CN2770087Y - Device with gas adsorbing function - Google Patents
Device with gas adsorbing function Download PDFInfo
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- CN2770087Y CN2770087Y CN 200420013106 CN200420013106U CN2770087Y CN 2770087 Y CN2770087 Y CN 2770087Y CN 200420013106 CN200420013106 CN 200420013106 CN 200420013106 U CN200420013106 U CN 200420013106U CN 2770087 Y CN2770087 Y CN 2770087Y
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- light shield
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- adsorption unit
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Abstract
A device, which is provided with function of adsorbing gas particles, is a box that holds masks, wafers or panels that are used for manufacturing integrated circuits and liquid crystal displays. A gas adsorbing unit is equipped in the box. The gas adsorbing unit is used for adsorbing gas pollutants, which prevents interaction between the masks or the wafers and the gas pollutants from influencing distribution of patterns on the masks or yield of components formed in the wafers or the panels. The gas adsorbing unit includes gas adsorbing materials that are filled in the unit to adsorb gas pollutants.
Description
Technical field
The utility model relates to a kind of device with adsorbed gas particle function, particularly relates to a kind of adsorbed gas particle that has, organic or inorganic gas for example, the box for photomask of function or wafer cassette or the like.
Background technology
Lifting along with the manufacture of semiconductor technology, wafer factory is also more and more higher for the requirement of dust free room operating environment, when wafer enters the processing procedure in another stage at the processing procedure of finishing a stage, wafer must be taken out from the process reaction room in this stage, wafer be delivered to carried out the processing procedure reaction in the process reaction room in another stage again.Being subjected to the pollution of environment for fear of wafer in the process of carrying, mainly all is to see through wafer cassette wafer is carried at present among wafer factory.With regard to the production line of present 8 o'clock or ten two o'clock wafer factories, mainly be to utilize SMIF (SMIF) system to carry, all there is the certain standard flow process in above-mentioned SMIF (SMIF) system for design, carrying and the conveying of wafer cassette.
In addition, in the manufacture process of integrated circuit, can use a large amount of micro-photographing process with form time micron or even little shadow pattern (pattern) of nanometer size (dimension), to reach the purpose of the memory subassembly of making the super-high density integration.Carrying out in the process of micro-photographing process, exposure bench (for example stepper stepper) can automatically take out the light shield that is placed in the box for photomask, aims at then and exposes.Different product (products) all will be changed different light shields with little shadow step of different levels (layers), and the process of replacing is earlier light shield to be withdrawed from board to get back to box for photomask afterwards, and then whole box for photomask is taken out, and then transports box for photomask.
From the above, the process technique of integrated circuit has entered the stage of highdensity inferior micron or nanometer, therefore have on it that particle (particles) exists or the light shield that its surperficial pattern is subjected to destroy is when carrying out micro-photographing process if use, to cause the formed pattern distortion of crystal column surface, the result causes the downslide even the whole integrated circuit package inefficacy (fail) of the process rate (yield) of integrated circuit package.According to the practical experience of wafer factory, can mainly come from air pollutants, crystallization deposition thing, scratch and electrostatic breakdown or the like to the reason that mask pattern impacts.Therefore, most of light shield all is to be seated in the box for photomask and to use its inner light shield of protection obsolete the time.Similarly, the wafer in most of the manufacturing also is to be placed in to use its inner wafer of protection among the described wafer cassette when nothing is carried out fabrication schedule.Yet the contamination gas of dust free room trace is known from experience the pattern distribution that influences light shield with the formation reaction of light shield surface, and then causes scrapping of wafer.
Therefore, based on above-mentioned required, and in response to the demand of trend, the utility model will propose a kind of new device, with avoid the organic or inorganic gases affect be placed in mask pattern in box for photomask or the wafer cassette distribute with wafer on integrated circuit package.
Summary of the invention
The purpose of this utility model is to provide a kind of device with adsorbed gas particle function.
A purpose more of the present utility model is to provide a kind of adsorbed gas particle that has, organic or inorganic gas for example, the box for photomask of function.
