CN2694477Y - 微型半导体器件封装低弧度引线专用压板 - Google Patents
微型半导体器件封装低弧度引线专用压板 Download PDFInfo
- Publication number
- CN2694477Y CN2694477Y CNU200420026901XU CN200420026901U CN2694477Y CN 2694477 Y CN2694477 Y CN 2694477Y CN U200420026901X U CNU200420026901X U CN U200420026901XU CN 200420026901 U CN200420026901 U CN 200420026901U CN 2694477 Y CN2694477 Y CN 2694477Y
- Authority
- CN
- China
- Prior art keywords
- pressing plate
- semiconductor device
- window
- minisize
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48095—Kinked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12032—Schottky diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
本实用新型涉及一种微型半导体器件封装低弧度引线专用压板。属电子元器件封装技术领域。压板中间横向开设有若干条平行的长腰形窗口1,其特点是长腰形窗口1左右两端部与窗口中心线的夹角α即窗口角为40~50°。这样,焊头Y方向可以运行的行程也就较长,因此能满足微型器件低弧度引线封装的要求。
Description
技术领域:
本实用新型涉及一种微型半导体器件封装低弧度引线专用压板。与封装用引线框架和炉面配合使用。属半导体器件封装技术领域。
背景技术:
封装微型半导体器件是表面组装技术的基础核心。主要用于封装场效应晶体管、肖特基二极管、数字晶体管等产品。其体积小、重量轻、电性能良好,更符合电子产品发展的趋势。
从微型半导体器件侧面示意图图1中可以看出,器件塑封体树脂总高度0.5mm,引线框架3′底部向上打弯深度0.1mm,考虑器件可靠性,金线2′与塑封体树脂表面距离须保留0.1mm,那么在芯片1′厚度100μm±10μm的条件下,要求引线弧高控制在中心值0.1mm±5μm的范围。引线封装过程中所使用压板是形成低弧度引线封装的关键。对于普通器件,由于其尺寸较大,与其相配套使用的压板窗口宽度也较大,虽然其窗口角即长腰形窗口端部与其中心线的夹角α较小,仅为10~15°,但已能满足焊头Y方向运行的行程要求。而对于微型器件采用低弧度引线封装,由于器件引线框架尺寸较小,相应的与其配套使用的压板窗口宽度也较小,仅为0.1mm,如采用传统的压板,由于其窗口角较小,焊头Y方向运行的行程较短,不能有效形成低弧度引线,还容易碰断劈刀。
发明内容:
本实用新型的目的在于克服上述不足,提供一种可以满足微型半导体器件低弧度引线封装要求的专用压板。
本实用新型的目的是这样实现的:一种微型半导体器件封装低弧度引线专用压板,压板中间横向开设有若干条平行的长腰形窗口,其特点是长腰形窗口左右两端部与窗口中心线的夹角α即窗口角为40~50°。这样,焊头Y方向可以运行的行程也就较长,因此能满足微型半导体器件低弧度引线封装的要求。
附图说明:
图1为采用低弧度引线封装的微型半导体器件侧面示意图。
图2为本实用新型压板正视图。
图3为本实用新型压板侧视图。
图4为本实用新型压板背视图。
图5为图2的A-A剖示图。
具体实施方式:
如图2~3,本实用新型为一种微型半导体器件封装低弧度引线专用压板。压板中间横向开设有6条平行的长腰形窗口1,压板正面窗口1周边设置有与窗口上表面平齐的一框形下平台2,下平台2周边向上凸出设置有一框形上平台3,上平台3左右两侧向外延伸凸出设置有连接侧边4,侧边4上开设有连接通孔5。如图4,压板背面窗口1两边横向开设有6条平行的长凹槽6,用于有效压紧器件引线框架。如图5,长腰形窗口1左右两端部与窗口中心线的夹角α即窗口角为40~50°。
Claims (4)
1、一种微型半导体器件封装低弧度引线专用压板,压板中间横向开设有若干条平行的长腰形窗口(1),其特征在于长腰形窗口(1)左右两端部与窗口中心线的夹角α即窗口角为40~50°。
2、根据权利要求1所述的一种微型半导体器件封装低弧度引线专用压板,其特征在于压板背面窗口(1)两边横向开设有若干条平行的长凹槽(6)。
3、根据权利要求1或2所述的一种微型半导体器件封装低弧度引线专用压板,其特征在于压板正面窗口(1)周边设置有与窗口上表面平齐的框形下平台(2),下平台(2)周边向上凸出设置有框形上平台(3),上平台(3)左右两侧向外延伸凸出设置有连接侧边(4)。
4、根据权利要求3所述的一种微型半导体器件封装低弧度引线专用压板,其特征在于侧边(4)上开设有连接通孔(5)。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU200420026901XU CN2694477Y (zh) | 2004-05-09 | 2004-05-09 | 微型半导体器件封装低弧度引线专用压板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU200420026901XU CN2694477Y (zh) | 2004-05-09 | 2004-05-09 | 微型半导体器件封装低弧度引线专用压板 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2694477Y true CN2694477Y (zh) | 2005-04-20 |
Family
ID=34771449
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU200420026901XU Expired - Lifetime CN2694477Y (zh) | 2004-05-09 | 2004-05-09 | 微型半导体器件封装低弧度引线专用压板 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2694477Y (zh) |
-
2004
- 2004-05-09 CN CNU200420026901XU patent/CN2694477Y/zh not_active Expired - Lifetime
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7859089B2 (en) | Copper straps | |
EP2463904A3 (en) | Multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical interconnections | |
WO2008008587A3 (en) | A stacked-die electronics package with planar and three-dimensional inductor elements | |
EP2224482A3 (en) | Integrated leadframe and bezel structure and device formed from same | |
JP2011066327A5 (zh) | ||
WO2006118994A3 (en) | Multi-chip module and method of manufacture | |
JP2013508974A5 (zh) | ||
CN2694477Y (zh) | 微型半导体器件封装低弧度引线专用压板 | |
CN107910313A (zh) | 一种新型半导体封装结构及其封装方法及电子产品 | |
US10840172B2 (en) | Leadframe, semiconductor package including a leadframe and method for forming a semiconductor package | |
CN201804856U (zh) | 表面贴装型半导体元件 | |
CN101312112B (zh) | 芯片封装外引线成型模具 | |
CN210245488U (zh) | 非接触式上下芯片封装结构 | |
CN201527969U (zh) | 集成电路封装中引线框及基岛结构 | |
CN203085519U (zh) | 一种芯片引线框架 | |
CN2694478Y (zh) | 微型半导体器件封装低弧度引线专用炉面 | |
US7977776B2 (en) | Multichip discrete package | |
CN101483168B (zh) | 基于金属框架的模塑方式sim卡封装结构及其封装方法 | |
CN101447036B (zh) | 一种非接触智能电子标签用微型模块及载带 | |
US20060197199A1 (en) | Leadframe, coining tool, and method | |
US20110062569A1 (en) | Semiconductor device package with down-set leads | |
CN202434503U (zh) | 一种dip10集成电路器件及引线框、引线框矩阵 | |
CN213905352U (zh) | 一种可用于二极管或三极管生产用的引线框架 | |
CN201804855U (zh) | 表面贴装型半导体装置 | |
CN2692833Y (zh) | 一种用于薄型芯片模塑封装的条带 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CX01 | Expiry of patent term |
Expiration termination date: 20140509 Granted publication date: 20050420 |