CN2667662Y - Heat pipe radiator for integrated circuit - Google Patents
Heat pipe radiator for integrated circuit Download PDFInfo
- Publication number
- CN2667662Y CN2667662Y CN 200320110374 CN200320110374U CN2667662Y CN 2667662 Y CN2667662 Y CN 2667662Y CN 200320110374 CN200320110374 CN 200320110374 CN 200320110374 U CN200320110374 U CN 200320110374U CN 2667662 Y CN2667662 Y CN 2667662Y
- Authority
- CN
- China
- Prior art keywords
- heat
- fin
- heat pipe
- integrated circuit
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005855 radiation Effects 0.000 claims description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- 239000004411 aluminium Substances 0.000 claims description 3
- 230000003416 augmentation Effects 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 239000000741 silica gel Substances 0.000 claims description 2
- 229910002027 silica gel Inorganic materials 0.000 claims description 2
- 238000005245 sintering Methods 0.000 claims description 2
- 238000001816 cooling Methods 0.000 abstract description 8
- 238000005516 engineering process Methods 0.000 abstract description 7
- 238000005266 casting Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000009434 installation Methods 0.000 abstract description 2
- 230000009466 transformation Effects 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- AJDIZQLSFPQPEY-UHFFFAOYSA-N 1,1,2-Trichlorotrifluoroethane Chemical compound FC(F)(Cl)C(F)(Cl)Cl AJDIZQLSFPQPEY-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 238000009740 moulding (composite fabrication) Methods 0.000 description 2
- CYRMSUTZVYGINF-UHFFFAOYSA-N trichlorofluoromethane Chemical compound FC(Cl)(Cl)Cl CYRMSUTZVYGINF-UHFFFAOYSA-N 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses an integrated circuit heat pipe heat abstractor, it relates to an integrated circuit heat pipe heat abstractor's cooling system manufacturing technology, exactly, it is the cold heat abstractor of an electric installation, this utility model includes radiator fan, heat pipe radiator, heat transfer fin piece, bottom plate, the bottom plate of radiator, the surface closely laminates with the integrated circuit upper surface, heat pipe radiator upper surface is provided with bellied fin, the fin upper end is sealed, cavity, the lower extreme communicates with each other with the bottom plate constitution confined box with the heat pipe radiator, the heat pipe radiator constitutes the vacuum negative pressure structure with the bottom plate. The utility model discloses lie in having adopted heat pipe radiating element, having made the thermal resistance from heat source to radiating surface reduce by a wide margin to improve fin efficiency, increased the effective heat radiating area of radiator, its simple structure, if adopt advanced technology such as pressure casting or vacuum casting, heat pipe radiator and fin can one shot forming, and the cost will reduce by a wide margin.
Description
Technical field the present invention relates to a kind of cooling system manufacturing technology of integrated circuit heat-pipe radiating apparatus, and exactly, it is a kind of cooling and radiation device of electric installation.
Background technology is along with the develop rapidly of semiconductor technology, and the integrated level of integrated circuit (IC) chip improves constantly, and the operating frequency of chip also improves constantly, and the caloric value of integrated circuit (IC) chip has increased widely.Especially in computer realm, the heat dissipation problem of high primary frequency CPU also more and more becomes a problem that can not be ignored.
The heat dissipating method that the most generally uses is that the heat that CPU produces is directly delivered to fin at present, and the heat of fin being accumulated by the fan of quick rotation is taken away again.Although the capacity of heat transmission of aluminum or copper fin is very strong, and can increase area of dissipation by increasing fin.But owing to the increase of fin efficiency along with the distance of fin and thermal source (CPU) reduces, thus its fin thermal resistance have a limit.Therefore the thermal resistance of heat pipe (phase transformation) heat transfer element adopts heat pipe (phase transformation) heat transfer element can improve fin efficiency greatly than the low tens of and even hundreds of times of thermal resistance of aluminum or copper heat transfer element, thereby breaks through the fin thermal resistance limit.
As everyone knows, the radiator of hot pipe technique, the radiator of the employing hot pipe technique of COOLMASER have for example appearred adopting in the domestic market.And Chinese patent CN2458659Y discloses a kind of desktop computer CPU phase-change heat sink, and these all are goodish schemes.But because the structural manufacturing process complexity, the price height can't substitute existing product.
The summary of the invention the purpose of this utility model is that a kind of structural manufacturing process of design is simple, the integrated circuit heat pipe radiating system that cost is low.
Summary of the invention the utility model is achieved in that a kind of integrated circuit heat-pipe radiating apparatus that comprises radiator fan, heat transfer fin, base plate, the plate outer surface of radiator and integrated circuit upper surface fit tightly, heat pipe heat radiation body upper surface is provided with the fin of projection, the fin upper end closed, hollow, the lower end communicates with the casing that base plate constitutes sealing with the heat pipe heat radiation body, and heat pipe heat radiation body and base plate constitute the negative pressure of vacuum structure, and fin is fixed on the outer wall of fin.
The utility model is applicable to the heat pipe phase-change radiation system of integrated circuit, and it is simple in structure, and cost is low.Of the present utility modelly be to have adopted the heat pipe heat radiation element, the thermal resistance from the thermal source to the heat-delivery surface reduced significantly, thereby improve fin efficiency, increased the efficiently radiates heat area of radiator.And simple in structure, if adopt advanced technologies such as compression casting or vacuum pressing and casting, heat pipe heat radiation body and fin can one-shot formings, and cost reduces significantly.
Description of drawings is further described the utility model below in conjunction with accompanying drawing:
Fig. 1 is a front view of the present utility model
Fig. 2 is the cutaway view of A-A of the present utility model
Fig. 3 is a left view of the present utility model
1 is fin; 2 is column; 3 is radiator fan; 4 is the heat pipe heat radiation body; 5 is fin; 6 is working media; 7 is base plate.
The embodiment the purpose of this utility model is also again further to realize by following technology solution: above-mentioned a kind of integrated circuit heat pipe (phase transformation) cooling system, base plate 7 outer surfaces and the integrated circuit upper surface of wherein said radiator fit tightly, and are coated with silica gel etc. to reduce contact heat resistance.
Heat pipe heat radiation body 4 upper surfaces are provided with the fin 1 of some projectioies, fin 1 upper end closed, hollow, the lower end communicates with the casing that base plate 7 constitutes sealing with heat pipe heat radiation body 4, fin 1 inner surface is processed groove-shaped wick, can be dovetail groove, rectangular channel or vee gutter, conduct heat with reinforced transformation.And the fin 5 of augmentation of heat transfer is all arranged outside the fin 1 of every projection, to increase area of dissipation.
The working media 6 that wherein said heat pipe heat radiation body 4 and base plate 7 constitute the negative pressure of vacuum structures is any in the organic substance compatible with selected case material.The working media 6 that heat pipe heat radiation body 4 and base plate 7 constitute the negative pressure of vacuum structures can be any in the organic substance compatible with selected case material.For example: at 0-100 ℃, the working media 6 compatible with aluminium has ammonia, fluorine Lyons-21, Freon-11, freon-113, acetone; The working media compatible with copper has Freon-11, freon-113, hexane, acetone, ethanol, methyl alcohol etc.
Heat pipe heat radiation body 4 is aluminium and aluminium alloy or copper and copper alloy with the material of base plate 7 and fin 5 usefulness.Above-mentioned a kind of integrated circuit heat pipe (phase transformation) cooling system, upper surface that can described therein base plate 7 is provided with some surface texture for strengthening boiling, and the upper surface of base plate 7 is surface textures such as the thin ball of sintering, filamentary webs, burr body, pearl particle.
A kind of integrated circuit heat pipe (phase transformation) cooling system, it includes radiator fan 3, heat pipe heat radiation body 4, heat transfer fin 5, base plate 7, the column 2 and the working media 6 of fan is installed.Heat pipe heat radiation body 4 constitutes the casing that seals with base plate 7, and a little amount of work medium 6 is arranged at the bottom in the casing.Heat pipe heat radiation body 4 is provided with the fin 1 of some projectioies to upper surface, fin 1 upper end closed, and hollow, the lower end communicates with the casing that heat pipe heat radiation body and base plate constitute sealing.Fin 1 is outside equipped with the fin 6 of augmentation of heat transfer, and radiator fan 3 is installed in above the heat pipe heat radiation body 4, is fixed on the column 2.
As Fig. 1, the utility model by radiator fan 3, heat pipe heat radiation body 4, fin 5, base plate 7, column 2 and the working media 6 that is enclosed in the negative pressure of vacuum structure that heat pipe heat radiation body 4 and base plate 7 constitute form.The fluid passage of the hollow in the fin of heat pipe heat radiation body 4 projectioies communicates with the cavity that base plate 7 constitutes with heat pipe heat radiation body 4, and fin 5 can be welded on the fin 1, if process conditions permission heat pipe heat radiation body 4 and fin 5 can one-shot formings.Radiator fan 3 is fixed on the column 2.
Its course of work is as follows: base plate 7 outer surfaces and the integrated circuit upper surface of radiator fit tightly.The heat that integrated circuit produces arrives working media 6 through base plate 7.Because the negative pressure of vacuum structure that heat pipe heat radiation body 4 and base plate 7 constitute, working media 6 is under the vacuum negative pressure condition, vaporizes, and produces in the cavity of fin hollow that steam enters 4 some projectioies of heat pipe heat radiation body.Because heat pipe heat radiation body 4 and fin 5 are subjected to the cold wind cooling that radiator fan 3 blows out, so steam condensation here that working media 6 vaporizations produce, then reflux and fall back at last along the fin wall and continue to be heated vaporization in the working media 6, the cooling of realization to integrated circuit so moves in circles.
Claims (6)
1. integrated circuit heat-pipe radiating apparatus, comprise radiator fan (3), heat transfer fin (5), base plate (7), it is characterized in that: the base plate of radiator (7) outer surface and integrated circuit upper surface fit tightly, heat pipe heat radiation body (4) upper surface is provided with the fin (1) of projection, fin (1) upper end closed, hollow, the lower end communicates with the casing that base plate (7) constitutes sealing with heat pipe heat radiation body (4), heat pipe heat radiation body (4) constitutes the negative pressure of vacuum structure with base plate (7), and fin (5) is fixed on the outer wall of fin (1).
2. a kind of integrated circuit heat-pipe radiating apparatus according to claim 1 is characterized in that: heat pipe heat radiation body (4) is aluminium and aluminium alloy or copper and copper alloy with the material of base plate (7) and fin (5) usefulness.
3. a kind of integrated circuit heat-pipe radiating apparatus according to claim 1 is characterized in that: the working media (6) that heat pipe heat radiation body (4) and base plate (7) constitute the negative pressure of vacuum structure is any in the organic substance compatible with selected case material.
4. a kind of integrated circuit heat-pipe radiating apparatus according to claim 1, it is characterized in that: heat pipe heat radiation body (4) upper surface is provided with the fin (1) of some projectioies, fin (1) upper end closed, hollow, the lower end communicates with the casing that base plate (7) constitutes sealing with heat pipe heat radiation body (4), fin (1) inner surface is processed groove-shaped wick, can be trapezoidal, rectangular channel or vee gutter, and the fin (5) of augmentation of heat transfer is all arranged outside the fin (1) of every projection.
5. a kind of integrated circuit heat-pipe radiating apparatus according to claim 1 is characterized in that: the base plate of radiator (7) outer surface and integrated circuit upper surface fit tightly, and are coated with silica gel.
6. a kind of integrated circuit heat-pipe radiating apparatus according to claim 1 is characterized in that: the upper surface of base plate (7) is the surface texture of the thin ball of sintering, filamentary webs, burr body, pearl particle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320110374 CN2667662Y (en) | 2003-10-20 | 2003-10-20 | Heat pipe radiator for integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320110374 CN2667662Y (en) | 2003-10-20 | 2003-10-20 | Heat pipe radiator for integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2667662Y true CN2667662Y (en) | 2004-12-29 |
Family
ID=34343656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200320110374 Expired - Fee Related CN2667662Y (en) | 2003-10-20 | 2003-10-20 | Heat pipe radiator for integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2667662Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101287955B (en) * | 2005-06-07 | 2010-09-29 | 沃尔弗林管子公司 | Heat transfer surface for electronic cooling |
| CN111954422A (en) * | 2020-08-21 | 2020-11-17 | 广州极诣科技有限公司 | Communication is with preventing signal interference equipment |
-
2003
- 2003-10-20 CN CN 200320110374 patent/CN2667662Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101287955B (en) * | 2005-06-07 | 2010-09-29 | 沃尔弗林管子公司 | Heat transfer surface for electronic cooling |
| CN111954422A (en) * | 2020-08-21 | 2020-11-17 | 广州极诣科技有限公司 | Communication is with preventing signal interference equipment |
| CN111954422B (en) * | 2020-08-21 | 2021-07-27 | 广州极诣科技有限公司 | Communication is with preventing signal interference equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1383170B1 (en) | Thermosiphon for electronics cooling with nonuniform airflow | |
| CN2736925Y (en) | Heat sink | |
| EP1684564B1 (en) | Liquid cooled thermosiphon for electronic components | |
| CN2696124Y (en) | Heat sink | |
| CN2834120Y (en) | Natural air-cooled passive circulating micro-grooves phase change heat radiation system | |
| CN100506004C (en) | Remote passive circulating phase-change heat-diffusing method and system | |
| CN101052290A (en) | High efficiency heat radiation cool plate for electronic device | |
| CN104197612B (en) | A kind of high efficiency and heat radiation assembly of semiconductor freezer | |
| CN100557367C (en) | A kind of large power plate integral type phase change heat-radiation method and radiator | |
| CN1842265B (en) | Heat pipe radiator | |
| CN107462094A (en) | Phase transformation heat collector cavity heat pipe heat | |
| CN2569345Y (en) | Loop type heat pipe structure | |
| CN2720631Y (en) | Fin heat-tube radiator | |
| CN2667662Y (en) | Heat pipe radiator for integrated circuit | |
| CN219761747U (en) | High-power radiator combining VC and pulsating heat pipe | |
| CN103249276A (en) | Heat dissipation device, heat dissipation component and electronic equipment | |
| CN2834121Y (en) | Remote forced liquid-cooled micro-grooves phase change heat radiation system | |
| CN2736932Y (en) | Integrated circuit heat sink employing heat pipe technique | |
| CN2785322Y (en) | Heat radiator | |
| CN2775837Y (en) | Aluminum-copper combined integrated circuit heat radiator using heat pipe technology | |
| CN2543122Y (en) | Heat Pipe radiator | |
| CN201160359Y (en) | Straight-fin heat expansion reinforced structure minuteness scale composite phase-change heat fetching apparatus | |
| CN2865211Y (en) | Radiator specially for electronic component | |
| CN1556545A (en) | Flat curved type heat pipe integrated heat radiator for electron element | |
| CN210014479U (en) | Radiator, air condensing units and air conditioner |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |