CN2773933Y - Electronic elements - Google Patents
Electronic elements Download PDFInfo
- Publication number
- CN2773933Y CN2773933Y CN 200520056173 CN200520056173U CN2773933Y CN 2773933 Y CN2773933 Y CN 2773933Y CN 200520056173 CN200520056173 CN 200520056173 CN 200520056173 U CN200520056173 U CN 200520056173U CN 2773933 Y CN2773933 Y CN 2773933Y
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- CN
- China
- Prior art keywords
- electronic component
- liquid metal
- metallic object
- insulating body
- metallic
- Prior art date
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- Expired - Lifetime
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Abstract
The utility model provides an electronic component including insulating body and at least one conductive body contained in the insulating body. The conductive body includes liquid metal with the low-impedance. Both ends of the liquid metal connect with the metallic body. The utility model conductive body of the electronic component includes the liquid metal with the low-impedance comparing with the prior art, which can greatly reduce the impedance of the conductive body and promote signal transmission.
Description
[technical field]
The utility model relates to a kind of electronic component.
[background technology]
Include insulating body and at least one electric conductor that is contained in the insulating body the electronic component (as electric connector) at present, this electric conductor is generally the metal sheet punching out and forms, but this metal sheet impedance is higher, particularly when electric conductor when docking the electronic component Mechanical Contact, the contact position has higher impedance usually, in addition, under a lot of situations in order to guarantee electric conductor elasticity preferably, electric conductor must be bent, can increase the length of electric conductor like this, thereby the impedance of electric conductor is increased.
Therefore, be necessary to design a kind of new-type electronic component, to overcome above-mentioned defective.
[utility model content]
The purpose of this utility model is to provide a kind of tool more low-impedance electronic component.
In order to reach above-mentioned creation purpose, the utility model electronic component, it comprises insulating body and at least one electric conductor that is contained in the insulating body, and this electric conductor includes low-impedance liquid metal, and the liquid metal two ends are connected with metallic object; In addition, the utility model electronic component also can be following structure: comprise first metallic object and second metallic object, first metallic object has a host cavity, second metallic object is arranged in host cavity and forms a spatial accommodation with first metallic object, be provided with liquid metal in this spatial accommodation, this liquid metal connects two metallic objects respectively.
Compared with prior art, the utility model electronic component connects two metallic objects with liquid metal as conductor, thereby can show the impedance that reduces between the metallic object, promotes the signal transmission.
[description of drawings]
Fig. 1 is the decomposing schematic representation of the utility model electronic component and chip module, circuit board;
Fig. 2 is the cutaway view of electronic component shown in Figure 1;
Fig. 3 is the front view of electronic component shown in Figure 1;
Fig. 4 is the vertical view of electronic component shown in Figure 1;
Fig. 5 is the upward view of electronic component shown in Figure 1;
Fig. 6 is the combined front view of electronic component shown in Figure 1 and chip module, circuit board;
Fig. 7 is the front view of the another kind of electronic component of the utility model;
Fig. 8 is the vertical view of electronic component shown in Figure 7;
Fig. 9 is the cutaway view of the third electronic component of the utility model;
Figure 10 is the cutaway view of the 4th kind of electronic component of the utility model.
Figure 11 is the cutaway view of the 5th kind in the utility model electronic component.
Figure 12 is the 6th kind of embodiment of the utility model electronic component.
[embodiment]
Below in conjunction with the drawings and specific embodiments the utility model electronic component is described further.
Extremely shown in Figure 6 as Fig. 1, electronic component is electric connector 1 (also can be other electron components such as circuit board certainly) in the present embodiment, be used for connecting butt joint electronic component 2 (being chip module in the present embodiment) and circuit board 3, it comprises that insulating body 11 and at least one are contained in the electric conductor in the insulating body 11, this electric conductor includes low-impedance liquid metal 12 and (is mercury in the present embodiment, certainly also can be other low-impedance liquid metal), liquid metal 12 two ends are connected with metallic object 13.
This insulating body 11 comprises interfix two-layer up and down 14,15, and two-layer up and down insulating body forms accommodation hole 16 jointly.These accommodation hole 16 volumes are a bit larger tham liquid metal 12 volumes, can flow toward the gap when making liquid metal 12 pressurizeds; Accommodation hole 16 two ends have smaller opening 17, and two openings 17 are equipped with outside chamfering 18, two opening parts up and down at accommodation hole 16 respectively are provided with a movable and curved metallic object 13, its two end portions is arranged in accommodation hole 16, mid portion then protrudes in the surface of insulating body 11, can contact with circuit board 3 and chip module 2 respectively (welding manner or the compression way of contact), thereby make circuit board 3 plates and chip module 2 reach electric connection (as shown in Figure 6).In addition, these insulating body 11 upper and lower surfaces are equipped with location structure, and this location structure is respectively positioning frame body 19 and reference column 20 in upper and lower surface, but these positioning frame body 19 frames are lived chip module 2 peripheries to be located, and this reference column 20 can insert in the corresponding perforations on the circuit board 3 (not drawing among the figure) and be located.
Certainly the utility model electronic component also can be used for connecting two circuit boards, and this moment, insulating body 11 upper and lower surfaces were equipped with reference column, inserts respectively in the hole of corresponding circuits plate (as Fig. 7, shown in Figure 8).
With reference to Fig. 9, be the 3rd embodiment of the utility model electronic component.In the present embodiment, insulating body 11 is as a whole, which is provided with accommodation hole 16, the upper shed of accommodation hole 16 is less, and under shed is bigger, opening part is provided with mobilizable first metallic object 13 ' thereon, and first metallic object 13 ' is provided with a projection, can give prominence to insulating body 11 and contact with the butt joint electronic component.Its lower opening is installed with second metallic object, 13, the second metallic objects 13 and does not stretch out insulating body 11, can weld together mutually with the butt joint electronic component.Liquid metal 12 is positioned at the spatial accommodation that accommodation hole 16 and first metallic object 13 ', second metallic object 13 form, and spatial accommodation is greater than the volume of liquid metal 12.
Referring to Figure 10, be the 4th embodiment of the utility model electronic component.It is equally big that the accommodation hole 16 of insulating body 11 can be set to upper and lower opening, it all is installed with metallic object 13 in two ends up and down, metallic object 13 does not stretch out insulating body, and an end metallic object is offered an accepting hole 130, the upper and lower surface that runs through metallic object 13, terminal 4 for butt joint electronic component 2 inserts, and also can reach same effect.
See also Figure 11 again, be the 5th embodiment of the utility model electronic component.In the present embodiment, this insulating body 11 comprises interfix two-layer up and down 14,15, and two-layer up and down insulating body forms accommodation hole 16 jointly, and these accommodation hole 16 volumes are a bit larger tham liquid metal 12 volumes, can flow toward the gap when making liquid metal 12 pressurizeds; Accommodation hole 16 two ends have smaller opening 17, be provided with two metallic objects 13 respectively at smaller opening 17 places, this metallic object 13 comprises a main part 131 and a protuberance 132, wherein two main parts 131 are oppositely arranged, the centre is provided with elastomer 5 (for example elastomer of spring or other form), connect two main parts 131 respectively, liquid metal 12 is contained in this accommodation hole 16 and two metallic object main parts, the 131 formed spaces, to realize connecting of two metallic objects 13, protuberance 132 then can contact with the butt joint electronic component respectively, to realize electrically conducting of two butt joint electronic components.
The foregoing description also can be embodied as following mode, referring to Figure 12, electronic component (being probe in the present embodiment) comprises first metallic object and second metallic object, wherein first metallic object 13 ' can have a host cavity, second metallic object 13 is contained in first metallic object, 13 ' the formed host cavity versatilely, liquid metal 12 is positioned at two metallic objects 13, the 13 ' spatial accommodation that forms, and in addition, is connected with elastomer 5 between two metallic objects 13,13 '.
In sum,, thereby can significantly reduce the impedance of electric conductor, promote the signal transmission because the electric conductor of the utility model electronic component is provided with low-impedance liquid metal.
Claims (10)
1. electronic component, it comprises insulating body and at least one electric conductor that is contained in the insulating body, and it is characterized in that: this electric conductor includes low-impedance liquid metal, and the liquid metal two ends are connected with metallic object.
2. electronic component as claimed in claim 1 is characterized in that: this insulating body is provided with at least one volume and is a bit larger tham the accommodation hole that liquid metal volume and two ends have smaller opening, and liquid metal and metallic object all are contained in the accommodation hole.
3. electronic component as claimed in claim 1 is characterized in that: be connected with elastomer between two metallic objects.
4. electronic component as claimed in claim 1, it is characterized in that: this insulating body is provided with at least one volume and is a bit larger tham the accommodation hole that liquid metal volume and at least one end have smaller opening, the other end of accommodation hole is provided with metallic object, and liquid metal and another metallic object all are contained in the accommodation hole.
5. as the described electronic component of claim 1 to 4, it is characterized in that: this liquid metal is a mercury.
6. electronic component as claimed in claim 5 is characterized in that: this electronic component is an electric connector.
7. electronic component, it comprises first metallic object and second metallic object, first metallic object has a host cavity, second metallic object is arranged in host cavity and forms a spatial accommodation with first metallic object, it is characterized in that: be provided with liquid metal in this spatial accommodation, this liquid metal connects two metallic objects respectively.
8. electronic component as claimed in claim 7 is characterized in that: be connected with elastomer between two metallic objects.
9. as claim 7 or 8 described electronic components, it is characterized in that: this liquid metal is a mercury.
10. electronic component as claimed in claim 9 is characterized in that: this electronic component is a probe.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200520056173 CN2773933Y (en) | 2005-03-18 | 2005-03-18 | Electronic elements |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200520056173 CN2773933Y (en) | 2005-03-18 | 2005-03-18 | Electronic elements |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2773933Y true CN2773933Y (en) | 2006-04-19 |
Family
ID=36709196
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200520056173 Expired - Lifetime CN2773933Y (en) | 2005-03-18 | 2005-03-18 | Electronic elements |
Country Status (1)
Country | Link |
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CN (1) | CN2773933Y (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103682726A (en) * | 2013-09-27 | 2014-03-26 | 番禺得意精密电子工业有限公司 | Elastic conductor and electric connector, and preparation methods thereof |
CN105990299A (en) * | 2015-02-06 | 2016-10-05 | 展讯通信(上海)有限公司 | BGA (Ball Grid Array) packaging structure and preparation method thereof |
-
2005
- 2005-03-18 CN CN 200520056173 patent/CN2773933Y/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103682726A (en) * | 2013-09-27 | 2014-03-26 | 番禺得意精密电子工业有限公司 | Elastic conductor and electric connector, and preparation methods thereof |
CN103682726B (en) * | 2013-09-27 | 2015-11-18 | 番禺得意精密电子工业有限公司 | Elastic electric conductor, electric connector and manufacture method thereof |
CN105990299A (en) * | 2015-02-06 | 2016-10-05 | 展讯通信(上海)有限公司 | BGA (Ball Grid Array) packaging structure and preparation method thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CX01 | Expiry of patent term |
Expiration termination date: 20150318 Granted publication date: 20060419 |