CN2773567Y

CN2773567Y - Soft refrigerating assembly structure

Info

Publication number: CN2773567Y
Application number: CN 200520050264
Authority: CN
Inventors: 林昌亮
Original assignee: Individual
Current assignee: Individual
Priority date: 2005-02-04
Filing date: 2005-02-04
Publication date: 2006-04-19
Anticipated expiration: 2015-02-04

Abstract

The utility model discloses a soft refrigerating assembly structure which comprises a first soft insulating basal layer, a second soft insulating basal layer, circuit layers and a plurality of P-type semiconductors and N type semiconductors which are matched between the two soft insulating basal layers and arranged mutually at intervals, wherein each of the circuit layers is respectively arranged on the corresponding surface between the two soft insulating basal layers and corresponds to the interfaces on the upper and the lower ends of the P-type and the N-type semiconductors to form the contact connection, and the P-type semiconductors and N-type semiconductors which are limited between the two soft insulating basal layers are made to be interconnected and conducted to form a loop. When the predetermined current is applied, the temperature difference is generated between the upper and the lower soft insulating basal layers, and the utility model can be used for heating or refrigerating. Especially, the utility model has the function of adapting to be pasted on the uneven surface of an object by the upper and the lower soft insulating basal layers, and the defect that the rigid insulating basal layers of the traditional refrigerating assembly can not adapt to be used for the uneven surface of the object can be just improved.

Description

Soft refrigerating assembly structure

Technical field:

The utility model relates to a kind of soft refrigerating assembly structure.

Background technology:

Cooling chip (Thermoelectric Cooling Module) has another name called peltier effect refrigerator, Peltier monomer, also has person to be heat pump.The theoretical foundation of cooling chip was promptly found by scientist as far back as 19 beginnings of the century, wherein, general refrigerating assembly is the Peltier effect (or claiming the thermoelectric cooling effect) that utilizes Frenchman Jean Charles AthansePeltier to be found, it is with electric current during by two kinds of circuit that different conductor connected, and the temperature of its contact can descend; In other words, when DC current during by two kinds of different metal materials, can produce the phenomenon of heat absorption and heat release, metal interface and electric current flow into this Electro-Thermal Circuit forward the time, promptly produce the effect (cooling) of absorbing heat, otherwise, then produce the effect (heating) of heat release.And refrigerating assembly remove have that volume is little, noiselessness and do not have the characteristics such as restriction of service orientation (stand upside down or edge-on), more because need not to use cold coal, so do not have environmental protection public hazards and the high advantage of the temperature controlled degree of accuracy, so be widely used in the heat radiation cooling of (as: central processing unit, laser light head) in the easy electronic building brick that generates heat of electronics implements at present, or need refrigeration or pyrogenicity implements (as: cold/heat begin to drink machine) etc., need high efficiency and high accurancy and precision heat exchange, and in the limited electric equipment products of usable floor area.

As shown in Figure 1, structure for general existing refrigerating assembly 1, it is made up of thermoelectric couple, and described thermoelectric couple cooperates circuit layer (13,14) layout therebetween to be formed by connecting by a P type and N-type semiconductor (11,12), when turn-on power, this N-type semiconductor 12 has subzero temperature difference electromotive force because of unnecessary electronics is arranged, otherwise, P-type semiconductor 11 makes it have the electromotive force of the positive temperature difference because of having unnecessary electric hole; When electronics when N-type semiconductor 12 interfaces are passed at P-type semiconductor 11 interfaces, the temperature of node can reduce, in other words, its energy must increase, and the energy that it increased is equivalent to the energy that node consumes; Otherwise when passing through P-type semiconductor 11 interfaces as if electronics by N-type semiconductor 12 interfaces, junction temperature will raise.When thermoelectric couple connects a direct current power supply, the joint will produce the transfer of the temperature difference and heat, be that refrigeration face 15 (top substrate layer TopLayer Baseboard) will produce heat-absorbing action, and radiating surface 16 (following laminar substrate Bottom Layer Baseboard) will heat release.Therefore, be to be connected with general conductor assembly to form a complete line between above-mentioned P type and the N-type semiconductor (11,12), when applying a scheduled current, this each P type and N-type semiconductor (11,12) crystal grain can produce Peltier effect, again by an insulating materials, be generally pottery, the substrate of making is encapsulated P type and N-type semiconductor (11,12); And can utilize when switching on, the temperature difference that causes upper and lower laminar substrate to produce, the demand of looking are applied on the product of required heating or refrigeration.

Described just as leading portion, general existing refrigerating assembly, it nearly all is the material that is used as insulating with hard pottery in order to coat the substrate of P type or N-type semiconductor (11,12), for example content is 96% aluminium oxide (Al ₂O ₃) pottery; Therefore described ceramic material is as the interface of substrate institute sintering formation, its wood property is quite hard and crisp, be shaped and assembling adds and is easy to generate embrittlement man-hour, and extremely be difficult for the processed bending arc shape body surface that is attached to, significantly limited to the changeability of this refrigerating assembly in the utilization aspect, development condition still exists too big restricted.

The utility model content:

Technical problem to be solved in the utility model is: at the deficiencies in the prior art, a kind of basic unit of making upper and lower insulator interface with soft insulating materials is provided, make described soft insulated substrate, have to adapt to and comply with the effect that is affixed on the non-planar surface object and uses, to improve the soft refrigerating assembly structure that the soft insulated substrate of traditional hard can't effectively be applied in the disappearance of non-planar surface object.

In order to solve the problems of the technologies described above, the technical scheme that the utility model adopted is: a kind of soft refrigerating assembly structure, include: two circuit layers and a plurality of N-type semiconductor and P-type semiconductor, also comprise the first soft insulated substrate and the second soft insulated substrate, described two circuit layers are arranged in the relative inner face of two soft insulated substrate respectively, and described a plurality of N-type semiconductors and P-type semiconductor are connected between the obverse circuit layer of two-phase to hand over spaced mode setting.

Described soft insulated substrate is made with the soft material of a tool thermal conductivity and electrical insulating property.Described soft insulated substrate adopts a soft conductor material layer, is capped with insulating barrier to form on the surface of its positioned opposite circuit layer at least.

Compared with prior art, the utility model has the advantages that: by upper and lower two soft insulated substrate, be to have to adapt to the function of using according to being affixed on the non-planar surface of object, to improve the rigid insulation basic unit of traditional refrigerating assembly, can't effectively be applied in the disappearance of the non-planar surface on the object.

As for detailed construction of the present utility model, application principle, feature and effect, then please refer to the explanation that following adjoint is done, and be tending towards understanding:

Description of drawings:

Fig. 1 is the cut-away view that generally has the refrigerating assembly structure now.

Fig. 2 is the structure cut-away view of the utility model one embodiment.

Fig. 3 is a three-dimensional exploded view embodiment illustrated in fig. 2.

Fig. 4 is the structure cut-away view of another embodiment of the present utility model.

Fig. 5 is a three-dimensional exploded view embodiment illustrated in fig. 4.

Fig. 6 is of the present utility model one preferable enforcement schematic diagram.

Fig. 7 is the enforcement enlarged diagram of Fig. 6.

The figure number explanation:

1,2.... refrigerating assembly

3....P type semiconductor

4....N type semiconductor

5.... object

11....P type semiconductor

12....N type semiconductor

13,14.... circuit layer

15.... refrigeration face

16.... radiating surface

21.... the first soft insulated substrate

22.... the second soft insulated substrate

210, the soft electrically conductive film of 220....

211, the apparent surface of the soft conductor mould of 221....

212,222.... insulating barrier

23,24.... circuit layer

50.... non-planar surface

The specific embodiment:

See also Fig. 2 to Fig. 3, refrigerating assembly 2 structures mainly include first soft insulated substrate 21, the second soft insulated substrate 22 and are arranged in circuit layer (23,24) and a plurality of P-type semiconductors 3 and a plurality of N-type semiconductor 4 between the opposite face of this two soft insulated substrate (21,22); This two soft insulated substrate (21,22) adopt the good soft non-conductive material of heat-transfer effect or can soft electrically conductive film (210,220) as Fig. 4 or shown in Figure 5, apparent surface (211,221), be capped with the formed material of insulating barrier (212,222) and make; And these a plurality of P-type semiconductors 3 and N-type semiconductor 4 can polarity be handed over spaced mode to arrange to be set up between two circuit layers (23,24) that are arranged on corresponding of the two soft insulated substrate (21,22), and with the circuit layer of two soft insulated substrate (21,22)? (23,24) form the electrically connect loop.

Therefore, when complying with above-mentioned refrigerating assembly 2 with soft insulated substrate (21,22), can be by the flexible softness characteristics of these insulated substrate (21,22), attaching is filled on the non-planar surface 50 of object 5; , as Figure 6 and Figure 7, and when imposing a scheduled current, just can produce the transfer of a temperature difference and heat in the joint place, when if the sense of current flows to P-type semiconductor 3 by N-type semiconductor 4, this moment, temperature can be to decline, and produce heat-absorbing action, form a cold junction, if sense of current is opposite, then this moment, temperature can rise, and then the generation exothermic effects, form a hot junction.

As Fig. 4 and Figure 5 shows that another embodiment of the present utility model, two soft insulated substrate (21,22) can metal on kenel or the soft electrically conductive film (210,220) made as material of the preferable nonisulated body of other thermal conduction characteristic, again in its at least on the opposite face (211,221) by insulating layer coating (212,222), to form insulation effect; Also can directly make insulation characterisitic that these insulated substrate produce therebetween with identical, but different according to the difference of wood property different intensity and resistance characteristics be arranged as if refrigerating assembly 2 being imposed colloid or its non-conductive material.

Comprehensive the above as can be known, a kind of soft refrigerating assembly structure of the utility model, have really the existing refrigerating assembly of improvement be subject to insulated substrate can't be with meeting tortuous application disappearance that be caused.

Claims

1, a kind of soft refrigerating assembly structure, include: two circuit layers and a plurality of N-type semiconductor and P-type semiconductor, it is characterized in that: also comprise the first soft insulated substrate and the second soft insulated substrate, described two circuit layers are arranged in the relative inner face of two soft insulated substrate respectively, and described a plurality of N-type semiconductors and P-type semiconductor are connected between the obverse circuit layer of two-phase to hand over spaced mode setting.

2, soft refrigerating assembly structure as claimed in claim 1, it is characterized in that: described soft insulated substrate is made with the soft material of a tool thermal conductivity and electrical insulating property.

3, soft refrigerating assembly structure as claimed in claim 1, it is characterized in that: described soft insulated substrate adopts a soft conductor material layer, is capped with insulating barrier to form on the surface of its positioned opposite circuit layer at least.