Another purpose of the present utility model is to provide a kind of adsorbed gas particle that has, organic or inorganic gas for example, the wafer cassette of function.
The utility model provides a kind of device with adsorbed gas particle function, and this device is the container of light shield transport case, box for photomask, light shield storage cabinet, wafer cassette or the panel box of bearing integrated manufacturing.One gas adsorption unit is disposed in this container, and it is used for adsorbing the gas particle in this container.Wherein this gas adsorption unit air inclusion sorbing material is disposed at and wherein is used for adsorbing this gas particle.
The utility model provides a kind of device with adsorbed gas particle function, and this device is the box of light shield, wafer or the panel of bearing integrated manufacturing, LCD manufacturing.One gas adsorption unit is disposed in the above-mentioned box, its be used for the adsorbed gas particle influence the pattern distribution of light shield to avoid above-mentioned light shield or wafer and the effect of above-mentioned gas particle be formed at wafer or panel in the yield of assembly.Wherein above-mentioned gas absorbing unit air inclusion sorbing material is disposed at and wherein is used for the adsorbed gas particle.
The utility model provides a kind of device of tool adsorbed gas function, a box for photomask for example, and it comprises: a lower cover, it has a light shield pedestal and can be used to carry a light shield, and above-mentioned light shield pedestal utilizes bracing frame that this light shield is supported; One loam cake can cover becoming a box body mutually with above-mentioned lower cover, and protects this light shield in wherein by this; And a gas adsorption unit, be used for the adsorbed gas particle, for example organic or inorganic gas influences the distribution of this mask pattern to avoid above-mentioned light shield adhered to by this organic or inorganic gas; Wherein the above-mentioned gas absorbing unit with adsorption material in it and place the inside of this box body.
The utility model provides the device of another kind of tool adsorbed gas function, a wafer cassette for example, and it comprises: a brilliant boat, it has several slots; One outer cover, it can carry above-mentioned brilliant boat; And a gas adsorption unit, be used for the adsorbed gas particle, organic or inorganic gas for example, to avoid inserting wafer in the above-mentioned slot and the effect of above-mentioned organic or inorganic gas and influence be formed at above-mentioned wafer in the yield of integrated circuit package; Wherein the above-mentioned gas absorbing unit with adsorption material in it and place the inside of above-mentioned outer cover.
Description of drawings
In conjunction with appended icon, can understand the plurality of advantages of foregoing and this utility model by following detailed description easily, wherein:
Fig. 1 is the schematic diagram that the utlity model has the box for photomask of adsorbed gas particle function.
Fig. 2 is the schematic diagram with wafer cassette of adsorbed gas particle function of the present utility model.
Fig. 3 a to Fig. 3 b is the schematic diagram of the container of the loading box for photomask with adsorbed gas particle function of the present utility model or wafer cassette etc.
Embodiment
The utlity model has the device that adsorbs organic or inorganic gas function, this device for example is a box for photomask or wafer cassette, with cooperating preferred embodiment of the present utility model and the icon of enclosing to be specified in down, it should be understood that all preferred embodiments only are the usefulness of illustration in the utility model.Therefore, the preferred embodiment in literary composition, the utility model also can be widely used among other embodiment, be not to be used for limiting box for photomask or wafer cassette, other for example: light shield transport case, light shield storage cabinet, panel of LCD box or the like also can be used for the utility model.And the utility model is not limited to any embodiment, and should be with the claim of enclosing and equivalent fields thereof and decide.
A kind of device with adsorbed gas particle function of the utility model, this device is the container of light shield transport case, box for photomask, light shield storage cabinet, wafer cassette or the panel box of bearing integrated manufacturing.One gas adsorption unit is disposed in this container, and it is used for adsorbing the gas particle in this container.Wherein this gas adsorption unit air inclusion sorbing material is disposed at and wherein is used for adsorbing this gas particle.
A kind of device with adsorbed gas particle function of the utility model, this device is the box of light shield, wafer or the panel of bearing integrated manufacturing, LCD manufacturing.One gas adsorption unit is disposed in the above-mentioned box, its be used for the adsorbed gas particle influence the pattern distribution of light shield to avoid above-mentioned light shield or wafer and the effect of above-mentioned gas particle be formed at wafer or panel in the yield of assembly; Wherein above-mentioned gas absorbing unit air inclusion sorbing material is disposed at and wherein is used for the adsorbed gas particle.
A kind of box for photomask that adsorbs organic or inorganic gas function that has of the present utility model, it comprises: a lower cover, it has a light shield pedestal and can be used to carry a light shield, and above-mentioned light shield pedestal utilizes bracing frame that this light shield is supported; One loam cake can cover becoming a box body mutually with above-mentioned lower cover, and protects this light shield in wherein by this; And a gas adsorption unit that comprises sorbing material, being used for the adsorbed gas particle, organic or inorganic gas for example influences pattern distribution wherein to avoid above-mentioned light shield and this organic or inorganic gas effect; Wherein above-mentioned sorbing material disposes or is arranged at the inside of this box body through the packing monomer of packing, and does not harm the access or the storing of this wafer or light shield.
Another kind of the present utility model has the wafer cassette of the organic or inorganic gas function of absorption, and it comprises: a brilliant boat, and it has several slots in wherein; One outer cover, it can carry above-mentioned brilliant boat; And a sorbing material, being used for the adsorbed gas particle, organic or inorganic gas for example is to avoid inserting wafer in the above-mentioned slot and this organic or inorganic gas effect and influence the yield that is formed at the assembly in the above-mentioned wafer; Wherein above-mentioned sorbing material is disposed at the inside of above-mentioned outer cover through packing.
Fig. 1 is the schematic diagram that the utlity model has the box for photomask of adsorbed gas particle function.
See also Fig. 1, the box like structure that box for photomask 10 as shown in the figure is made up of a loam cake 11 and a lower cover 12.The top of above-mentioned lower cover 12 is provided with a light shield pedestal 19; it can utilize bracing frame 18 that a light shield 14 of making integrated circuit is supported; and after loam cake 11 and lower cover 12 cover mutually, above-mentioned light shield 14 is protected in the above-mentioned box for photomask 10, destroy to avoid above-mentioned light shield 14 to be subjected to external influence or pollute.Above-mentioned light shield 14 comprises transparent area 15 and non-transparent area 13, and for example, the glass that wherein above-mentioned light shield 14 is made up of transparent quartz material is base configuration, and plates the chromium layer to form the pattern of light shield 14 at non-transparent area 13.
The bracing frame 18 of above-mentioned light shield pedestal 19 is made up of four support columns 17 and three side safe edges 16, above-mentioned three side safe edges 16 are located at two sides and the rear side of above-mentioned light shield pedestal 19 respectively, above-mentioned four support columns 17 then are side safe edge 16 inboards of being located at two sides of above-mentioned light shield pedestal 19 respectively, so structure can support four corners (corners) of above-mentioned light shield 14, makes two sides and the rear side of above-mentioned light shield 14 be surrounded on wherein.Mandatory declaration be that the number of above-mentioned support column 17 and side safe edge 16 can the conversion according to demand.In addition, for the side safe edge 16 that makes above-mentioned bracing frame 18 can produce screen effect to the light shield 14 that is carried, to avoid above-mentioned light shield 14 pattern distribution to be subjected to the influence of extraneous static lotus and to damage, above-mentioned side safe edge 16 employed materials must be the materials with free electron, and for example metal or the nonmetallic material (dissipative material) of dispersing are made and to be formed.Yet, owing to metallics can be because the effect of electrostatic charge produces spark (spark), therefore and can the pattern distribution on light shield 14 surfaces be damaged, the side safe edge 16 of above-mentioned bracing frame 18 is made and is become best selection with the nonmetallic material (dissipative material) of dispersing.
Because the process technique of integrated circuit has entered the stage of highdensity inferior micron or nanometer, therefore have on it that particle exists or the light shield 14 that its surperficial pattern is subjected to destroy is when carrying out micro-photographing process if use, to cause the formed pattern distortion of crystal column surface, the result causes the downslide even the whole integrated circuit package inefficacy (fail) of the process rate (yield) of integrated circuit package.Practical experience according to semiconductor crystal wafer factory, the reason that can impact light shield 14 patterns mainly comes from air particles, scratch and electrostatic breakdown or the like, wherein the source of air particles mainly is the air pollutants arround coming from, and these air pollutants can form crystal (Haze) and influence light mask image on the light shield surface.The part major part of scratch is meant that chromium layer for light shield 14 surfaces is subjected to the external force effect and produces in addition.Static also can damage the picture on surface of above-mentioned light shield 14, and the generation of static mainly is to come from the air in the dust free room, work on the spot/engineering staff's work clothes or the friction that robotic arm is produced in course of conveying.Because the very possible voltage that is equivalent to 700 volts (V) that produces of static, this will damage and have influence on the distribution of pattern for the chromium layer on light shield 14 surfaces.Therefore, most of light shield 14 all is to be placed in the box for photomask 10 and to use its inner light shield of protection obsolete the time.
From the above, time of being placed in the box for photomask 10 of above-mentioned light shield 14 may be very long.Have influence on the integrality of light shield 14 patterns with being placed on the chromium layer effect of the above-mentioned light shield 14 in the box for photomask 10 for fear of air particles, the unit 9 that the utility model provides an inside that is disposed at above-mentioned box for photomask 10 to comprise the adsorbed gas material, its with adsorption material in it and be disposed at the inside of above-mentioned box for photomask 10.The above-mentioned unit 9 that comprises the adsorbed gas material can absorb above-mentioned box for photomask 10 inner or arround gas particle, for example organic and inorganic gas or air pollutants (airborne molecular contamination), with avoid fully above-mentioned box for photomask 10 inner or arround air particles and the chromium layer effect that is placed on the light shield 14 in the box for photomask 10.For an embodiment, the material of above-mentioned sorbing material is silica gel (silicon gel), molecular sieve (molecular sieve), zeolite (Zeolite) or activated carbon.Wherein the chemical analysis of above-mentioned molecular sieve is aluminosilicate crystalline solid (CRYSTALLINE ALUMINO-SILICATES), via special chemical synthesis mechanism, can obtain unique single aperture (MONO-DISPERSE), porousness micro-structural (POROUS MICROSTRUCTURE), can not expand behind its adsorbed gas particle, can not chemical solution, and still keep dry state, and its pore size is approximately close with the size of gas molecule.
The method of above-mentioned packing sorbing material for example is to utilize gas permeable material, metal parcel or sorbing material itself is made a sheet of adsorbent.
Fig. 2 is the schematic diagram that the utlity model has the wafer cassette of adsorbed gas particle function.
See also Fig. 2, wafer cassette 20 as shown in the figure comprises a brilliant boat 23 and an outer cover 21.Above-mentioned brilliant boat 23 has several slots 24 in wherein, and for an embodiment, the number of above-mentioned slot 24 is 25, and each slot 24 all can be put a wafer 25, that is to say, each brilliant boat 23 can carry 25 wafer 25.Above-mentioned outer cover 21 be one can folding cover body, it can carry above-mentioned brilliant boat 23.Above-mentioned wafer cassette 20 more comprises rotating to insert sends (not icon), be located at the folding intersection of above-mentioned outer cover 21, utilize above-mentioned rotation to insert to send and to open or closed above-mentioned outer cover 21, to be placed in the outer cover 21 from the above-mentioned brilliant boat 23 of the interior taking-up of above-mentioned outer cover 21 or with above-mentioned brilliant boat 23.Above-mentioned rotation inserts that to send for above-mentioned outer cover 21 be very important with combining of 23 in brilliant boat, once slotting the sending of above-mentioned rotation turns to the phenomenon that wafer 25 fragmentations on the above-mentioned slot 24 will take place in untrue position.
In addition, wafer cassette handle 22 both sides that are arranged at above-mentioned outer cover 21 are beneficial to the carrying and the conveying of above-mentioned wafer cassette 20.
Moreover, for the process technique of integrated circuit,, will cause the downslide even the whole integrated circuit package inefficacy (fail) of integrated circuit package process rate (yield) if there is particle to exist on wafer 25 surfaces in making.Practical experience according to semiconductor crystal wafer factory, above-mentioned particle and scratch can cause great influence to the yield (yield) and the usefulness (performance) of the integrated circuit package on the wafer 25 really, wherein the source of particle mainly is the air arround coming from, and the part major part of scratch is meant that wafer 25 surfaces are subjected to the external force effect and produce in addition.Therefore, the wafer 25 in most of manufacturing the (pending) when not making all is placed on and uses its inner wafer 25 of protection in the wafer cassette 20.
From the above, time of being placed in the wafer cassette 20 of above-mentioned wafer 25 may be very long.For fear of arround air particles have influence on the yield (yield) and the usefulness (performance) of integrated circuit package with being placed on the integrated circuit package effect on the above-mentioned wafer 25 in the wafer cassette 20, the utility model provides a unit that comprises the adsorbed gas material 26 that is disposed at above-mentioned wafer cassette 20 inside, its with adsorption material in it and place the inside of above-mentioned wafer cassette 20.The above-mentioned unit (gas adsorption unit) 26 that comprises the adsorbed gas material can absorb above-mentioned wafer cassette 20 inner or arround gas particle, for example organic and inorganic gas or air pollutants (airborne molecular contamination), with avoid fully above-mentioned wafer cassette 20 inner or arround air particles and the wafer 25 that is placed in the above-mentioned wafer cassette 20 on the integrated circuit package effect.For an embodiment, the material of above-mentioned sorbing material is silica gel (silicon gel), molecular sieve (molecular sieve), zeolite (Zeolite) or activated carbon.Wherein the chemical analysis of above-mentioned molecular sieve is aluminosilicate crystalline solid (CRYSTALLINE ALUMINO-SILICATES), via special chemical synthesis mechanism, can obtain unique single aperture (MONO-DISPERSE), porousness micro-structural (POROUS MICROSTRUCTURE), can not expand behind its adsorbed gas particle (particles), can not chemical solution, and still keep dry state, and its pore size is approximately close with the size of gas molecule.
The method of above-mentioned packing sorbing material for example is to utilize gas permeable material, metal parcel or sorbing material itself is made a sheet of adsorbent.
Fig. 3 a to Fig. 3 b is the schematic diagram of the container of the loading box for photomask with adsorbed gas particle function of the present utility model or wafer cassette etc.
See also Fig. 3 a to Fig. 3 b, container 32 as shown in the figure comprises that a dividing plate 30 is placed in one.Said vesse 32 comprises but is not limited to light shield transport case, box for photomask, light shield storage cabinet, wafer cassette or the panel box that bearing integrated is made.For an embodiment, said vesse 32 carryings one box for photomask 33.In addition, aforementioned barriers 30 has several perforates (openings) 31.For an embodiment, above-mentioned perforate (openings) 31 is the circular hole of 10 centimetres of diameters.
In addition, said vesse 32 has leader 35 and is arranged at carrying and the conveying that its both sides are beneficial to said vesse 32.
In fact, time of being placed in the container 32 of above-mentioned box for photomask 33 may be very long.For fear of arround air particles have influence on following yield (yield) and the usefulness (performance) of making integrated circuit package with being placed on the light shield effect on the box for photomask 33 in the said vesse 32, the utility model provides a unit that comprises the adsorbed gas material 34 that is disposed at said vesse 32 inside, its with adsorption material in it and place the inside of said vesse 32.The above-mentioned unit (gas adsorption unit) 34 that comprises the adsorbed gas material can absorb said vesse 32 inner or arround gas particle, for example organic and inorganic gas or air pollutants (airborne molecular contamination), with avoid fully said vesse 32 inner or arround air particles be placed on said vesse 32 in box for photomask 33 in the light shield effect.For an embodiment, the material of above-mentioned sorbing material is silica gel (silicon gel), molecular sieve (molecular sieve), zeolite (Zeolite) or activated carbon.Wherein the chemical analysis of above-mentioned molecular sieve is aluminosilicate crystalline solid (CRYSTALLINE ALUMINO-SILICATES), via special chemical synthesis mechanism, can obtain unique single aperture (MONO-DISPERSE), porousness micro-structural (POROUS MICROSTRUCTURE), can not expand behind its adsorbed gas particle (particles), can not chemical solution, and still keep dry state, and its pore size is approximately close with the size of gas molecule.
The method of above-mentioned packing sorbing material for example is to utilize gas permeable material, metal parcel or sorbing material itself is made a sheet of adsorbent.
Major advantage of the present utility model is as follows:
1, the packing of sorbing material of the present utility model is simple.
Number (life time) and the scrappage that reduces light shield when 2, gas adsorption unit of the present utility model can increase the use of light shield.
3, gas adsorption unit of the present utility model can promote the yield (yield) of integrated circuit package.
The utility model illustrates as above that with preferred embodiment so it is not to be used for limiting the patent right scope that the utility model is advocated.Its scope of patent protection when on accompanying Claim and etc. same domain decide.All skill persons who is familiar with this field, in not breaking away from this patent spirit or scope, change of being done or retouching all belong to the utility model and disclose equivalence change or the design that spirit is finished down, and should be included in the following claim.
Claims (10)
1, a kind of device with adsorbed gas particle function, this device is the container of light shield transport case, box for photomask, light shield storage cabinet, wafer cassette or the panel box of bearing integrated manufacturing, it is characterized in that: a gas adsorption unit is disposed in this container, and it is used for adsorbing the gas particle in this container; Wherein this gas adsorption unit air inclusion sorbing material is disposed at and wherein is used for adsorbing this gas particle.
2, the device with adsorbed gas particle function according to claim 1, it is characterized in that: this gas particle comprises organic gas, inorganic gas or air pollutants, wherein this gas-adsorbing material material package contains silica gel, molecular sieve, activated carbon or zeolite, and wherein this gas adsorption unit comprises the package body that adopts gas permeable material, adopts the package body of metal parcel or makes a sheet of adsorbent and places the inside of this container.
3, a kind of device with adsorbed gas particle function, this device is the light shield of bearing integrated manufacturing or the box of wafer, it is characterized in that: a gas adsorption unit is disposed in this box, and it is used for the yield that the adsorbed gas particle influences the pattern distribution of this light shield or is formed at the assembly in this wafer to avoid this light shield or this wafer and this gas particle effect; Wherein this gas adsorption unit air inclusion sorbing material is disposed at and wherein is used for adsorbing this gas particle.
4. the device with adsorbed gas particle function according to claim 3, it is characterized in that: this box comprises: light shield transport case, box for photomask, light shield storage cabinet, wafer cassette, wherein this gas particle comprises organic gas, inorganic gas or air pollutants, wherein this sorbing material comprises silica gel, molecular sieve, activated carbon or zeolite, and wherein this gas adsorption unit comprises the package body that adopts gas permeable material, adopts the package body of metal parcel or makes a sheet of adsorbent and places the inside of this box.
5. device with adsorbed gas particle function, this device is the light shield of carrying LCD manufacturing or the box of panel, it is characterized in that: a gas adsorption unit is disposed in this box, and it is used for the yield that the adsorbed gas particle influences the pattern distribution of this light shield or is formed at the assembly in this panel to avoid this light shield or this panel and this gas particle effect; Wherein this gas adsorption unit air inclusion sorbing material is disposed at and wherein is used for adsorbing this gas particle.
6. the device with adsorbed gas particle function according to claim 5, it is characterized in that: this box comprises: light shield transport case, box for photomask, light shield storage cabinet, panel box, wherein this gas particle comprises organic gas, inorganic gas or air pollutants, wherein this sorbing material comprises silica gel, molecular sieve, activated carbon or zeolite, and wherein this gas adsorption unit comprises the package body that adopts gas permeable material, adopts the package body of metal parcel or makes a sheet of adsorbent and places the inside of this box.
7. box for photomask with adsorbed gas particle function, it is characterized in that: this box for photomask comprises:
One lower cover, it has a light shield pedestal can carry a light shield with rice, and this light shield pedestal utilizes bracing frame that this light shield is supported;
One loam cake can cover becoming a box body mutually with this lower cover, and protects this light shield in wherein by this; And
One gas adsorption unit is disposed at and is used for the adsorbed gas particle in this box body, influences pattern distribution wherein to avoid this light shield and this gas particle effect;
Wherein this gas adsorption unit air inclusion sorbing material is disposed at and wherein is used for adsorbing this gas particle.
8. the box for photomask with adsorbed gas particle function according to claim 7, it is characterized in that: this bracing frame has two sides and the rear side that three outer side edges are incorporated into this light shield pedestal respectively, wherein this gas particle comprises organic gas, inorganic gas or air pollutants, wherein this sorbing material comprises silica gel, molecular sieve, activated carbon or zeolite, and wherein this gas adsorption unit comprises the package body that adopts gas permeable material, adopts the package body of metal parcel or makes a sheet of adsorbent and places the inside of this box body.
9. the wafer cassette with adsorbed gas particle function is characterized in that, this wafer cassette comprises:
One brilliant boat has several slots in wherein;
One outer cover, it can carry this crystalline substance boat; And
One gas adsorption unit is disposed in this box body, is used for the adsorbed gas particle, to avoid inserting wafer in this slot and this gas particle effect and influence the yield that is formed at the assembly in this wafer;
Wherein this gas adsorption unit air inclusion sorbing material is disposed at and wherein is used for adsorbing this gas particle.
10. the wafer cassette with adsorbed gas particle function according to claim 9 is characterized in that: this outer cover be one can folding cover body; More comprise rotate inserting and send, be located at the folding intersection of this outer cover, utilize this rotations to insert to send can open or closed this outer cover with this crystalline substance boat of taking-up in this outer cover or put this crystalline substance boat in this outer cover; Wherein this gas particle comprises organic gas, inorganic gas or air pollutants; Wherein should comprise several slots by the crystalline substance boat, each this slot can carry a wafer; Comprise that more the wafer cassette handle is arranged at the both sides of this outer cover; Wherein this sorbing material comprises silica gel, molecular sieve, activated carbon; Wherein this gas adsorption unit comprises the package body that adopts gas permeable material, adopts the package body of metal parcel or makes a sheet of adsorbent and places the inside of this outer cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420013106 CN2770087Y (en) | 2004-12-23 | 2004-12-23 | Device with gas adsorbing function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420013106 CN2770087Y (en) | 2004-12-23 | 2004-12-23 | Device with gas adsorbing function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2770087Y true CN2770087Y (en) | 2006-04-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200420013106 Expired - Fee Related CN2770087Y (en) | 2004-12-23 | 2004-12-23 | Device with gas adsorbing function |
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| Country | Link |
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| CN (1) | CN2770087Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101063806B (en) * | 2006-04-28 | 2011-06-22 | 台湾积体电路制造股份有限公司 | Method and apparatus for solving mask precipitated defect |
| CN105637627A (en) * | 2013-09-06 | 2016-06-01 | 安格斯公司 | Substrate containment with enhanced solid getter |
| CN108288597A (en) * | 2017-01-10 | 2018-07-17 | 台湾积体电路制造股份有限公司 | Case and particle detection technique |
-
2004
- 2004-12-23 CN CN 200420013106 patent/CN2770087Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101063806B (en) * | 2006-04-28 | 2011-06-22 | 台湾积体电路制造股份有限公司 | Method and apparatus for solving mask precipitated defect |
| CN105637627A (en) * | 2013-09-06 | 2016-06-01 | 安格斯公司 | Substrate containment with enhanced solid getter |
| CN108288597A (en) * | 2017-01-10 | 2018-07-17 | 台湾积体电路制造股份有限公司 | Case and particle detection technique |
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| GR01 | Patent grant | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |