CN2701571Y - Buffering laser cutting head - Google Patents
Buffering laser cutting head Download PDFInfo
- Publication number
- CN2701571Y CN2701571Y CN 200420023648 CN200420023648U CN2701571Y CN 2701571 Y CN2701571 Y CN 2701571Y CN 200420023648 CN200420023648 CN 200420023648 CN 200420023648 U CN200420023648 U CN 200420023648U CN 2701571 Y CN2701571 Y CN 2701571Y
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- CN
- China
- Prior art keywords
- cutting head
- focusing
- microscope base
- focus
- ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model provides a buffering laser cutting head. Because the inner sleeve and external sleeve of the focus control are connected in moving, the columnating glass can be loaded into or taken up quickly. Adjusting the focusing ring and the focal change, in addition, the external sleeve of the focus control is compressed on the adjusting ring of the cutting mouth through the buffer spring, so even encountering accident in cutting, the hard breakdown can not be caused. The entirety of the focusing structure is placed in the adjusting ring of the cutting mouth and can automatically reset. So, the laser cutting head has good performance and excellent characteristic against the air current, and the buffering laser cutting head is convenient to operate and can bear 250 bar high-pressure gas simultaneously.
Description
Technical field
The utility model relates to a kind of cutting processing equipment, particularly a kind of laser cutting head.
Background technology
Laser has high brightness, high directivity, high monochromaticity and high coherence's four characteristics, and laser beam can obtain high energy density after focusing on.At present, laser is widely used in cutting, punching, welding and material modification (heat treatment, melting welding etc.) in industry.Wherein, laser cutting accounts for more than 70%.But the main problem of existing laser cutting head has the rigid structure can not buffer protection in unexpected collision process, depends on the damage protection cutting head of ceramic body, and can not reset fast; Focusing lens is safeguarded for the inner-rotary type dismounting needs dismounting cutting head body, very inconvenient; Focus adjustment mode utilizes the screw thread of adjusting cutting head mechanism to realize, poor air-tightness must be recalibrated the coaxial of cutting head simultaneously; Cutting head and can not bear the high pressure draught of 25BAR, thereby use during cutting inconveniently, influence cutting performance.
Summary of the invention
The purpose of this utility model is the buffering laser cutting head that a kind of energy buffer protection is provided, resets soon and can bears high pressure draught for the deficiency that solves above-mentioned technology.
In order to achieve the above object, buffering laser cutting head provided by the utility model, its water-cooled microscope base is fixed on the Z axle slide carriage, focusing on the microscope base folder is solidly connected with the water-cooled microscope base, focusing on microscope base is placed in the focusing microscope base folder, the outside is compressed by locking piece, the cutting head cavity presss from both sides by being threaded with the focusing microscope base, clamp nut is locked at cutting head adjustment ring on the end face of cutting head cavity, cover is connected movingly with focus adjustment overcoat in the focus adjustment, their integral body is placed in the cutting head adjustment ring, the focusing nut is adjusted overcoat by being threaded with focus, and focusing ring is fixed on the focusing nut, and cutting head mechanism is fixed in the focus adjustment and puts, cutting head adjustment jackscrew can be adjusted cutting head adjustment ring and carry out radial displacement, and buffer spring is adjusted overcoat with focus and is pressed on the cutting head adjustment ring.
The buffering laser cutting head that the utility model provides is owing to cover and focus adjustment overcoat in the focus adjustment is connected movingly, thereby can pack into fast or take out focusing lens, in addition, adjust focusing ring and also can adjust the variation of focus, also have, by buffer spring focus is adjusted overcoat and be pressed on the cutting head adjustment ring, like this, when cutting,, can not cause hard breakdown even run into accident yet; The integral body of focusing structure is placed in the cutting head adjustment ring, can automatically reset, and therefore, this laser cutting head function admirable is used easy to operately, has good anti-stream condition, can bear the gases at high pressure of 250BAR simultaneously.
Description of drawings
Fig. 1 is the structural representation of an embodiment of the present utility model.
The specific embodiment
Below in conjunction with description of drawings enforcement of the present utility model is described in further detail.
Referring to Fig. 1, water-cooled microscope base 1 by location mouthful be fixed on the Z axle slide carriage, focus on microscope base folder 3 and fixedly connected with water-cooled microscope base 1.The drawing and pulling type focusing microscope base 2 that one side is furnished with sealing ring is placed in the focusing microscope base folder 3, and outside they can be slidingly matched mutually by housing screw locking, can pack into fast or take out, and like this, replacing or cleaning focusing lens are very convenient.Cutting head cavity 4 presss from both sides 3 by being threaded with focusing on microscope base, and the coupling part is furnished with sealing ring.Clamp nut 5 is locked at cutting head adjustment ring 11 on the end face of cutting head cavity 4, cover 6 was connected movingly with focus adjustment overcoat 7 in focus was adjusted, and their integral body is placed in the cutting head adjustment ring 11, and by a mouthful location, between add sealing ring, start self centering effect.Focusing nut 9 is adjusted overcoat 7 by being threaded with focus, and focusing ring 8 is fixed on the focusing nut 9, like this, adjusts the variation that focusing ring also can be adjusted focus.Cutting head mechanism 10 is fixed on focus and adjusts on the interior cover 6, and cutting head adjustment jackscrew 12 can be adjusted cutting head adjustment ring 11 and carry out radial displacement, makes cutting nozzles coaxial with the focus lamp center.Buffer spring 13 is adjusted overcoat 7 with focus and is pressed on the cutting head adjustment ring 11, like this, when cutting, even run into accident, also can not cause hard breakdown.In addition, the overall structure of above-mentioned focusing is placed in the cutting head adjustment ring 11, by a mouthful location, like this, can reset fast automatically.
Certainly, present embodiment is not limited to the utility model, and every employing analog structure of the present utility model and similar variation thereof all should be listed the protection domain of protection domain claims of the present utility model in.
Claims (1)
1, a kind of buffering laser cutting head, it is characterized in that, its water-cooled microscope base is fixed on the Z axle slide carriage, focusing on the microscope base folder is solidly connected with the water-cooled microscope base, focusing on microscope base is placed in the focusing microscope base folder, the outside is compressed by locking piece, the cutting head cavity presss from both sides by being threaded with the focusing microscope base, clamp nut is locked at cutting head adjustment ring on the end face of cutting head cavity, cover is connected movingly with focus adjustment overcoat in the focus adjustment, their integral body is placed in the cutting head adjustment ring, the focusing nut is adjusted overcoat by being threaded with focus, and focusing ring is fixed on the focusing nut, and cutting head mechanism is fixed in the focus adjustment and puts, cutting head adjustment jackscrew can be adjusted cutting head adjustment ring and carry out radial displacement, and buffer spring is adjusted overcoat with focus and is pressed on the cutting head adjustment ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420023648 CN2701571Y (en) | 2004-06-11 | 2004-06-11 | Buffering laser cutting head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420023648 CN2701571Y (en) | 2004-06-11 | 2004-06-11 | Buffering laser cutting head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2701571Y true CN2701571Y (en) | 2005-05-25 |
Family
ID=34770739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200420023648 Expired - Lifetime CN2701571Y (en) | 2004-06-11 | 2004-06-11 | Buffering laser cutting head |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2701571Y (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100409993C (en) * | 2006-04-06 | 2008-08-13 | 龙岩理尚精密机械有限公司 | Digital-control laser cutting head and method for making same |
| CN102039488A (en) * | 2009-10-14 | 2011-05-04 | 上海团结普瑞玛激光设备有限公司 | Coaxial powder-feeding laser-cladding processing head |
| CN101176947B (en) * | 2006-11-09 | 2011-05-25 | 深圳市大族激光科技股份有限公司 | Laser cutting machine tool and cutting head for laser cutting machine tool |
| CN102500920A (en) * | 2011-11-17 | 2012-06-20 | 奇瑞汽车股份有限公司 | Cutting head |
| CN101634104B (en) * | 2009-08-14 | 2012-06-27 | 武汉金运激光股份有限公司 | Laser cutting head and laser embroidery all-in-one machine using same |
| CN105108354A (en) * | 2015-09-17 | 2015-12-02 | 苏州凯锝微电子有限公司 | Laser cutting head |
| CN105382428A (en) * | 2015-11-24 | 2016-03-09 | 大族激光科技产业集团股份有限公司 | Laser processing device and laser head anti-collision assembly thereof |
-
2004
- 2004-06-11 CN CN 200420023648 patent/CN2701571Y/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100409993C (en) * | 2006-04-06 | 2008-08-13 | 龙岩理尚精密机械有限公司 | Digital-control laser cutting head and method for making same |
| CN101176947B (en) * | 2006-11-09 | 2011-05-25 | 深圳市大族激光科技股份有限公司 | Laser cutting machine tool and cutting head for laser cutting machine tool |
| CN101634104B (en) * | 2009-08-14 | 2012-06-27 | 武汉金运激光股份有限公司 | Laser cutting head and laser embroidery all-in-one machine using same |
| CN102039488A (en) * | 2009-10-14 | 2011-05-04 | 上海团结普瑞玛激光设备有限公司 | Coaxial powder-feeding laser-cladding processing head |
| CN102039488B (en) * | 2009-10-14 | 2013-08-28 | 上海团结普瑞玛激光设备有限公司 | Coaxial powder-feeding laser-cladding processing head |
| CN102500920A (en) * | 2011-11-17 | 2012-06-20 | 奇瑞汽车股份有限公司 | Cutting head |
| CN102500920B (en) * | 2011-11-17 | 2014-08-27 | 奇瑞汽车股份有限公司 | Cutting head |
| CN105108354A (en) * | 2015-09-17 | 2015-12-02 | 苏州凯锝微电子有限公司 | Laser cutting head |
| CN105382428A (en) * | 2015-11-24 | 2016-03-09 | 大族激光科技产业集团股份有限公司 | Laser processing device and laser head anti-collision assembly thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHANGHAI UNITED PRIMA LASER EQUIPMENT CO., LTD. Free format text: FORMER OWNER: TUANJIE BAICHAO DIGITAL CONTROL LASER EQUIPMENT CO., LTD., SHANGHAI Effective date: 20070706 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20070706 Address after: 201188 Shanghai city Minhang District Kunyang Road No. 2019 Patentee after: Shanghai Unity Purui Laser Equipment Co., Ltd. Address before: 201188 Shanghai City Kunyang Road No. 2019 Patentee before: Shanghai Unity Prima Laser Machinery Co., Ltd. |
|
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20140611 Granted publication date: 20050525 |