CN2715348Y - 带散热功能的led - Google Patents

带散热功能的led Download PDF

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Publication number
CN2715348Y
CN2715348Y CNU2004200077912U CN200420007791U CN2715348Y CN 2715348 Y CN2715348 Y CN 2715348Y CN U2004200077912 U CNU2004200077912 U CN U2004200077912U CN 200420007791 U CN200420007791 U CN 200420007791U CN 2715348 Y CN2715348 Y CN 2715348Y
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China
Prior art keywords
led
heat radiation
led chip
pin
heat
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Expired - Lifetime
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CNU2004200077912U
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English (en)
Inventor
姚志图
周泽松
张则佩
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Shenzhen Waichi Photoelectric Co., Ltd.
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姚志图
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Led Device Packages (AREA)

Abstract

本实用新型带散热功能的LED，为克服现有技术中热量不能及时散发的问题，包括封装在一起的两个电位脚和一个与电位脚电连接的LED芯片，在所述的两个电位脚之间还封装有散热脚，所述的LED芯片固定安装在散热脚在封装体内的一端，散热脚的另一端引出于封装体外。上述结构中的正负极电位脚为LED芯片电源输入脚，而散热脚将LED芯片在工作时产生的热量散发掉，为LED能正常、高效地工作提供保障，特别适用于大功率、高亮度的LED芯片的封装。

Description

带散热功能的LED
技术领域
本实用新型涉及一种LED，特别涉及一种带散热功能的LED。
背景技术
LED以其功耗低、亮度高、体积小、寿命长、反应速度快、易封装等优势已应用到各行各业，现有的LED一般由透明的封装材料将两个电位脚和一个安装电位脚的LED芯片封装在一起组成，各种不同形状及规格的LED，它们的封装方式基本为SMD(贴片)，支架，这些直接焊接在主板上，由于这些LED封装没有专门的散热结构，只适用于低功率，低亮度的LED芯片封装。随着科学技术的发展，大功率，高亮度的LED芯片制造技术日益成熟，这些LED芯片功率可达1W以上，在工作时，这些LED芯片会产生很大的热量，如果这些热量不及时散发掉，将会使LED芯片温度不断升高而影响LED的性能、寿命。
发明内容
为克服上述缺点，本实用新型提供一种带散热功能的LED。
本实用新型带散热功能的LED，包括封装在一起的两个电位脚和一个与电位脚电连接的LED芯片，在所述的两个电位脚之间还封装有散热脚，所述的LED芯片固定安装在散热脚在封装体内的一端，散热脚的另一端引出于封装体外。
上述结构中的正负极电位脚为LED芯片电源输入脚，而散热脚将LED芯片在工作时产生的热量散发掉，为LED能正常、高效地工作提供保障，特别适用于大功率、高亮度的LED芯片的封装。
附图说明
图1为本实用新型带散热功能的LED的剖视示意图。
图2为图1所示带散热功能的LED使用状态剖视示意图。
具体实施方式
参照图1，本实用新型带散热功能的LED，包括封装在一起的两个电位脚3和一个与电位脚3电连接的LED芯片6，在所述的两个电位脚3之间还封装有散热脚4，所述的LED芯片6固定安装在散热脚4在封装体1内的一端，散热脚4的另一端引出于封装体1外。
作为本实用新型的进一步改进，所述的散热脚4在封装体1内的一端为凹形弧面2。上述散热脚在封装体内一端的凹形弧面2可对安装在其内的LED芯片6在发光时产生很好的反射作用，可以使LED能进一步的减小功耗、增强LED的亮度，为LED的高效地工作提供了进一步的保障。当然本实用新型的LED散热脚4及所述的凹形弧面2的外形、大小可根据LED芯片功率、形状不同而单独设计，以便满足不同的LED芯片光线反射和散热的要求。
作为本实用新型的进一步改进，上述的LED芯片6采用导热粘结材料粘固在散热脚4在封装体内的一端，以便于对LED芯片6更好地进行散热。
本实用新型带散热功能的LED的使用参考状态如图2所示，本实用新型的带散热功能的LED的电位脚3焊接在控制主板7上，散热脚4焊接在散热板8上。

Claims (3)

1、一种带散热功能的LED，包括封装在一起的两个电位脚和一个与电位脚电连接的LED芯片，其特征在于：在所述的两个电位脚之间还封装有散热脚，所述的LED芯片固定安装在散热脚在封装体内的一端，散热脚的另一端引出于封装体外。
2、如权利要求1所述的带散热功能的LED，其特行征在于：所述的散热脚在封装体内的一端为凹形弧面。
3、如权利要求1或2所述的带散热功能的LED，其特征在于所述的LED芯片采用导热粘结材料粘固在散热脚在封装体内的一端。
CNU2004200077912U 2004-03-26 2004-03-26 带散热功能的led Expired - Lifetime CN2715348Y (zh)

Priority Applications (1)

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CNU2004200077912U CN2715348Y (zh) 2004-03-26 2004-03-26 带散热功能的led

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Application Number Priority Date Filing Date Title
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117038818A (zh) * 2023-10-08 2023-11-10 盐城鸿石智能科技有限公司 一种高反射MicroLED及其制备方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117038818A (zh) * 2023-10-08 2023-11-10 盐城鸿石智能科技有限公司 一种高反射MicroLED及其制备方法

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