CN2681215Y - A computer heat sink - Google Patents
A computer heat sink Download PDFInfo
- Publication number
- CN2681215Y CN2681215Y CN 03237660 CN03237660U CN2681215Y CN 2681215 Y CN2681215 Y CN 2681215Y CN 03237660 CN03237660 CN 03237660 CN 03237660 U CN03237660 U CN 03237660U CN 2681215 Y CN2681215 Y CN 2681215Y
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- heat
- radiator
- water tank
- semiconductor refrigeration
- fan
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Abstract
The utility model provides a computer radiating device, which combines the radiating techniques of the existing fan, the semiconductor refrigerator and the series sheet radiator so as to achieve the high radiating effect. A heat exchanger consists of a base, a cap, a water inlet nozzle and a water outlet nozzle, in which a screw type groove is provided, the water outlet nozzle is communicated with the miniature water tank of the semiconductor refrigerating radiator through a miniature water pump, and the miniature water tank is tightly attached with a semiconductor refrigerating sheet on which a radiating sheet is tightly attached.
Description
Technical field: the utility model relates to a kind of heat abstractor of computer.
Background technology: at present, at the cooling measure of each heat generating components of computer, mainly be traditional fan heat radiation and water or heat radiation of other liquid cooling and semiconductor refrigeration radiating, described heat dissipation technology means are single employing.Wherein, the fan heat radiation is that the heat that will pass to heat radiator from euthermic chips such as cpu blows away with the wind that fan produces, and its efficient is poor, the noise height; General water or the heat radiation of other liquid cooling are to bring out by water or other liquid with the heat of a heat exchanger with euthermic chips such as cpu, afterwards, carry out the heat interchange heat radiation by water and air, its effect can because the water yield what and change, so it is the heat dissipation instability, and bulky; Semiconductor refrigeration radiating then is by semiconductor chilling plate the heat of euthermic chips such as cpu to be conducted to fan heating radiator or water or other liquid cooling heating radiator to dispel the heat, its radiating effect is better, but, in case if semiconductor chilling plate generation problem, can not in time heat be taken away, will cause euthermic chips such as cpu to burn because heat can not in time be pulled away.
Summary of the invention: at above-mentioned the deficiencies in the prior art, the utility model proposes a kind of computer radiating apparatus, it combines existing multiple heat dissipation technology, can reach higher radiating effect.This device has following good effect or advantage:
1, heat-sinking capability is strong.The utility model is mainly used in the heat radiation to computer chip, the heat radiation object can be cpu, the motherboard north bridge chips, the video card chip, perhaps other heat generating components, it will have fan heat dissipation technology, semiconductor refrigeration radiating technology and slice radiator heat dissipation technology now and combine, reached very high radiating effect, it can effectively be controlled and be used for to the water of heat generating components heat radiation or the temperature of other liquid, making has reasonable temperature difference relation between heat generating components and the water, effectively control the temperature of heat generating components.Owing to have stronger heat-sinking capability, this heat abstractor can use a plurality of heat exchangers simultaneously, and a plurality of heat generating components in the computer are dispelled the heat.Can deal with the heat radiation needs of high-power, golf calorific value cpu in following one period.
2, peace and quiet.With respect to normally used fan heating radiator, this heat abstractor only uses 1 to 2 low-noise fan, just can reach good heat-radiation effect, thereby quiet.
3, small and exquisite.The water tank of this heat abstractor just plays an effect that conveniently adds water, can not use, compare with normally used water-filled radiator, do not re-use bucket, so, it is small and exquisite many that whole device is wanted, and can put into computer housing inside, reduces computer and additionally take up room because efficient radiating apparatus is installed.Simultaneously, whole device is airtight, and is safer with respect to common water-cooling heat radiating device, can not spill because of the water of bucket and causes dangerous.
4, safety.This device is airtight, not the phenomenon that can leak.Simultaneously, compare, can not cause heat generating components can not be dispelled the heat timely because semiconductor chilling plate burns for this reason and burn with the ordinary semiconductor refrigeration radiating.
5, be used to conduct the water of heat, can replace, such as silicone oil etc. with the heat-conducting liquid of other insulation.
The computer radiating apparatus that the utility model proposes, comprise the members such as minitype water tank in the semiconductor refrigeration radiating device, heat radiator, semiconductor chilling plate, semiconductor refrigeration radiating device of water tank, heat exchanger, micro pump, band fan, architectural feature is: heat exchanger is made up of base and lid and water inlet tap, faucet, in spiral type groove is arranged, its faucet is communicated with minitype water tank in the semiconductor refrigeration radiating device through micro pump, be glued with semiconductor chilling plate on minitype water tank, heat radiator is close on the semiconductor chilling plate.
Described semiconductor refrigeration radiating device can be made up of the heating radiator of two bands semiconductor chilling plate, minitype water tank and heat radiator, two heating radiators are faced mutually with heat radiator and are arranged, the location arrangements perpendicular with these two heating radiators has a fan and a slice radiator, and above-mentioned parts all are contained in the shell; In the enclosure, the position of fan and slice radiator is parallel, two semiconductor refrigeration radiating devices with heat radiator mutually in the face of and and fan perpendicular, air admission hole and venthole are arranged on shell.
Described micro pump can be the Wet-dry water pump, can be installed in the water tank; Minitype water tank and water tank can replace mutually.
Described minitype water tank is made up of base and lid and water inlet tap, faucet, and the U-shaped groove is arranged on the base, and the two ends of groove link to each other with the turnover water nozzle respectively; Fluid sealant or O-ring seal are arranged between base and the lid, and bottom and lid are fixed with screw; Bottom and lid also can be used the bonding or welding of glue; Water inlet tap and faucet can be at ends of base or each at one end also can be all in the side respectively; Can also be arranged on the lid.
Employed semiconductor chilling plate can be the 1-6 sheet in the described heating radiator.
The air admission hole of described heating radiator and venthole can be round, also can the side of being, polygon or other geometric configuration.
The shell of described heating radiator can be a cube, also can be right cylinder, many rhombohedreons or other geometric configuration.
Described radiator shell inside can also increase a fan between semiconductor refrigeration radiating device and venthole.
The heat-conducting cream or the heat conduction cloth that increase heat conductivility can be arranged between the minitype water tank of described semiconductor refrigeration radiating device and the semiconductor chilling plate and between semiconductor chilling plate and the heat radiator.
Description of drawings:
Fig. 1 is a structural principle synoptic diagram of the present utility model.
Fig. 2 is a heat exchanger contour structures synoptic diagram.
Fig. 3 is the left view of Fig. 2.
Fig. 4 is the longitudinal section of base among Fig. 2.
Fig. 5 is the left view of Fig. 4.
Fig. 6 is the front view of semiconductor refrigeration radiating device.
Fig. 7 is the left view of Fig. 6.
Fig. 8 is the front view of heating radiator minitype water tank.
Fig. 9 is the left view of Fig. 8.
Figure 10 is the inner structure synoptic diagram of minitype water tank.
Figure 11 is the A-A cut-open view of Figure 10.
Figure 12 is the reinforced structure left surface view of semiconductor refrigeration radiating device among Fig. 6.
Figure 13 is the reinforced structure front view of semiconductor refrigeration radiating device among Fig. 6.
Figure 14 is the right side view of Figure 13.
Figure 15 is the slice radiator structural representation.
Figure 16 is the left view of Figure 15.
Figure 17 is the synoptic diagram that two semiconductor refrigeration radiating devices are installed relatively with heat radiator.
Figure 18 is the reinforced structural principle synoptic diagram of heating radiator.
Embodiment: be described further in conjunction with the accompanying drawings, but this embodiment is as the novel protection of this use is limited.
Among the figure, the 1st, water tank, the 2nd, heat exchanger, the 3rd, micro pump, the 4th, the semiconductor refrigeration radiating device of band fan, the 5th, fan on the semiconductor refrigeration radiating device 4, the 6th, heat radiator, the 7th, semiconductor chilling plate, the 8th, the minitype water tank in the semiconductor refrigeration radiating device 4, the 9th, the base of heat exchanger 2, the 10th, the lid of heat exchanger 2, the 11st, the water inlet tap of heat exchanger 2, the 12nd, the faucet of heat exchanger 2, the 13rd, the spirality tank of heat exchanger 2 bases the inside, the 14th, the water inlet of minitype water tank 8, the 15th, the water delivering orifice of minitype water tank 8, the 16th, the power lead of semiconductor chilling plate 7, the 17th, the fixing bolt hole of the lid of minitype water tank 8 and base, the 18th, the U type tank on minitype water tank 8 bases, the 19th, the reinforced shell of semiconductor refrigeration radiating device 4, the 20th, slice radiator, the 21st, the fan of the reinforced inside of semiconductor refrigeration radiating device 4, the 22nd, the air admission hole on the shell 19, the 23rd, the venthole on the shell 19,24 be two not with the semiconductor refrigeration radiating device of fan, the 25th, the power interface that semiconductor refrigeration radiating device 4 is reinforced, the 26th, the water pipe of slice radiator 20, the 27th, aluminium flake or the copper sheet of string on water pipe 20.
As shown in Figure 1, water in the water tank 1, under the effect of micro pump 3, the heat exchanger 2 of flowing through, the heat of heat generating components such as cpu in the computer or video card, north bridge is brought out, through semiconductor refrigeration radiating device 4, in semiconductor refrigeration radiating device 4, freezed by semiconductor chilling plate 7 or dispel the heat after get back to water tank 1.When the semiconductor refrigeration radiating device 4, in minitype water tank 8, after heat was freezed by force by semiconductor chilling plate 7, heat was transmitted to heat radiator 6 by semiconductor, blows away through passing through fan 5 with the current of heat.Heat exchanger is by corresponding fastener and cpu and video card, and north bridge chips is close to, and can use heat-conducting cream to increase heat transfer efficiency therebetween.
Fig. 2, in 3,4,5, heat exchanger is made up of base 9 and lid 10, there is the screw type tank 13 of indent the base the inside, the two ends of tank 13 respectively with lid 10 on fixing nozzle and spout 11,12 be communicated with.Water enters in the base through water inlet tap 11, comes out through faucet 12 behind the tank 13 of flowing through.The heat of heat generating components such as cpu or video card, north bridge is given the water of 13 li of the tanks in the screw type loop of flowing through by base 9 conduction in the computer.The water that is flow through is constantly taken away.Use the soldering firm welding between nozzle and spout and the lid 10 and between lid 10 and the base 9, scolding tin has played the effect of fixing and sealing here.
Fig. 6 in 7, with the water of heat, enters from water inlet 14 in the minitype water tank 8 of semiconductor refrigeration radiating device 4, and flow out from water delivering orifice 15 minitype water tank 8 backs of flowing through.Flow through minitype water tank 8 water with heat, under the effect of semiconductor chilling plate 7, be transmitted on the heat radiator 6, the wind that is produced by fan 5 blows away.All scribble heat-conducting cream on two faces of semiconductor chilling plate 7, the one side of its high temperature is close on the heat radiator 6, and the one side of low temperature is close on the minitype water tank 8.
Fig. 8 in 9, connects together through bolt hole 17 with screw after being coated with fluid sealant between the lid of minitype water tank 8 and the base or having used O-ring seal.Semiconductor chilling plate 7 is attached on the base of type water tank 8, and the quantity of semiconductor chilling plate can be one or more.
Figure 10, in 11,18 is the indent U type tank on base, the heat that the water band is given the bases of minitype water tank in the tank 18 back conduction of flowing through.Water is from water inlet 14, and tank 18 backs of flowing through flow away from water delivering orifice 15.
Figure 12,13, reinforced heating radiator shown in 14 is used for the semiconductor refrigeration radiating device 4 of alternate figures 6, it is to remove fan on the basis of semiconductor refrigeration radiating device 4, a same semiconductor refrigeration radiating device and a slice radiator 20 have been increased simultaneously, in addition, between slice radiator and semiconductor refrigeration radiating device, increase a fan 21, the position of slice radiator 20 and fan is for being parallel to each other, and pass, the position of semiconductor refrigeration radiating device and fan is vertical mutually, two semiconductor refrigeration radiating devices that removed fan are faced layout mutually with heat radiator, position relation between them has guaranteed that air can linearly pass through the heat radiator of slice radiator 20 and semiconductor refrigeration radiating device under the effect of fan 21.The parts that air is flowed through in shell 19 are in proper order: two semiconductor refrigeration radiating device 24 → ventholes 23 of air admission hole 22 → slice radiator 20 → fan 21 → face mutually, for increasing radiating effect, can between semiconductor refrigeration radiating device 24 and venthole 23, increase by one and fan 21 similar fans again.Air blows on the slice radiator 20 through air admission hole 22 under the effect of fan 21, by fan 21, blows on the heat radiator of semiconductor refrigeration radiating device 24 afterwards, afterwards, comes out from venthole 23.Water enters from water inlet tap 14, at first flows to slice radiator 20, flows through former and later two semiconductor refrigeration radiating devices 24 again and comes out from faucet 15 afterwards.25 is the power interface of semiconductor chilling plate and fan.22 and 23 shape can be round among the figure, also can the side of being or other geometric scheme.
Figure 15, in 16, slice radiator 20 its styles are the microminiaturization of automobile water tank radiator, its principle of work is: heat in the water is through the water pipe 26 whole slice radiator 20 of flowing through, heat conducts to aluminium flake or the copper sheet 27 of string on copper pipe by the outer wall of water pipe 26, is taken away by the air of heating radiator.The water pipe 26 that is treated to the U type forms the appearance of Figure 17 by aluminium flake or copper sheet 27 by the certain distance string together.
Figure 17 be two not with the side view of fan semiconductor refrigeration radiating device 24 with the relative state arrangement of heat radiator.Flow to back semiconductor refrigeration and heat radiator before water is flowed through earlier after the semiconductor refrigeration radiating device again, flow out afterwards.Two semiconductor refrigeration radiating devices are installed in shell 19 the insides with the relative state of heat radiator.With the water of heat, during the semiconductor refrigeration radiating device, enter minitype water tank 8 before flowing through from water inlet tap 14, water with heat be transmitted to heat radiator 6 by the effect of semiconductor chilling plate 7.The water of minitype water tank 8 of flowing through flows out from water nozzle 15, and the back semiconductor refrigeration and heat radiator of flowing through afterwards dispels the heat again.
Among Figure 18, water with heat, carried out for the first time after the heat radiation through slice radiator 20, be forced to heat radiation before flowing to during radiator for semiconductor again, flow to the back radiator for semiconductor afterwards and be forced to heat radiation again, with the water of heat, through flowing away after above three heat radiations.
Claims (9)
1, a kind of computer radiating apparatus, comprise the members such as minitype water tank in the semiconductor refrigeration radiating device, heat radiator, semiconductor chilling plate, semiconductor refrigeration radiating device of water tank, heat exchanger, micro pump, band fan, it is characterized in that: heat exchanger is made up of base and lid and water inlet tap, faucet, in spiral type groove is arranged, its faucet is communicated with minitype water tank in the semiconductor refrigeration radiating device through micro pump, be glued with semiconductor chilling plate on minitype water tank, heat radiator is close on the semiconductor chilling plate.
2, heat abstractor according to claim 1, it is characterized in that: the semiconductor refrigeration radiating device can be made up of the heating radiator of two bands semiconductor chilling plate, minitype water tank and heat radiator, two heating radiators are faced mutually with heat radiator and are arranged, the location arrangements perpendicular with these two heating radiators has a fan and a slice radiator, and above-mentioned parts all are contained in the shell; In the enclosure, the position of fan and slice radiator is parallel, two semiconductor refrigeration radiating devices with heat radiator mutually in the face of and and fan perpendicular, air admission hole and venthole are arranged on shell.
3, heat abstractor according to claim 1 is characterized in that: micro pump can be the Wet-dry water pump, can be installed in the water tank; Minitype water tank and water tank can replace mutually.
4, heat abstractor according to claim 1 is characterized in that: minitype water tank is made up of base and lid and water inlet tap, faucet, and the U-shaped groove is arranged on the base, and the two ends of groove link to each other with the turnover water nozzle respectively; Fluid sealant or O-ring seal are arranged between base and the lid, and bottom and lid are fixed with screw; Bottom and lid also can be used the bonding or welding of glue; Water inlet tap and faucet can be at ends of base or each at one end also can be all in the side respectively; Can also be arranged on the lid.
5, heat abstractor according to claim 1 is characterized in that: employed semiconductor chilling plate can be the 1-6 sheet in the heating radiator.
6, heat abstractor according to claim 1 and 2 is characterized in that: the air admission hole of heating radiator and venthole can be circular, square or polygon.
7, heat abstractor according to claim 1 and 2 is characterized in that: the shell of heating radiator can be cube, right cylinder or many rhombohedreons.
8, heat abstractor according to claim 1 and 2 is characterized in that: radiator shell inside can also increase a fan between semiconductor refrigeration radiating device and venthole.
9, heat abstractor according to claim 1 and 2 is characterized in that: the heat-conducting cream or the heat conduction cloth that increase heat conductivility can be arranged between the minitype water tank of semiconductor refrigeration radiating device and the semiconductor chilling plate and between semiconductor chilling plate and the heat radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03237660 CN2681215Y (en) | 2003-09-27 | 2003-09-27 | A computer heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03237660 CN2681215Y (en) | 2003-09-27 | 2003-09-27 | A computer heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2681215Y true CN2681215Y (en) | 2005-02-23 |
Family
ID=34598754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03237660 Expired - Fee Related CN2681215Y (en) | 2003-09-27 | 2003-09-27 | A computer heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2681215Y (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104699209A (en) * | 2015-04-03 | 2015-06-10 | 肖海蓉 | Spiral cooling structure of computer |
| CN103098616B (en) * | 2011-11-09 | 2015-11-18 | 潘国明 | Self-propelled melon seed collection machine |
| CN106200845A (en) * | 2016-08-31 | 2016-12-07 | 张鋆 | A kind of desktop cpu chiller |
| CN106249821A (en) * | 2016-08-16 | 2016-12-21 | 陈玮彤 | A kind of computer housing |
| CN110174933A (en) * | 2019-06-04 | 2019-08-27 | 姜海波 | Cabinet cooling device, cabinet and desk |
| CN110320984A (en) * | 2019-07-08 | 2019-10-11 | 合肥金新允电子技术有限公司 | A kind of fan-free built-in industrial control machine |
| CN111091954A (en) * | 2020-01-15 | 2020-05-01 | 苏州海森电器有限公司 | Elevator control transformer |
-
2003
- 2003-09-27 CN CN 03237660 patent/CN2681215Y/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103098616B (en) * | 2011-11-09 | 2015-11-18 | 潘国明 | Self-propelled melon seed collection machine |
| CN104699209A (en) * | 2015-04-03 | 2015-06-10 | 肖海蓉 | Spiral cooling structure of computer |
| CN104699209B (en) * | 2015-04-03 | 2017-11-21 | 陕西理工大学 | Computer spiral heat dissipation structure |
| CN106249821A (en) * | 2016-08-16 | 2016-12-21 | 陈玮彤 | A kind of computer housing |
| CN106200845A (en) * | 2016-08-31 | 2016-12-07 | 张鋆 | A kind of desktop cpu chiller |
| CN110174933A (en) * | 2019-06-04 | 2019-08-27 | 姜海波 | Cabinet cooling device, cabinet and desk |
| WO2020244542A1 (en) * | 2019-06-04 | 2020-12-10 | 姜海波 | Chassis cooling device, chassis, and desktop |
| CN110320984A (en) * | 2019-07-08 | 2019-10-11 | 合肥金新允电子技术有限公司 | A kind of fan-free built-in industrial control machine |
| CN111091954A (en) * | 2020-01-15 | 2020-05-01 | 苏州海森电器有限公司 | Elevator control transformer |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |