-01-29 | 2011-08-31 | 惠州科锐光电有限公司 | Wide angle oval light emitting diode package |
| US8350370B2 (en) | 2010-01-29 | 2013-01-08 | Cree Huizhou Opto Limited | Wide angle oval light emitting diode package |
| CN102169947B (en) * | 2010-01-29 | 2016-06-01 | 惠州科锐光电有限公司 | Wide angle oval light emitting diode package |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |