CN2681531Y - Packaging structure for electronic card - Google Patents
Packaging structure for electronic card Download PDFInfo
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- CN2681531Y CN2681531Y CN 200420004942 CN200420004942U CN2681531Y CN 2681531 Y CN2681531 Y CN 2681531Y CN 200420004942 CN200420004942 CN 200420004942 CN 200420004942 U CN200420004942 U CN 200420004942U CN 2681531 Y CN2681531 Y CN 2681531Y
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- plastic frame
- frame body
- conductive shell
- electronic cards
- vertical tabs
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Abstract
The utility model relates to a packaging structure for an electronic card, which carries out packaging in an embedding processing mode and comprises a plastic frame body, a first electric conduction shell from the edge of which a plurality of vertical folding sheets extend, and a second electric conduction shell from the edge of which a plurality of vertical folding sheets also extend, wherein, the plastic frame body and each electric conduction shell are singly shaped, the plastic frame body and the electric conduction shell which are singly shaped cause plastics of the plastic frame body to overflow into the vertical folding sheets in the embedding processing mode. The electric conduction shells are fixed in the plastic frame body in order to form a packaging box body for the electronic card.
Description
Technical field
The utility model is about a kind of encapsulating structure, refers to a kind of encapsulation structure-improved of electronic cards especially.
Background technology
At present common electronic cards is used very wide, and the trend of miniaturization is gradually arranged, such as data card (modern card), network card (Local Area Network card, LAN card) and storage card (memory card) or the like.The common international standards of electronic cards have pcmcia card and flash memory cards (Compact Flash card, CF card) and safe digital card (secure digital card) etc., and new specification standards are also constantly in the middle of development.Though the details of these standards is variant, but its encapsulating structure is then roughly the same, it mainly comprises a box body (case) in order to seal a printed circuit board (PCB) (PCB), and this box case must have conductivity, and has an earth terminal (ground), so that electronic cards is when inserting in the slot (slot) of electronic installation, this earth terminal can be connected with system earth (system reference) end of electronic installation.
The encapsulation of electronic cards must provide enough mechanical strength and electric property, it must meet some certain criteria (standard) standard at least, and its encapsulating structure also need be applicable to encapsulation procedure, so can manufacture in a large number, and adapt to the requirement of relevant cost.Traditional encapsulating structure is to utilize plastic frame (plastic frame) clamping one printed circuit board (PCB), again with folder/tool (tool) riveted two conductive shells (metal cover) up and down, and then seals this plastic frame and printed circuit board (PCB).But this kind electronic cards encapsulating structure can't make conductive shell and plastic frame combine closely, thereby when electronic cards is subjected to external force or the effect of deflection strength, conductive shell just is easy to loosening and comes off, moreover, utilize its mechanical strength of the formed structure of riveted relatively poor, in the riveted process, just be very easy to cause the conductive shell distortion.
Though industry also has with viscose bonding or embedding ejaculation modes such as (insert molding) to come in conjunction with conductive shell and plastic frame at present, but because the standard specification of existing electronic cards trends towards slender type, therefore when electronic cards is subjected to external force or the effect of deflection strength, the phenomenon that the zone that engages between plastic frame and the conductive shell just can cause conductive shell to separate with plastic frame because of the bed knife quantity not sufficient easily.Especially, use the manufacturing method thereof that embeds ejaculation (insert molding) need develop required mould in advance in conjunction with conductive shell and plastic frame, just need the many expenses of cost at first step, required time of certain whole processing procedure also because of need earlier with conductive shell and mould accurately contraposition could again plastics be injected in the mould with conductive shell is chimeric and understand relative increase, this has all intangibly increased many manufactured materialss, therefore the cost of manpower and time, utilizing tradition to embed to penetrate (insert molding) to come method in conjunction with conductive shell and plastic frame is not meet economic benefit and market is required really.About the technology of this part, can be with reference to United States Patent (USP) card numbers the 5th, 379, No. 587, the 5th, 475, No. 919 and the 5th, 490, No. 891, in addition, also can be with reference to Taiwan patent announcement number No. 482305, No. 471673 and No. 549688.
Therefore, how to develop a kind of above-mentioned known technology defective of improving, and the encapsulating structure of the electronic cards of fixing between energy reinforced plastics frame and conductive shell, real in pressing for the problem of solution at present.
Summary of the invention
Main purpose of the present utility model is to provide a kind of encapsulating structure of electronic cards, it mainly is to utilize implantation modes such as ultrasonic wave or high frequency waves, the plastic frame body of independent moulding and the conductive shell of moulding separately are joined together, so that the encapsulating structure of this kind electronic cards can be finished manufacturing under the time in less manufacturing cost and processing procedure, and then avoid tradition to imbed many defectives that fit dimension requires embedding in the accurate plastics-production mould to penetrate the electronic cards encapsulating structure that (insert molding) method finishes taking place with the conductive shell of moulding earlier separately.Simultaneously, to solve the conventional package structure when influenced by external force or deflection strength, cause plastic frame body to separate easily and problem such as recurring structure is loosening, mechanical strength is not good or conductive shell comes off with conductive shell.
To achieve these goals, the utility model provides a kind of electronic cards encapsulating structure, and it is implanted processing mode by one and encapsulates, and it comprises: the plastic frame body of an independent moulding; The conductive shell of one first independent moulding, its edge are extended with a plurality of vertical tabs; And the conductive shell of one second independent moulding, its edge is extended with a plurality of vertical tabs; Wherein, this conductive shell is to insert in this plastic frame body by implanting processing mode, and the plastics overflow that the plastic frame body that utilizes independent moulding produces when implanting with the conductive shell of moulding separately flows in this vertical tabs and makes this conductive shell be bonded to this plastic frame body, so as to forming an electronic cards Package boxes.
The encapsulating structure of described electronic cards, wherein this plastic frame body engages with this conductive shell.
The encapsulating structure of described electronic cards, wherein this plastic frame body has an abutting structure, and it is arranged near the opening part of this plastic frame body.
The encapsulating structure of described electronic cards, wherein this abutting structure is the cross bar of a strip, it is fixed in the both sides of this plastic frame body.
The encapsulating structure of described electronic cards, wherein the inside of this plastic frame body has an accommodation space, and in order to a printed circuit board (PCB) to be set, and this printed circuit board (PCB) is this accommodation space inside that is arranged at this plastic frame body by this abutting structure.
The encapsulating structure of described electronic cards, wherein this plastic frame body is one to come down to the framework of square type structure, in order to engage with this conductive shell.
The encapsulating structure of described electronic cards, wherein the inside of this plastic frame body has an accommodation space, in order to a printed circuit board (PCB) to be set.
The encapsulating structure of described electronic cards, wherein the upper and lower surface of this plastic frame body has a groove respectively, so that this vertical tabs is implanted this plastic frame body.
The encapsulating structure of described electronic cards, wherein the vertical tabs of this of this first conductive shell is implanted in the position of this plastic frame body inside for staggered or symmetrical up and down up and down with this vertical tabs of this second conductive shell.
The encapsulating structure of the electronic cards that the utility model provides, it can also by ultrasonic wave implantation mode or a high frequency waves implantation mode encapsulates, and it comprises: the plastic frame body of an independent moulding; One circuit board, it is placed in this plastic frame body; And the conductive shell of an independent moulding, its edge is extended with a plurality of vertical tabs; Wherein, this conductive shell is to insert in this plastic frame body by this ultrasonic wave implantation mode or the implantation of this high frequency waves, the plastics overflow that the plastic frame body that utilizes independent moulding produces when implanting with the conductive shell of moulding separately flows in this vertical tabs and makes this conductive shell be bonded to this plastic frame body, so as to forming an electronic cards Package boxes.
The beneficial effects of the utility model are that the open-celled structure of vertical tabs of conductive shell of the independent moulding of encapsulating structure utilization of electronic cards of the present utility model makes plastic frame body strengthen the strength that the plastic frame body of independent moulding is firmly grasped the conductive shell of independent moulding because of implanting processing mode, therefore not only can not need to penetrate (insert molding) method with traditional embedding again and finish the electronic cards encapsulating structure, significantly reduce complicated required manpower of required expense of mold developing and processing procedure and time, most important, can also be when electronic cards be subjected to external force or deflection strength and influences, make electronic cards not flexible, and the situation that the conductive shell perk can not take place or separate with plastic frame.
Description of drawings
Fig. 1 a is the decomposition texture schematic diagram of encapsulating structure of the electronic cards of the utility model first preferred embodiment;
Fig. 1 b is the combining structure schematic diagram of the utility model first preferred embodiment;
Fig. 1 c is the apex structure schematic diagram of the plastic frame body of the utility model first preferred embodiment;
Fig. 1 d is the bottom structural representation of the plastic frame body of the utility model first preferred embodiment;
Fig. 1 e is the combining structure schematic diagram of encapsulating structure of the electronic cards of the utility model first preferred embodiment;
Fig. 2 is the stereochemical structure decomposing schematic representation of the utility model second preferred embodiment;
Fig. 3 is the STRUCTURE DECOMPOSITION schematic diagram of the utility model the 3rd preferred embodiment.
Wherein, description of reference numerals is as follows:
1111: hole 112: vertical tabs
1121: hole 1122: perforate
12: plastic frame body 121: accommodation space
122: abutting structure 123: groove
124: groove 13: printed circuit board (PCB)
131: 14: the second conductive shells of connector
141: vertical tabs 142: vertical tabs
21 conductive shells, 211 vertical tabs
2111 breach
Conductive shell 32 in 31: the first: plastic frame body
Embodiment
The utility model is a kind of encapsulating structure of electronic cards, it is to implant the plastics overflow that produces when mode or high frequency waves implantation mode allow the plastic frame body of independent moulding implant with the conductive shell of moulding separately by ultrasonic wave to flow in (softening plastics inflow is embedded in) this vertical tabs, so that conductive shell can more closely anchor at plastic frame body, and then solution known technology processing procedure complexity, required cost is high and when influenced by external force or deflection strength, cause the relay deficiency between plastic frame and the conductive shell easily, and recurring structure is loosening or conductive shell perk or problem such as come off.
As shown in Figure 1a, it is the stereochemical structure decomposing schematic representation of the utility model first preferred embodiment.Structure shown in the present embodiment is the encapsulating structure of a storage card, and it is so that ultrasonic wave is implanted or the mode that high frequency waves are implanted makes the conductive shell of independent moulding be bonded to the plastic frame body inside of independent moulding.The main packing component of the encapsulating structure of the storage card of present embodiment comprises first conductive shell 11, plastic frame body 12, circuit board 13 and second conductive shell 14.Wherein, circuit board 13 is good with a printed circuit board (PCB).
First conductive shell 11 is arranged on the top end face of plastic frame body 12, and its edge has the vertical tabs 111,112 of a plurality of downward extensions, and this vertical tabs the 111, the 112nd is by ultrasonic wave is implanted or the mode that high frequency waves are implanted is inserted in the plastic frame body 12.In this embodiment, first conductive shell 11 has two kinds of multi-form vertical tabs 111,112, after making execution implant processing method, the softening plastics of plastic frame body 12 can flow through vertical tabs 111,112, and first conductive shell 11 is adhered together with plastic frame body 12.Shape as for vertical tabs 112 is also unrestricted, as shown in Figure 1a, vertical tabs 112 is except comprising a hole 1121, has the perforate 1122 that caves inward in addition at dual-side, it can make the softening stream of plastic of plastic frame body 12 cross the perforate 1122 that caves inward, and then strengthen the strength that first conductive shell 11 is bonded to plastic frame body 12, therefore when influenced by external force or deflection strength, problem such as plastic frame body and conductive shell will be not can recurring structure become flexible, mechanical strength is not good or conductive shell comes off.
Second conductive shell 14 is arranged on the bottom face of plastic frame body 12, and its edge has the vertical tabs 141,142 of a plurality of downward extensions equally, and this vertical tabs 141,142 is equally by ultrasonic wave is implanted or the mode that high frequency waves are implanted is inserted in the plastic frame body 12.The vertical tabs 141,142 of second conductive shell 14 is identical with the structure of the vertical tabs 111,112 of first conductive shell 11, and its member is given unnecessary details in the back no longer one by one.
Shown in Fig. 1 b, it is the combining structure schematic diagram of first conductive shell and second conductive shell, and as shown in the figure, the vertical tabs 111 of first conductive shell 11 is symmetrical up and down with the position that is provided with of the vertical tabs 141 of second conductive shell 14.And the vertical tabs 112 of first conductive shell 11 makes up with the mode that the vertical tabs 142 of second conductive shell 14 can interlock up and down, with the desired height of the encapsulating structure of saving storage card.Wherein, first conductive shell 11 and second conductive shell 14 are made for good with metal or stainless steel, but not as limit.
Certainly, the vertical tabs of this conductive shell and the shape of open-celled structure thereof be not limited to the utility model for embodiment shown in pattern, for instance, as shown in Figure 2, it is the perspective view of the utility model second embodiment.As shown in Figure 2, the vertical tabs 211 of conductive shell 21 of the present utility model also can be shape arbitrarily, and vertical tabs 211 more can comprise breach 2111, and any this conductive shell that makes is bonded to structure in the plastic frame body, is the scope that the utility model is protected.
As shown in Figure 1a, the inside of the plastic frame body 12 of present embodiment has an accommodation space 121, and has an abutting structure 122 near opening part.Wherein, abutting structure 122 is good with the cross bar of a strip, and it is fixed in the both sides of plastic frame body 12.And accommodation space 121 is mainly in order to the connector 131 that printed circuit board (PCB) 13 is set and the sub-device of powering is pegged graft, and this printed circuit board (PCB) 13 and connector 131 need be fixedly arranged on by abutting structure 122 accommodation space 121 inside of plastic frame body 12.
In addition, the top of plastic frame body 12 and bottom end surface all have the groove of ㄇ font, use for conductive shell and implant.Shown in Fig. 1 a and Fig. 1 c, the top end surface of plastic frame body 12 has groove 123, inserts in the plastic frame body 12 for first conductive shell 11.Same, the bottom end surface of plastic frame body 12 has groove 124 equally, shown in Fig. 1 d, uses for second conductive shell 14 and inserts in the plastic frame body 12.
Shown in Fig. 1 e, it is the combining structure schematic diagram of encapsulating structure of the electronic cards of the utility model first preferred embodiment.This conductive shell is inserted in the plastic frame body 12 by implanting processing mode, and after the conductive shell implantation, the softening plastics of plastic frame body will flow in this vertical tabs, make this conductive shell be bonded to plastic frame body 12, so as to forming an electronic cards Package boxes 10.
As shown in Figure 3, it is the STRUCTURE DECOMPOSITION schematic diagram of the utility model the 3rd preferred embodiment.Structure shown in the present embodiment is the encapsulating structure of a wireless network card, and in this embodiment, the encapsulating structure of wireless network card has first conductive shell 31, second conductive shell 33 and plastic frame body 32.Wherein, the vertical tabs and the open-celled structure thereof of first conductive shell 31 and second conductive shell 33 are identical with first preferred embodiment, and plastic frame body 32 is for coming down to the framework of square type structure, in order to engage with this conductive shell.
Certainly, the shape of electronic cards of the present utility model is not exceeded with " ㄇ " font, rectangle or rectangle, and electronic cards shape now any or standard soon all can be included reference in.
Claims (9)
1. the encapsulating structure of an electronic cards is characterized in that comprising:
One plastic frame body;
One first conductive shell, its edge are extended with a plurality of vertical tabs; And
One second conductive shell, its edge also are extended with a plurality of vertical tabs;
This plastic frame body and described conductive shell are respectively independent moulding, and the vertical tabs of each of described conductive shell is bonded in this plastic frame body by implanting processing mode.
2. the encapsulating structure of electronic cards as claimed in claim 1 is characterized in that this plastic frame body has an abutting structure, and it is arranged near the opening part of this plastic frame body.
3. the encapsulating structure of electronic cards as claimed in claim 2 is characterized in that this abutting structure is the cross bar of a strip, and it is fixed in the both sides of this plastic frame body.
4. the encapsulating structure of electronic cards as claimed in claim 2, the inside that it is characterized in that this plastic frame body has one in order to the accommodation space of a printed circuit board (PCB) to be set, and this printed circuit board (PCB) is arranged at this accommodation space inside of this plastic frame body by this abutting structure.
5. the encapsulating structure of electronic cards as claimed in claim 1 is characterized in that this plastic frame body is one to come down to the framework in order to engage with this conductive shell of square type structure.
6. the encapsulating structure of electronic cards as claimed in claim 5 is characterized in that the inside of this plastic frame body has one in order to the accommodation space of a printed circuit board (PCB) to be set.
7. the encapsulating structure of electronic cards as claimed in claim 1, the upper and lower surface that it is characterized in that this plastic frame body has one respectively makes this vertical tabs implant the groove of this plastic frame body.
8. the encapsulating structure of electronic cards as claimed in claim 1 is characterized in that this vertical tabs of this first conductive shell is implanted in the position of this plastic frame body inside for staggered up and down with this vertical tabs of this second conductive shell.
9. the encapsulation structure-improved of electronic cards as claimed in claim 1, wherein the vertical tabs of this of this first conductive shell and this vertical tabs of this second conductive shell position of being implanted in this plastic frame body inside is symmetry up and down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420004942 CN2681531Y (en) | 2004-03-08 | 2004-03-08 | Packaging structure for electronic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420004942 CN2681531Y (en) | 2004-03-08 | 2004-03-08 | Packaging structure for electronic card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2681531Y true CN2681531Y (en) | 2005-02-23 |
Family
ID=34605746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200420004942 Expired - Fee Related CN2681531Y (en) | 2004-03-08 | 2004-03-08 | Packaging structure for electronic card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2681531Y (en) |
-
2004
- 2004-03-08 CN CN 200420004942 patent/CN2681531Y/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: YOUKA ENTERPRISE CO., LTD Free format text: FORMER OWNER: 3 VIEW TECHNOLOGY CO., LTD. Effective date: 20080718 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20080718 Address after: Taoyuan County, Taiwan, china: Patentee after: Youka enterprise Limited by Share Ltd Address before: Postcode of Taiwan, Hsinchu: Patentee before: Yuancisan Sci-Tech Co., Ltd. |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050223 Termination date: 20100308 |