CN2659632Y - Optical grinder - Google Patents
Optical grinder Download PDFInfo
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- CN2659632Y CN2659632Y CNU2003201276976U CN200320127697U CN2659632Y CN 2659632 Y CN2659632 Y CN 2659632Y CN U2003201276976 U CNU2003201276976 U CN U2003201276976U CN 200320127697 U CN200320127697 U CN 200320127697U CN 2659632 Y CN2659632 Y CN 2659632Y
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- wandering star
- star plate
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- grinding machine
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- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
The utility model relates to the surface processing technology of optical components, involving an optical grinding machine and a method for processing a sapphire crystal substrate for processing semiconductors. The grinding machine is composed of a frame, a working bench panel, a basin, a motor and a vertical rotating shaft driven by the motor. A lower grinding disc, a supporting and pressing structure of an upper grinding disc, the upper grinding disc above the lower grinding disc and a cooling liquid conveyor are arranged on the top of the rotating shaft. The lower grinding disc is composed of a bottom disc and an internal gear ring, an external ring sun gear and a plurality of erratic star plates are arranged on the bottom disc. The utility model has the advantages of high processing efficiency, low processing cost and high processing precision, thereby satisfying the processing requirement of a sapphire crystal substrate for semi-conductors, and being beneficial for industrialized production.
Description
Technical field the utility model belongs to the optical element surface processing technique field, particularly the film forming system of crystal substrates and method of surface finish thereof.
Background technology sapphire (Al
2O
3) be six side's symmetrical structures, it possesses good optics and physical property as the hardest oxide crystal.Its mechanical strength is higher, and resistance to chemical attack has good thermal conductivity, heat endurance, and transmission region is wide, be desirable window substrate stock, in addition, it has electrical insulating property, stable chemical performance, drain capacitance and parasitic capacitance are little, are fabulous semiconductor, superconduction backing materials.
The sapphire crystal substrates of using as substrate is generally ф 2, and " (2 inches) have 50.80mm * 0.30mm, two kinds of specifications of 50.80mm * 0.43mm.Optics sapphire crystal substrates as Semiconductor substrate has very high requirement to its surface, comprise that flatness (face shape is not advised aperture N. Δ N) reaches 0.2/ λ and interferes area, the depth of parallelism (θ) reaches 0.005mm, fineness (B) or roughness (Ra) reaches 0.5nm.
Traditional planar optical elements surface grinding machine (being called for short the optical grinding machine) as shown in Figure 1, mainly comprises frame 11, and a worktable panel 12 is installed on the frame, and a basin 13 and cooling fluid conveying device (not shown) are installed on the workbench; A vertical rotation axle 15 that motor 14 is installed in the frame and drives, this turning cylinder passes from the basin bottom, and a lower millstone 161 is installed at its top, and a upper millstone 162 is set on it; Upper millstone is installed on the workbench supports pressure exerting arrangement, the end that this mechanism generally includes 17 3 pull bars of a tripod links to each other with tripod by universal joint, the other end of three pull bars links to each other with upper millstone 162, also establishes a thimble 18 on the upper millstone 162 it is exerted pressure.Its operation principle is: the driven by motor turning cylinder rotates with lower millstone, and upper millstone is subjected to the pressure of thimble to rotate with lower millstone and swung by last surface pull rod.
Use the said equipment that the method that optical element carries out Surface Machining is divided into corase grind, fine grinding and polishing three phases, concrete procedure of processing is as follows:
At first element to be processed 19 is sticked on the upper millstone, the rotation by last lower millstone and finish the processing on a surface with the friction of abrasive, process one side after, heating is come unstuck, and unloading piece is also reverse pastes, reprocess second, also will add abrasive and cooling water in the process, and polishing fluid.This equipment can be finished the surface from roughly grinding, be finely ground to whole machining processes of polishing by changing the material of abrasive and mill.
Above-mentioned equipment has the following disadvantages:
1, efficient is low, processing in general 8 hours 1 or 3-7 sheet;
2, workpiece is taked the gluing fixation, has increased last dish unloading piece heating process, because the generation thermal deformation of coming unstuck has increased the irregular of plane interference striped;
3, various rotating speeds fixedly mix up, and in fact have only two kinds of motion modes and rotating speed, and promptly workpiece is rotated the axle drive and can rotates and swing the movement locus repetition.The amount of grinding size increases the weight of upper millstone by thimble to be estimated to detect, and science after size will be unloaded dish, has not been cleaned actual measurement and just known.
4, the diameter of general workpiece can not be too big, want to process the above substrate of ф 50 * 0.4mm, the one, easy fragmentation, the 2nd, inaccessiable as the desired technical indicator of Semiconductor substrate substrate to flatness, the depth of parallelism and fineness (B) or the roughness (Ra) on surface, difficulty of processing is very big.
The summary of the invention the purpose of this utility model is for overcoming the weak point of prior art, a kind of optical grinding machine is proposed, have the working (machining) efficiency height, processing cost is low, the characteristics that machining accuracy is high can satisfy semiconductor with the processing request of optics sapphire crystal substrates and help industrialization.
A kind of optical grinding machine that the utility model proposes, mainly comprise frame, one worktable panel is installed on the frame, one basin is installed on the workbench, a vertical rotation axle of motor and drive thereof is installed in the frame, this turning cylinder passes from the basin bottom, a lower millstone is installed at its top, the support pressure exerting arrangement of upper millstone is installed on the workbench, and with support pressure exerting arrangement and link to each other and place upper millstone on the lower millstone and cooling fluid conveying device; It is characterized in that, said lower millstone by the chassis, be arranged on the ring gear of chassis outer circumference and be arranged on the external tooth sun gear in the center of circle, chassis, wandering star plate more than one is formed, this wandering star plate outer rim has external tooth, and every block of wandering star plate is meshing with each other with the ring gear and the external tooth sun gear of other wandering star plate and outer circumference respectively simultaneously; The height of said ring gear, external tooth sun gear and the wandering star plate all final thickness with workpiece is identical or smaller; Every block of wandering star plate has more than one and the corresponding through hole of workpiece external diameter, and workpiece is placed in one just.
Characteristics of the present utility model and effect:
1) the utility model is 4 kinds of rotating manners and speed, i.e. lower millstone rotation, and the wandering star dish had not only revolved round the sun but also the wandering star motion of rotation, and workpiece can little commentaries on classics in the wandering star dish, and upper millstone is because friction drives backward rotation, and no track moves; Grinding resistance is little, has improved the flatness precision of workpiece; Do not damage workpiece, two sides Even Grinding, production efficiency height.2) not using dish, is to keep forging ahead automatically, and not gluing has cut the distortion of heating upper lower burrs, has reduced the distortion on plane.3) machining accuracy height, but the workpiece diameter is big.Quality can reach various substrates, the particularly semiconductor requirement of the optical index of sapphire crystal substrates.5), the utility model production efficiency height: can form industrialization, significantly reduce cost.
Description of drawings
Fig. 1 is existing optical grinding machine structural representation.
Fig. 2 is an optical grinding machine structural representation of the present utility model.
Fig. 3 is a lower millstone structure embodiment schematic diagram of the present utility model.
A kind of optical grinding machine that the specific embodiment the utility model proposes is described in detail as follows in conjunction with the embodiments:
The structure of the optical grinding machine embodiment of the utility model design as shown in Figure 2, mainly comprise rack 21, one worktable panel 22 is installed on the rack, one basin 23 is installed on the workbench, gas compressor (not shown) and motor 24 are installed in the frame, the vertical rotation axle 25 that motor drives by stepless speed adjusting gear and gear drive 241, this turning cylinder passes from the basin bottom, a lower millstone 261 is installed at its top, one stand 27 is installed on the workbench, the pressure inflator 281 that links to each other with gas compressor and the shift mechanism 271 and the coolant pipe 272 of upper millstone 262 are installed in the stand, one end of one force pipe 282 is connected with pressure inflator 281, and the other end is fixed on upper millstone 262 back side central spot.Above-mentioned parts all can select for use conventional products to assemble.
The operation instrument 29 realization process of being made up of survey tachometer, measuring pressure meter, timer and various control button also can be installed on the worktable panel of present embodiment control (operation instrument is the outsourcing mature equipment, also can not be provided with by the processing of traditional approach manual measurement) automatically.
The lower millstone structure of present embodiment as shown in Figure 3, by chassis 2611, be arranged on the ring gear 2612 of chassis outer circumference and be arranged on the external tooth sun gear 2613 in the center of circle, chassis, five blocks of wandering star plates 2614 constitute, this wandering star plate outer rim has external tooth, and every block of wandering star plate is meshing with each other with the ring gear 2612 of other wandering star plate and outer circumference and the external tooth sun gear 2613 in the center of circle, chassis respectively simultaneously; The height of said ring gear 2612, external tooth sun gear 2613 and wandering star plate 2614 is identical and identical or smaller with the final thickness of workpiece.Every block of wandering star plate all has five and the corresponding through hole 2615 of workpiece external diameter (being slightly larger than the workpiece external diameter), and workpiece is placed in one just.The through hole number that the piece number of wandering star plate of the present utility model and wandering star plate are opened is not limited to number that present embodiment is lifted according to mill size and any setting of workpiece size.Upper millstone of the present utility model supports pressure exerting arrangement also can adopt traditional structure.
The characteristics of present embodiment: 1) grinding resistance is little, does not damage workpiece, two sides Even Grinding, production efficiency height, 25 of time processing (can adorn 5 in wandering star dish of 5 wandering star dishes).2) not using dish, is to keep forging ahead automatically, and not gluing has cut the distortion of heating upper lower burrs, has reduced the distortion on plane; 3) control amount of grinding automatically by operation instrument, amount of gas pressure, speed is with the levelling of processing dimension amount size; Easy to operate, go slick, adopt infinitely variable speeds, start steadily; 4) present embodiment can disposable processing 25, working (machining) efficiency height, 5) quality can reach various substrates, and the depth of parallelism evenly is controlled within the 0.002mm automatically; The even breakage of pressure is in 99.5%; The particularly semiconductor requirement of the optical index of sapphire crystal substrates.
Claims (3)
1, a kind of optical grinding machine, mainly comprise frame, one worktable panel is installed on the frame, one basin is installed on the workbench, a vertical rotation axle of motor and drive thereof is installed in the frame, this turning cylinder passes from the basin bottom, a lower millstone is installed at its top, the support pressure exerting arrangement of upper millstone is installed on the workbench, and with support pressure exerting arrangement and link to each other and place upper millstone on the lower millstone and cooling fluid conveying device; It is characterized in that, said lower millstone by the chassis, be arranged on the ring gear of chassis outer circumference and be arranged on the external tooth sun gear in the center of circle, chassis, wandering star plate more than one is formed, this wandering star plate outer rim has external tooth, and every block of wandering star plate is meshing with each other with the ring gear and the external tooth sun gear of other wandering star plate and outer circumference respectively simultaneously; The height of said ring gear, external tooth sun gear and the wandering star plate all final thickness with workpiece is identical or smaller; Every block of wandering star plate has more than one and the corresponding through hole of workpiece external diameter, and workpiece is placed in one just.
2, optical grinding machine as claimed in claim 1, it is characterized in that, said support pressure exerting arrangement comprises the gas compressor that is installed in the frame, be installed in the stand on the workbench, be installed in the pressure inflator and the upper millstone shift mechanism that link to each other with gas compressor in the stand, and a force pipe, an end of this force pipe is connected with the pressure inflator, and the other end is fixed on upper millstone back side central spot.
3, optical grinding machine as claimed in claim 1 is characterized in that, also is included in to be equipped with on the worktable panel by measuring and regulate tachometer, measurement and regulating the operation instrument that pressure gauge, timer and various control button are formed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2003201276976U CN2659632Y (en) | 2003-12-16 | 2003-12-16 | Optical grinder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2003201276976U CN2659632Y (en) | 2003-12-16 | 2003-12-16 | Optical grinder |
Publications (1)
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CN2659632Y true CN2659632Y (en) | 2004-12-01 |
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ID=34349702
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CNU2003201276976U Expired - Fee Related CN2659632Y (en) | 2003-12-16 | 2003-12-16 | Optical grinder |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101982302A (en) * | 2010-08-30 | 2011-03-02 | 兰州瑞德实业集团有限公司 | Planetary transmission mechanism for double-faced grinding/polishing machine |
CN112108949A (en) * | 2020-09-10 | 2020-12-22 | 肇庆中彩机电技术研发有限公司 | Precision bearing width grinding device and grinding method thereof |
-
2003
- 2003-12-16 CN CNU2003201276976U patent/CN2659632Y/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101982302A (en) * | 2010-08-30 | 2011-03-02 | 兰州瑞德实业集团有限公司 | Planetary transmission mechanism for double-faced grinding/polishing machine |
CN101982302B (en) * | 2010-08-30 | 2013-01-02 | 兰州瑞德实业集团有限公司 | Planetary transmission mechanism for double-faced grinding/polishing machine |
CN112108949A (en) * | 2020-09-10 | 2020-12-22 | 肇庆中彩机电技术研发有限公司 | Precision bearing width grinding device and grinding method thereof |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |