CN2689586Y - MEMS miniature piezoelectric drivers - Google Patents
MEMS miniature piezoelectric drivers Download PDFInfo
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- CN2689586Y CN2689586Y CN 200420007142 CN200420007142U CN2689586Y CN 2689586 Y CN2689586 Y CN 2689586Y CN 200420007142 CN200420007142 CN 200420007142 CN 200420007142 U CN200420007142 U CN 200420007142U CN 2689586 Y CN2689586 Y CN 2689586Y
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Abstract
The utility model discloses an MEMS miniature piezoelectric driver which can generate large vertical displacement, belonging to the microelectron mechanical field. The two ends or the middles of suspension elastic beams are connected by a short transverse beam, a driver of a symmetric parallel cascade over beam structure is formed corresponding to a symmetry axis X, the middle parts of the over beams of the two outer sides of the driver is connected with a substrate via a short transverse beam connected with the substrate to form a fixed end, and the number of the over beams of the parallel cascade can be equal with or larger than the integral number of 3. Multilayered film compound piezoelectric units on each suspension elastic beam are symmetrically distributed by a symmetry axis Y to form a large vertical displacement piezoelectric driver which is in progressive multilevel, and the piezoelectric driving displacement is increased. The utility model can diminish the length of the driving structure in a microelectron mechanical system, the driving voltage is reduced, and major driving force is provided. The utility model which is suitable to be volume-produced is simple in structure, high in device stability, simple in process, easy in manufacturing and higher in rate of finished products.
Description
Technical field
The utility model belongs to the microelectron-mechanical field, particularly can realize the miniature piezoelectric driver of a kind of MEMS that big vertical displacement drives on microchip.
Background technology
Along with progress of science and technology, systems such as electronics, machinery develop towards miniaturization, microminiaturized direction, the high density of chip, multi-functional, the intelligent integrated important directions that becomes people's research.In recent ten years, based on large scale integrated circuit manufacturing technology and the exclusive special process of micromachining technology, realize the multi-functional integrated of MIniature machinery structure, miniature actuator, microelectronic component and circuit system, form so-called microelectromechanical systems (MicroElectroMachanical System, be called for short MEMS), or micro-system (Microsystem).The progress of this microsystems technology makes the ic manufacturing technology based on advanced person's semiconductor technology develop into manufacturing sophisticated electronic mechanical system on microchip, forms SOC (system on a chip) integrated (SOC).With microminiaturized, integrated, intelligent, information-based, advanced person is fabricated to the MEMS technology of characteristics from being designed into manufacturing, not only based on little electricity technology, and relate to many technology-oriented disciplines such as computer technology, the communication technology, microelectric technique, automatic control technology, Machine Design and manufacturing, can be described as the complex art of a multidisciplinary intersection.Based on complicated micro-system such as the microsensor of MEMS technology, miniature actuator, micro-optical systems, radio system, microbe chip, microfluidic device, stereo integrated circuit, the existing considerable industries such as industry, military affairs, biology, medical science that are applied to.
At present, physical principles such as static, electromagnetism, heat, piezoelectricity, marmem extensively are applied to MEMS actuator and driver.Advantages such as electrostatic and piezoelectric type microactrator has the precision height, do not generate heat, response speed is very fast.Through people's unremitting effort and broad research for many years, the static microactrator has become the vitals that MEMS drives, and simultaneously, the application of other little execution mechanism also obtains deep research.But, utilize existing little execution architecture of these principles generally to have big driver size, take more chip area, and the vertical drive displacement that realizes on substrate is limited, complex manufacturing technology, reliability are not high, and power consumption is big, and the life-span is short.In being subjected to the MEMS piezoelectric membrane type of drive of broad research, adopt cantilever beam structure mostly, because the elongation of piezoelectric membrane is limited, so the maximum deflection displacement on the cantilever beam structure is very limited, simultaneously, be driven structure and when realizing vertical displacement, also be accompanied by lateral shift and rotation.This feature limits the extensive use of Piezoelectric Driving mode in the MEMS field, the ripe MEMS commercialized device that causes present employing piezoelectric membrane to drive seldom occurs.This cantilever Drive Structure will realize big vertical displacement, require to increase the length of beam and increase driving voltage, so just one side has increased the cantilever beam static deflection amount that is caused by gravity, when causing not making alive, cantilever promptly has big yaw displacement, seriously limits its range of application.On the other hand, the straight cantilever beam Drive Structure of this length significantly reduces the mechanical vibration strength of driver, is easy to generate jitter phenomenon in the work, and very easily is hit and fractures.In addition, the straight cantilever Drive Structure of the list of this length has increased the inertia effects of cantilever itself, makes the operating frequency of driver very low, the application scenario that the many operating frequencies of incompatibility are higher.In addition, for obtaining big displacement, high driving voltage very easily causes piezoelectric membrane to puncture, and to the quality proposition higher requirement of piezoelectric membrane, has increased the technology difficulty of piezoelectric membrane deposit.High driving voltage brings many additive effects to piezoelectric membrane simultaneously, and has increased the complexity of corresponding electronic circuit.At manufacture view, the long cantilever that easily shakes significantly increases the complexity of manufacturing, reduces the rate of finished products of micromachined.Long driver length also makes it be difficult to the application of adaptation in some micro structural components or device array.These have all seriously limited the application of cantilever beam piezoelectric actuator in microelectronic mechanical devices and system.
Summary of the invention
The purpose of this utility model provides the miniature piezoelectric driver of a kind of MEMS, it is characterized in that: two ends or centre at suspension spring beam 1 connect through tail trimmer 1, become symmetry cascade suspension beam structure side by side with respect to the symmetry axis X-shaped, structure on two sides is identical, and the overarm middle part in driver two outsides links to each other with substrate by substrate connection tail trimmer 4 and forms stiff end; In each overarm, be symmetry axis with the central vertical bisector Y of length direction, segmented deposition is pressed multilayer film composite piezoelectric unit 2 symmetrically, and every section multilayer film composite piezoelectric unit 2 forms the driver element that utilizes piezoelectric effect with following suspension spring beam 1; Multilayer film composite piezoelectric unit 2 on every suspension spring beam 1 is symmetrically distributed with symmetry axis Y, and the multilayer film composite piezoelectric unit 2 of each side can be 2,4,6 or 8, in whole Drive Structure, on the suspension spring beam 1 of symmetry axis X both sides, apply voltage with symmetric mode, in each side of symmetry axis X, each suspension spring beam 1 applies opposite polarity voltage with the upper and lower electrode of the multilayer film composite piezoelectric unit of the same side contiguous suspension spring beam 1 same position; Upper and lower electrode in the contiguous multilayer film composite piezoelectric of upper and lower electrode layer and its same side unit of each multilayer film composite piezoelectric unit of each side of symmetry axis Y applies opposite polarity voltage; Simultaneously, two the most contiguous upper and lower electrodes in multilayer film composite piezoelectric unit apply the voltage of identical polar in symmetry axis Y both sides.
Described multilayer film composite piezoelectric unit is on elastic film beam 1, resilient coating 5 is arranged from bottom to up, mutually unconnected mea layers 6 down, piezoelectric layer 7 and upper film electrode layer 8 complex superposition with multilayer film composite piezoelectric unit 2 of definite shape form, can also cover one deck insulating medium layer 9 at the upper electrode film laminar surface, top electrode lead-in wire 10, bottom electrode lead-in wire 11 are connected with upper film electrode layer 8, following mea layers 6 respectively.
The number of the overarm of described cascade arranged side by side can be for being equal to or greater than 3 integer.
Described piezoelectric layer 7 can be a kind of piezoelectric among PZT, PLZT, ZnO, AlN, the PVDF or is combined into the composite membrane of the piezoelectricity Seed Layer of multi-layer piezoelectric film or piezoelectric membrane and deposit in advance by more than one piezoelectric.
Described suspension spring beam 1 can be the compound tunic of one or more elastomeric materials in monocrystalline silicon, polysilicon, silicon dioxide, amorphous silicon, the silicon nitride.
Two the most contiguous multilayer film composite piezoelectric unit 2 of described symmetry axis Y both sides can couple together, and form a big multilayer film composite piezoelectric unit.
The beneficial effects of the utility model are to adopt a kind of suspension Drive Structure of the multistage cascade of going forward one by one to realize big vertical displacement.Effectively shortened the length of driver, made it can save device area significantly in some applications; Reduced driving voltage; Improve the operating frequency of driver, had good device drive performance.Simultaneously, it is simple in structure, has very high device reliability, and technology is simple, and easily processing has higher fabrication yield, is fit to produce in batches.
Description of drawings:
Fig. 1 for the suspension spring beam and on multilayer film composite piezoelectric cell schematics.
The activation configuration schematic diagram of Fig. 2 for constituting by four suspension flexible drive beams.
The activation configuration schematic diagram of Fig. 3 for constituting by three suspension flexible drive beams.
Fig. 4 is a multilayer film composite piezoelectric cellular construction schematic diagram.
Embodiment
The utility model provides the miniature piezoelectric driver of a kind of MEMS.At the two ends of suspension spring beam 1 or middlely connect through tail trimmer 3, become symmetry cascade suspension beam structure side by side with respect to the symmetry axis X-shaped, the number of the overarm of cascade can be for being equal to or greater than 3 integer side by side.Symmetry axis X structure on two sides is identical, and the overarm middle part in driver two outsides links to each other with substrate by substrate connection tail trimmer 4 and forms stiff end; In each overarm, be symmetry axis with the central vertical bisector Y of length direction, segmented deposition is pressed multilayer film composite piezoelectric unit 2 symmetrically, and every section multilayer film composite piezoelectric unit 2 forms the driver element that utilizes piezoelectric effect with following suspension spring beam 1; Multilayer film composite piezoelectric unit 2 on every suspension spring beam 1 is symmetrically distributed with symmetry axis Y, and the multilayer film composite piezoelectric unit 2 of each side can be 2,4,6 or 8, in whole Drive Structure, on the suspension spring beam 1 of symmetry axis X both sides, apply voltage with symmetric mode, in each side of symmetry axis X, each suspension spring beam 1 applies opposite polarity voltage with the upper and lower electrode of the multilayer film composite piezoelectric unit of the same side contiguous suspension spring beam 1 same position; Upper and lower electrode in the contiguous multilayer film composite piezoelectric of upper and lower electrode layer and its same side unit of each multilayer film composite piezoelectric unit of each side of symmetry axis Y applies opposite polarity voltage; Simultaneously, two the most contiguous upper and lower electrodes in multilayer film composite piezoelectric unit apply the voltage (as shown in Figure 1 and Figure 2) of identical polar in symmetry axis Y both sides.
Above-mentioned piezoelectric layer 7 can be a kind of piezoelectric among PZT, PLZT, ZnO, AlN, the PVDF or is combined into the composite membrane of the piezoelectricity Seed Layer of multi-layer piezoelectric film or piezoelectric membrane and deposit in advance by more than one piezoelectric.
Above-mentioned suspension spring beam 1 can be the compound tunic of one or more elastomeric materials in monocrystalline silicon, polysilicon, silicon dioxide, amorphous silicon, the silicon nitride.
Two the most contiguous multilayer film composite piezoelectric unit 2 of described symmetry axis Y both sides can couple together, and form a big multilayer film composite piezoelectric unit (as Fig. 3, shown in Figure 5).
Figure 7 shows that multilayer film composite piezoelectric unit is on elastic film beam 1, resilient coating 5 is arranged from bottom to up, mutually unconnected mea layers 6 down, piezoelectric layer 7 and upper film electrode layer 8 complex superposition with multilayer film composite piezoelectric unit 2 of definite shape form, can also cover one deck insulating medium layer 9 at the upper electrode film laminar surface, top electrode lead-in wire 10, bottom electrode lead-in wire 11 are connected with upper film electrode layer 8, following mea layers 6 respectively.
Figure 1 shows that the situation of an elasticity overarm.
The elasticity overarm is gone up and is formed four piezoceramic multilayer film unit A, B, C, D.Wherein, A, B and C, D are with respect to central symmetry axis Y symmetry.If apply identical voltage between the upper/lower electrode of piezoceramic multilayer film unit A, C, and it is identical to apply size between B, D upper/lower electrode, the polarity opposite voltage.Then whole overarm can produce bending.
If elasticity overarm unit shown in Figure 1 is connected into three beams (as shown in Figure 3), four beam drivers (as shown in Figure 2) through tail trimmer 3, then whole driver is with respect to symmetry axis X symmetry.Driver connects tail trimmer 4 by substrate and links to each other with substrate.Because of driver with respect to the X-axis symmetry, so if the corresponding upper and lower electrode of piezoceramic multilayer film applies the voltage and the load of symmetry in the overarm of X-axis both sides, then the malformation of symmetry axis X both sides and displacement are identical.
Claims (4)
1. the miniature piezoelectric driver of a MEMS is characterized in that: at the two ends of suspension spring beam (1) or middlely connect through tail trimmer (3), become the symmetry driver of cascade suspension beam structure side by side with respect to the symmetry axis X-shaped; Symmetry axis X structure on two sides is identical, and the overarm middle part in driver two outsides links to each other with substrate by substrate connection tail trimmer (4) and forms stiff end; In each overarm, central vertical bisector Y with length direction is a symmetry axis, segmented deposition is pressed multilayer film composite piezoelectric unit (2) symmetrically, and every section multilayer film composite piezoelectric unit (2) forms the driver element that utilizes piezoelectric effect with following suspension spring beam (1); Multilayer film composite piezoelectric unit (2) on every suspension spring beam (1) is symmetrically distributed with symmetry axis Y, and the multilayer film composite piezoelectric unit (2) of each side can be 2,4,6 or 8, in whole Drive Structure, suspension spring beam (1) in symmetry axis X both sides upward applies voltage with symmetric mode, in each side of symmetry axis X, each suspension spring beam (1) applies opposite polarity voltage with the upper and lower electrode of the multilayer film composite piezoelectric unit of contiguous suspension spring beam (1) same position in the same side; Upper and lower electrode in the contiguous multilayer film composite piezoelectric of upper and lower electrode layer and its same side unit of each multilayer film composite piezoelectric unit of each side of symmetry axis Y applies opposite polarity voltage; Simultaneously, two the most contiguous upper and lower electrodes in multilayer film composite piezoelectric unit apply the voltage of identical polar in symmetry axis Y both sides.
2. according to the miniature piezoelectric driver of the described MEMS of claim 1, it is characterized in that: described piezoceramic multilayer film, every section piezoelectricity composite multi-layer film unit is on the elastic film beam, resilient coating (5) is arranged from bottom to up, unconnected mutually mea layers (6) down, piezoelectric layer (7) and upper film electrode layer (8) complex superposition with multilayer film composite piezoelectric unit (2) of definite shape form, can also cover one deck insulating medium layer (9) at the upper electrode film laminar surface, top electrode lead-in wire (10), bottom electrode lead-in wire (11) respectively with upper film electrode layer (8), following mea layers (6) connects.
3. according to the miniature piezoelectric driver of the described MEMS of claim 1, it is characterized in that: the number of the overarm of described cascade arranged side by side can be for being equal to or greater than 3 integer.
4. according to the miniature piezoelectric driver of the described MEMS of claim 1, it is characterized in that: the most contiguous two multilayer film composite piezoelectric unit (2), described symmetry axis Y both sides can couple together, and form a big multilayer film composite piezoelectric unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420007142 CN2689586Y (en) | 2004-03-18 | 2004-03-18 | MEMS miniature piezoelectric drivers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420007142 CN2689586Y (en) | 2004-03-18 | 2004-03-18 | MEMS miniature piezoelectric drivers |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1317815C (en) * | 2004-03-18 | 2007-05-23 | 清华大学 | Mini piezoelectric drive for MEMS |
| CN101093966B (en) * | 2006-06-23 | 2010-12-22 | 株式会社东芝 | Piezoelectric driven mems device |
| CN101510486B (en) * | 2009-03-24 | 2011-01-05 | 中北大学 | Micro actuation switch |
| CN114735179A (en) * | 2022-04-24 | 2022-07-12 | 南京航空航天大学 | Imitative cuttlefish wave fin based on piezoelectric fiber composite drive |
-
2004
- 2004-03-18 CN CN 200420007142 patent/CN2689586Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1317815C (en) * | 2004-03-18 | 2007-05-23 | 清华大学 | Mini piezoelectric drive for MEMS |
| CN101093966B (en) * | 2006-06-23 | 2010-12-22 | 株式会社东芝 | Piezoelectric driven mems device |
| CN101510486B (en) * | 2009-03-24 | 2011-01-05 | 中北大学 | Micro actuation switch |
| CN114735179A (en) * | 2022-04-24 | 2022-07-12 | 南京航空航天大学 | Imitative cuttlefish wave fin based on piezoelectric fiber composite drive |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050330 Termination date: 20100318 |