CN2705473Y - Electroplating V-shape base for increasing conductivity - Google Patents
Electroplating V-shape base for increasing conductivity Download PDFInfo
- Publication number
- CN2705473Y CN2705473Y CN 200420022188 CN200420022188U CN2705473Y CN 2705473 Y CN2705473 Y CN 2705473Y CN 200420022188 CN200420022188 CN 200420022188 CN 200420022188 U CN200420022188 U CN 200420022188U CN 2705473 Y CN2705473 Y CN 2705473Y
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- China
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- negative electrode
- shape base
- conducting block
- additional conductive
- contact
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Abstract
The new shape of this practicality relates to a kind of plating V-shape base that strengthens conductivity, it comprises the negative electrode V-shape base near the negative electrode conducting block, be characterized in, on negative electrode V-shape base, be equipped with a pair of additional conductive contact rod at least near negative electrode conducting block both sides, the auxiliary contact surface of additional conductive contact rod and the side of negative electrode conducting block are close to, be with spring on the additional conductive contact rod, and be connected with the elasticity copper bar.Owing to increase at least one pair of elastic floating additional conductive contact in former negative electrode conducting block both sides, auxiliary contact closely contacted with the negative electrode conducting block by spring force.Therefore its advantage is: multiple spot, small area and elastic floating contact, make each auxiliary contact can both be close to the cathode rod conducting block, the actual contact face can be reached or greater than theory contact area long-pending 50%, under the situation that does not increase V-shape base, conductivity improves a lot, and makes the V-shape base structure seem very compact, reasonable.
Description
Technical field
The new shape of this practicality relates to a kind of plating V-shape base, particularly a kind of plating V-shape base that strengthens conductivity.
Background technology
Electroplating industry at present adopts V-shape base to finish the location and the conduction work of plating piece as negative electrode usually, size according to the weight decision negative electrode V-shape base of electroplating required strength of current and plating piece, when big and plating piece weight is heavier when strength of current, the also corresponding increase of negative electrode V-shape base.According to electroplating technology requirement, plating work is under low voltage, big current situation, electric current can reach amperes up to ten thousand sometimes, the bigger contact surface of need just between cathode rod conducting block and the negative electrode V-shape base.Normally, solve the problem that strengthens conductivity to strengthen conductive contact surfaces with increasing V-shape base.But the real work situation is to increase the negative electrode V-shape base except that improving bearing capacity and radiating effect, has little effect to strengthening the conductivity aspect.Its reason is: 1. coating bath all adopts welding forming on the electroplating technology streamline, the locating surface of negative electrode V-shape base can not carry out its surface accuracy that guarantees of mechanical cutting processing on the coating bath, can only adjust the relative position of each negative electrode V-shape base when mounted, so not only installation difficulty is very high, and is difficult to guarantee required relative position precision requirement; 2. an electroplating technology streamline has a lot of root cathode rods, and its rod shaped structure will keep consistency very difficult, and cathode rod in use also can be out of shape, and has increased the negative electrode V-shape base though cause, and its contact surface increases seldom.Draw according to the experiment detection: under the situation of above-mentioned processing and installation method, the actual contact face has only 15% of theoretical numerical value.
Summary of the invention
The purpose of the new shape of this practicality is in order to overcome at present because plating V-shape base and cathode rod conducting block real contact area are less, and the shortcoming that conductivity is relatively poor provides a kind of increase to assist point of contact, to strengthen the plating V-shape base of conductivity.
The technical scheme of the new shape of this practicality is: a kind of plating V-shape base that strengthens conductivity, it comprises the negative electrode V-shape base near the negative electrode conducting block, be characterized in, on negative electrode V-shape base, be equipped with a pair of additional conductive contact rod at least near negative electrode conducting block both sides, the auxiliary contact surface of additional conductive contact rod and the side of negative electrode conducting block are close to, be with spring on the additional conductive contact rod, and be connected with the elasticity copper bar.
Because structure of the present utility model is to increase at least one pair of elastic floating additional conductive contact rod in former negative electrode conducting block both sides, and the auxiliary contact surface of auxiliary contact rod is closely contacted with the negative electrode conducting block.Therefore the beneficial effects of the utility model are: multiple spot, small area and elastic floating contact, make each auxiliary contact can both be close to the cathode rod conducting block, the actual contact face can be reached or greater than theory contact area long-pending 50%, under the situation that does not increase V-shape base, conduction intensity and performance improve a lot, and make the V-shape base structure seem very compact, reasonable.
Description of drawings
Fig. 1 is the utility model structural representation.
Embodiment
Shown in 1, a kind of plating V-shape base that strengthens conductivity, it comprises the negative electrode V-shape base 1 near negative electrode conducting block 2, be characterized in, on negative electrode V-shape base 1, be equipped with a pair of additional conductive contact rod 5 at least near negative electrode conducting block 2 both sides, the auxiliary contact surface 4 of additional conductive contact rod 5 is close to the side of negative electrode conducting block 2, is with spring 6 on the additional conductive contact rod 5, and is connected with elasticity copper bar 7.3 is the V-type contact surface among the figure.In force, the conductive current summation of auxiliary contact is controlled at about 40% of total current, in order to take into account heat radiation and to conduct electricity both.
Claims (1)
1. plating V-shape base that strengthens conductivity, it comprises the negative electrode V-shape base (1) near negative electrode conducting block (2), it is characterized in that, on negative electrode V-shape base (1), be equipped with a pair of additional conductive contact rod (5) at least near negative electrode conducting block (2) both sides, the auxiliary contact surface (4) of additional conductive contact rod (5) is close to the side of negative electrode conducting block (2), be with spring (6) on the additional conductive contact rod (5), and be connected with elasticity copper bar (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420022188 CN2705473Y (en) | 2004-04-23 | 2004-04-23 | Electroplating V-shape base for increasing conductivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420022188 CN2705473Y (en) | 2004-04-23 | 2004-04-23 | Electroplating V-shape base for increasing conductivity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2705473Y true CN2705473Y (en) | 2005-06-22 |
Family
ID=34849128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200420022188 Expired - Fee Related CN2705473Y (en) | 2004-04-23 | 2004-04-23 | Electroplating V-shape base for increasing conductivity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2705473Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102011170A (en) * | 2010-07-06 | 2011-04-13 | 无锡出新环保设备有限公司 | Water-bath type cooling V-shaped electroplating seat |
| CN102130389A (en) * | 2010-11-04 | 2011-07-20 | 无锡市星亿涂装环保设备有限公司 | Cathode conducting seat |
| CN103806068A (en) * | 2014-02-28 | 2014-05-21 | 成都先进功率半导体股份有限公司 | High-speed plating line plating conductive device |
| CN105714364A (en) * | 2016-03-30 | 2016-06-29 | 河南平高电气股份有限公司 | Cathode conductive seat for electroplating, cathode conductive device for electroplating, and electroplating equipment |
| CN109957829A (en) * | 2019-04-28 | 2019-07-02 | 安泰科技股份有限公司 | Electro-plating roller conductive seat |
-
2004
- 2004-04-23 CN CN 200420022188 patent/CN2705473Y/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102011170A (en) * | 2010-07-06 | 2011-04-13 | 无锡出新环保设备有限公司 | Water-bath type cooling V-shaped electroplating seat |
| CN102011170B (en) * | 2010-07-06 | 2012-06-13 | 无锡出新环保设备有限公司 | Water-bath type cooling V-shaped electroplating seat |
| CN102130389A (en) * | 2010-11-04 | 2011-07-20 | 无锡市星亿涂装环保设备有限公司 | Cathode conducting seat |
| CN103806068A (en) * | 2014-02-28 | 2014-05-21 | 成都先进功率半导体股份有限公司 | High-speed plating line plating conductive device |
| CN103806068B (en) * | 2014-02-28 | 2016-03-02 | 成都先进功率半导体股份有限公司 | A kind of High-speed Electric plate wire electroplating conductive device |
| CN105714364A (en) * | 2016-03-30 | 2016-06-29 | 河南平高电气股份有限公司 | Cathode conductive seat for electroplating, cathode conductive device for electroplating, and electroplating equipment |
| CN105714364B (en) * | 2016-03-30 | 2018-07-03 | 河南平高电气股份有限公司 | A kind of plating cathode conducting seat, plating cathode electric installation and electroplating device |
| CN109957829A (en) * | 2019-04-28 | 2019-07-02 | 安泰科技股份有限公司 | Electro-plating roller conductive seat |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |