CN2708500Y - Structure of IC wafer - Google Patents
Structure of IC wafer Download PDFInfo
- Publication number
- CN2708500Y CN2708500Y CN 200420065567 CN200420065567U CN2708500Y CN 2708500 Y CN2708500 Y CN 2708500Y CN 200420065567 CN200420065567 CN 200420065567 CN 200420065567 U CN200420065567 U CN 200420065567U CN 2708500 Y CN2708500 Y CN 2708500Y
- Authority
- CN
- China
- Prior art keywords
- wafer
- supporting body
- face
- framework
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Disclosed is a structure of integrated circuit wafer, including a carrying body, a wafer, a plurality of bonding wires, a cover, a supporting body and an adhesive object. The carrying body is provided with a top face, a bottom face and an accommodating chamber; the accommodating chamber is provided with an opening, and the top face is separately provided a plurality of welding zones and a plurality of non-welding zones on the periphery of the opening; the welding zones and the non-welding zones are lined adjacently, and each welding zone is provided with a welding pad; the wafer is fixedly provided in the accommodating chamber and is provided with a plurality of welding pads; the plurality of bonding wires are respectively electrically connected to the welding pads provided on the welding zones of the carrying body and to the welding pads of the wafer; the cover is used for closing the opening of the accommodating chamber; the supporting body is clamped between the cover and the plurality of non-welding zones provided on the top face of the carrying body; the adhesive object is distributed at the connective point of the cover and the carrying body to make the cover fixedly connected to the carrying body.
Description
Technical field
The structure of the utility model and integrated circuit (IC) wafer is equipped with the pass, is meant a kind of assembling structure of small-scale integrated circuit especially.
Background technology
Small-scale integrated circuit crystal wafer assembling structure commonly used, as No. 152172, Taiwan patent announcement that the inventor invented, see also shown in Figure 1, its primary structure includes a supporting body (1), one room (2), this room has an opening (3), and the periphery of this opening (3) is arranged with most weld pads (4); One wafer (5) is fixedly arranged in this room (2); Most bonding wires (6) electrically connect weld pad (4) and this wafer (5) on this supporting body respectively; One adhesive thing (7) is distributed in this opening (3) periphery; One hides (8), affixed with this adhesive thing (7), and can seal the opening (3) of this room (2); Because for the weld pad (4) of this bonding wire (6) routing respectively, move to the periphery of this room (2) opening (3) by room (2) inside, this room (2) must be wire bonder reservation operations space again, so the size that can dwindle assembling structure.
Yet, when this kind design is sealed room openings (3) to hide (8), bonding wire (6) and weld pad (4) can be subjected to hiding (8) directly contact extruding, and cause bonding wire to be damaged or bonding wire (6) is come off by weld pad (4), make the wafer (5) can't normal operation, reduce structure dress yield, cause production cost to improve.
The utility model content
Main purpose of the present utility model is to provide a kind of structure dress of integrated circuit (IC) wafer, and it is long-pending significantly to dwindle its packaging housing.
Another purpose of the present utility model is to provide a kind of structure dress of integrated circuit (IC) wafer, and it is avoided destroying bonding wire and is connected.
For achieving the above object, the structure of a kind of integrated circuit (IC) wafer that the utility model provides dress includes:
One supporting body has an end face, a bottom surface and a room, and this room has an opening, and this end face is arranged with most weld zones and most non-weld zone in the periphery of this opening, and these weld zones and these non-weld zones are adjacent arrangement;
One wafer is fixedly arranged in this room, and this wafer has most weld pads;
Most bonding wires electrically connect the weld zone on this supporting body and the weld pad of this wafer respectively;
One hides, in order to seal the opening of this room;
One supporter is folded on this supporting body end face between the some non-weld zones and this covering.
One adhesive thing is distributed in this covering and this supporting body joining place, with so that this covering be fixed on this supporting body.
Wherein this covering has a bottom surface and an end face, and this supporter is convexly set in the bottom surface of this covering.
Wherein this supporter is that one is convexly set in the non-weld zone that this opens the supporting body end face.
Wherein this supporter generally is a framework, has a hollow region in this framework, and in order to overlapping with this opening, the bottom surface of this framework convexes with some projections, and this framework fits in these non-weld zones with these projections.
Wherein this room has a bottom, a sidewall, and this side wall ring is around in this bottom peripheral edge, and forms this opening in the top of this supporting body bottom surface.
Wherein:
This supporting body includes a plate body and a framework, and this plate body has a bottom surface and an end face, and this end face is laid with the watertight composition that a metal material is made;
This framework has the hollow region that an end face, a bottom surface and run through this top, bottom surface, and this framework hollow region and this plate body end face can form a room, use for this wafer to be installed in.
Wherein also include a jockey, it includes and is communicated with the most perforations in this non-weld zone of framework end face to this framework bottom surface, and most metal pins, respectively an end of this pin inserts and puts and is fixed between this framework bottom surface and this plate body end face, and electrically connect with this perforation, it is outside and be bent into reservation shape that respectively the other end of this pin then is positioned at this supporting body.
Wherein also include a jockey, this jockey is in order to electrically connect this supporting body weld zone to this supporting body outside.
Wherein this jockey is the most perforations that are opened in this supporting body periphery, and these perforations connect the bottom surface of these weld zones and this supporting body.
Wherein this connection dress includes most metal pins, and respectively the weld zone of an end of this pin and this supporting body electrically connects, and the other end then is positioned at this supporting body outside and is bent into reservation shape.
Wherein this weld zone is a weld pad.
Description of drawings
Below, enumerate preferred embodiment of the present utility model, and after cooperating following accompanying drawing to be described in more detail in, wherein:
Fig. 1 is a kind of integrated circuit (IC) wafer structure dress commonly used.
Fig. 2 is the cutaway view of the utility model first preferred embodiment.
Fig. 3 is the utility model first preferred embodiment, the stereogram of this covering.
Fig. 4 is the vertical view of the utility model first preferred embodiment, and wherein this covering removes.
Fig. 5 is the constitutional diagram of analysing and observe of the utility model second preferred embodiment.
Fig. 6 is the vertical view of the utility model second preferred embodiment, and wherein this covering removes.
Fig. 7 is the constitutional diagram of analysing and observe of the utility model the 3rd preferred embodiment.
Fig. 8 is the vertical view of the utility model the 3rd preferred embodiment, and wherein this covering removes.
Fig. 9 is the utility model the 4th preferred embodiment, the stereogram of this supporter.
Embodiment
See also Fig. 2 to shown in Figure 4, the structure dress (10) of the utility model first a kind of integrated circuit (IC) wafer that preferred embodiment provides, its bonding wire (13), one that consists predominantly of a supporting body (11), a wafer (12), majority hides (14), a supporter (15), an adhesive thing (16) and a jockey (17), wherein:
This supporting body (11), can be plastic cement, glass fibre, reinforced plastic, pottery ... made etc. the insulating properties material, has an end face (11a), one bottom surface (11b) and a room (11c), this room (11c) has a bottom (11d), one sidewall (11e), this sidewall (11e) is surrounded on the periphery of this bottom (11d), and form an opening (11f) in the top of this end face (11a), the periphery of this opening (11f), be arranged with most weld zones (11g) and most non-weld zone (11h), these weld zones (11g) are adjacent arrangement with these non-weld zones (11h), and above-mentioned respectively this weld zone (11g) can be a weld pad.
This wafer (12), the adhesive bottom (11d) of being fixed in this room (11c), the surface of this wafer (12) have most weld pads (12a).
This bonding wire (13) respectively, made by the metal material that conductivity such as aluminium or gold are good, it utilizes a marking device (not shown) to be connected on the weld pad (12a) of this wafer with the one end earlier, the other end is connected to the weld zone (11g) of this supporting body (11) in the horizontal-extending mode again.
This covering (14) has an end face (14a) and a bottom surface (14b), in order to the opening (11f) that seals this room (11c), not polluted by outside destroy or foreign material to protect this wafer (12).
This supporter (15), be formed in one and be convexly set in the periphery of this covering (14) bottom surface (14b), when the opening (11f) of this room (11c) was sealed in this covering (14), this supporter (15) fitted on the some non-weld zone (11h) of this opening (11f) periphery with its lower end.
This adhesive thing (16); be distributed in this covering (14) and this supporting body (11) joining place; in order to this this bonding wire (13) and this contact of this weld zone (11g) respectively respectively of covering protection; and make this covering (14) be fixed in this supporting body (11); and fill the slit of sealing because of these supporters (15) institute's this supporting body that is formed at (11) and this covering (14) joining place, reach the effect that seals this room (11c).
The major function of this jockey (17) is in order to connect respectively this weld zone (11g) on this supporting body (11) to this supporting body (11) outside; This jockey (17) is for being opened in most perforations (17a) of this supporting body (11) periphery in the present embodiment, these perforations (17a) connect the bottom surface (11b) of these weld zones (11g) and this supporting body (11), thus when this structure is adorned on the circuit board that is assembled in an external world, can utilize scolding tin to be connected respectively this perforation (17a), make the circuit of this wafer (12) and the line conduction of this circuit board.
By combinations thereof, the structure dress of this integrated circuit (IC) wafer, when this opening (11f) is sealed in its covering (14), isolation by this supporter (15), can avoid this covering (14) directly to push respectively this bonding wire (13) and the respectively joining place of this weld zone (11g), the linking that destroys its grade causes respectively, and this bonding wire (13) breaks away from respectively this weld zone (11g), and this supporter (15) causes this covering (14) and all intermarginal holes of this opening (11f), can fill up sealing by this adhesive thing (16), keep the sealing effectiveness of this room (11c).
See also shown in Fig. 5,6, the structure dress (20) of the utility model second a kind of integrated circuit (IC) wafer that preferred embodiment provides, it consists predominantly of a supporting body (21), a wafer (22), most bonding wire (23), covering (24), a supporter (25), an adhesive thing (26) and a jockey (27), and itself and last embodiment difference are:
This supporting body (21) includes a plate body (28) and a framework (29), and this plate body (28) has an end face (28a) and a bottom surface (28b), and this end face (28a) is laid with the watertight composition (28c) that a metal material is made; And this framework (29), has an end face (29a), this top is run through in one bottom surface (29b) and, the hollow region of bottom surface (29c), wherein this framework (29) end face (29a) is provided with most weld zone (29d) and non-weld zone (29e), these weld zones (29d) are adjacent arrangement with these non-weld zones (29e), this framework (29) bottom surface (29b) then is fixed on the watertight composition (28c) of this plate body (28) end face (28a), thus, the hollow region (29c) of this framework (29) can form a room (21a) with this plate body (28) end face (28a), uses for this wafer (22) to be installed in.
Secondly, this supporter (25) is made of most projections (25a), the some non-weld zone (29e) that this each projection (25a) is formed in one and is convexly set in this framework (29) end face (29a), when the opening of this room (29d) is sealed in this covering (24), this supporter (25) is to fit on it on some non-weld zone (29e) on this end face (29a), with when this opening is sealed in this covering (24), by the isolation of this supporter (25), can avoid this covering (24) directly to push respectively this bonding wire (23) and the respectively joining place of this weld zone (29e).
Moreover, this jockey (27) is in present embodiment, include and be communicated with the perforation (27a) of this framework (29) end face (29a) weld zone (29d) to this framework (29) bottom surface majority, and most metal pin (27b), respectively an end of this pin (27b) inserts and puts and is fixed between this framework (29) bottom surface (29b) and this plate body (28) end face (28a), and electrically connect with this perforation (27a), it is outside and be bent into reservation shape that respectively the other end of this pin (27b) then is positioned at this supporting body (21).
See also shown in Fig. 7,8, the structure dress (30) of the utility model the 3rd a kind of integrated circuit (IC) wafer that preferred embodiment provides, its bonding wire (33), one that consists predominantly of a supporting body (31), a wafer (32), majority hides (34), a supporter (35), an adhesive thing (36) and a jockey (37), and itself and the main difference of aforementioned each embodiment are:
This supporter (35) is made of the column (35a) of majority, this each column (35a) is fixed on the some non-weld zone (31a) of this supporting body (31) opening periphery with this adhesive thing (36) or other modes, when the room opening of this supporting body (31) is sealed in this covering (34), this supporter (35) is folded between these non-weld zones (31a) and this covering (34), with when the room opening of this supporting body (31) is sealed in this covering (34), by the isolation of this supporter (35), can avoid this covering (34) directly to push respectively this bonding wire (33) and the respectively joining place of this weld zone (31b).
Secondly, this jockey (37) is in present embodiment, include most metal pins (37a), respectively the weld zone (31b) of an end of this pin (37a) and this supporting body (31) electrically connects, and the other end then is positioned at this supporting body (31) outside and is bent into reservation shape.
See also shown in Figure 9, integrated circuit (IC) wafer structure that the utility model the 4th preferred embodiment is provided dress, itself and the main difference of the 3rd embodiment are:
This supporter is a framework (41), have an end face (41a) and a bottom surface (41b), has a hollow region (41c) in this framework, in order to overlapping with this opening, the bottom surface (41b) of this framework (41) convexes with some projections (41d), this framework (41) fits in these non-weld zones with these projections (41d), hole between itself and this supporting body is filled sealing with this binder, the end face (41a) of this covering affixed this framework of applying (41) directly pushes respectively this bonding wire and the respectively joining place of this weld zone to seal this room to avoid this covering.
The above only is the preferable possible embodiments of the utility model, changes so use the equivalent structure that the utility model specification and claim do such as, ought to be included in the claim of the present utility model.
Claims (11)
1. the structure of integrated circuit (IC) wafer dress is characterized in that, includes:
One supporting body has an end face, a bottom surface and a room, and this room has an opening, and this end face is arranged with most weld zones and most non-weld zone in the periphery of this opening, and these weld zones and these non-weld zones are adjacent arrangement;
One wafer is fixedly arranged in this room, and this wafer has most weld pads;
Most bonding wires electrically connect the weld zone on this supporting body and the weld pad of this wafer respectively;
One hides, and seals this room opening;
One supporter is folded on this supporting body end face between the some non-weld zones and this covering.
One adhesive thing is distributed in this covering and this supporting body joining place.
2. according to the structure dress of the described integrated circuit (IC) wafer of claim 1, it is characterized in that wherein this covering has a bottom surface and an end face, this supporter is convexly set in the bottom surface of this covering.
3. according to the structure dress of the described integrated circuit (IC) wafer of claim 1, it is characterized in that wherein this supporter is that one is convexly set in the non-weld zone that this opens the supporting body end face.
4. according to the structure dress of the described integrated circuit (IC) wafer of claim 1, it is characterized in that wherein this supporter generally is a framework, has a hollow region in this framework, overlapping with this opening, the bottom surface of this framework convexes with some projections, and this framework fits in these non-weld zones with these projections.
5. according to the structure dress of the described integrated circuit (IC) wafer of claim 1, it is characterized in that wherein this room has a bottom, a sidewall, this side wall ring is around in this bottom peripheral edge, forms this opening in the top of this supporting body bottom surface.
6. according to the structure dress of the described integrated circuit (IC) wafer of claim 1, it is characterized in that, wherein:
This supporting body includes a plate body and a framework, and this plate body has a bottom surface and an end face, and this end face is laid with the watertight composition that a metal material is made;
This framework has the hollow region that an end face, a bottom surface and run through this top, bottom surface, and this framework hollow region and this plate body end face form a room, is installed in for this wafer.
7. adorn according to the structure of the described integrated circuit (IC) wafer of claim 6, it is characterized in that, wherein also include a jockey, it includes and is communicated with the most perforations in this non-weld zone of framework end face to this framework bottom surface, and most metal pins, respectively an end of this pin inserts and puts and is fixed between this framework bottom surface and this plate body end face, and electrically connects with this perforation, and respectively the other end of this pin then is positioned at this supporting body outside and is bent into reservation shape.
8. according to the structure dress of the described integrated circuit (IC) wafer of claim 1, it is characterized in that wherein also include a jockey, this jockey is to electrically connect this supporting body weld zone to this supporting body outside.
9. according to the structure dress of the described integrated circuit (IC) wafer of claim 8, it is characterized in that wherein this jockey is the most perforations that are opened in this supporting body periphery, these perforations connect the bottom surface of these weld zones and this supporting body.
10. adorn according to the structure of the described integrated circuit (IC) wafer of claim 8, it is characterized in that, wherein this connection dress includes most metal pins, and respectively the weld zone of an end of this pin and this supporting body electrically connects, and the other end then is positioned at this supporting body outside and is bent into reservation shape.
11. the structure dress according to the described integrated circuit (IC) wafer of claim 1 is characterized in that wherein this weld zone is a weld pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420065567 CN2708500Y (en) | 2004-06-07 | 2004-06-07 | Structure of IC wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420065567 CN2708500Y (en) | 2004-06-07 | 2004-06-07 | Structure of IC wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2708500Y true CN2708500Y (en) | 2005-07-06 |
Family
ID=34852302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200420065567 Expired - Fee Related CN2708500Y (en) | 2004-06-07 | 2004-06-07 | Structure of IC wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2708500Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102815657A (en) * | 2011-06-08 | 2012-12-12 | 上海巨哥电子科技有限公司 | Packaging structure and packaging method thereof |
| CN104030233A (en) * | 2013-03-04 | 2014-09-10 | 宇芯(马)有限公司 | Top Port Mems Cavity Package |
-
2004
- 2004-06-07 CN CN 200420065567 patent/CN2708500Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102815657A (en) * | 2011-06-08 | 2012-12-12 | 上海巨哥电子科技有限公司 | Packaging structure and packaging method thereof |
| CN102815657B (en) * | 2011-06-08 | 2015-10-21 | 上海巨哥电子科技有限公司 | A kind of encapsulating structure and method for packing thereof |
| CN104030233A (en) * | 2013-03-04 | 2014-09-10 | 宇芯(马)有限公司 | Top Port Mems Cavity Package |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050706 Termination date: 20110607 |