CN2648605Y - Water-cooled plate type electronic power semiconductor device assembly - Google Patents
Water-cooled plate type electronic power semiconductor device assembly Download PDFInfo
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- CN2648605Y CN2648605Y CN 03276680 CN03276680U CN2648605Y CN 2648605 Y CN2648605 Y CN 2648605Y CN 03276680 CN03276680 CN 03276680 CN 03276680 U CN03276680 U CN 03276680U CN 2648605 Y CN2648605 Y CN 2648605Y
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- water
- semiconductor device
- power electronics
- electronics semiconductor
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Abstract
The utility model relates to a component of water-cooling flat type electric and electron semiconductor parts, pertaining to an electric and electron semiconductor parts application technology. The component essentially consists of a screw, a nut, flat type electric and electron semiconductor parts, water-cooling radiators, an insulation pad, a pressing block, impacting shelves, an impacting thread and a branch water pipe. the two impacting shelves are connected by the screw and the water-cooling radiator is arranged between the two impacting shelves, the flat electric and electron semiconductor parts are arranged between each two water-cooling radiators, the insulation pad is arranged between the water-cooling radiators and the impacting shelves, wherein, the impacting block is arranged between one end of the insulation pad and the impacting shelves and the impacting thread is impacted on the pressing block through the impacting shelves. The screw is a water pipe type screw that can be used as a water pipe and is connected with the water inlet and outlet of each water-cooling radiator by the branch water pipe. The space occupied by a water-cooling pipeline in a cabinet can be saved by using the water pipe type screw to replace the screw, thereby reducing the producing cost.
Description
Technical field:
The utility model relates to the plate power electronics semiconductor device assembly of a kind of water-cooled, belongs to the power electronics semiconductor device application technology, is particularly suitable for using in unsteady flow power device and reactive power compensator in the heavy-duty motor frequency control.
Background technology:
Plate power electronics semiconductor device is meant that shell is plate rectifier diode, fast recovery diode, gate level turn-off thyristor, insulation gate pole bipolar transistor, integral gate change transistor, two-phase thyristor, phase controlled thyristors power electronics semiconductor device such as (triode thyristors).
In the prior art, plate power electronics semiconductor device assembly is divided into air-cooled cooling and water-cooled is cooled off two kinds.Among the Chinese patent ZL00234403.3 " a kind of thyristor unsteady flow power device that adopts air-cooled cooling ", disclose a kind of thyristor power component assembly, the product brake tube of employing is plate shell.The screw rod that is with insulating case on it is connected in series radiator mutually with the briquetting that is positioned at the radiator two ends, and thyristor is installed between the radiator in twos, between radiator and the briquetting insulation cushion is installed.Thyristor power component assembly is installed in this device cabinet in the air channel, offers air inlet on the cabinet, and the blower fan that is installed in the cabinet top communicates on the air channel in wind collecting unit and cabinet.During work, the heat that thyristor produces reaches radiator, and the high wind that is produced by blower fan is taken away the heat on the radiator again, so that thyristor remains on the normal working temperature below 100 ℃.But,, job requirement can not be satisfied the time, need to adopt the water-cooled cooling when air-cooled for some high-power electric and electronic semiconductor apparatus assembly because air-cooled radiating effect is limited.
The plate power electronics semiconductor device assembly of water-cooled, its modular construction and air-cooled power electronics semiconductor device assembly are basic identical, just replace air-cooled radiator with water-filled radiator.Plate power electronics semiconductor device assembly is installed in the cabinet, cooling water recirculation system is responsible for by plumbing recirculated cooling water is introduced in the cabinet, link to each other with the distributive pipe that is positioned at plate power electronics semiconductor device assembly both sides respectively, distributive pipe links to each other with the intake-outlet of each radiator through each arm.The heat that the plate power electronics semiconductor device assembly of water-cooled is passed to radiator by boiler water circulation with power electronics semiconductor device is taken away, intensity of cooling is big, is specially adapted to the above heavy-duty motor frequency control of voltage 3Kv-10Kv, power 500kVA with using in unsteady flow power device and the reactive power compensator.But because the employing of water-cooling system, the distributive pipe that many water-cooled pipelines particularly are arranged in power electronics semiconductor device assembly both sides has taken a large amount of space of cabinet, makes the structure complicated in the device, has increased the workload of installation and maintenance.
Summary of the invention:
The purpose of this utility model provides a kind of plate power electronics semiconductor device assembly of water-cooled that can simplify the cabinet inner structure, make things convenient for installation and maintenance.
The purpose of this utility model realizes by following technical solution.
The plate power electronics semiconductor device assembly of a kind of water-cooled, mainly form by screw rod, nut, plate power electronics semiconductor device, water-filled radiator, insulation cushion, briquetting, clamping frame, housing pin and branching pipe, screw rod is contacted two clamping frames, between two clamping frames water-filled radiator is installed, plate power electronics semiconductor device is installed between the water-filled radiator in twos, between water-filled radiator and the clamping frame insulation cushion is installed, one briquetting is wherein arranged between the insulation cushion of an end and the clamping frame, and housing pin is pressed on the briquetting through clamping frame.Screw rod is the water pipe screw rod with water pipe effect, links to each other with the intake-outlet of each water-filled radiator by branching pipe.
Described branching pipe is a flexible pipe.
Described plate power electronics semiconductor device is that shell is any one in the power electronics semiconductor device such as plate rectifier diode, fast recovery diode, gate level turn-off thyristor, insulation gate pole bipolar transistor, integral gate change transistor, two-phase thyristor, phase controlled thyristors.
The advantage that the present invention is compared with prior art had is:
Screw rod water pipe screw rod in the plate power electronics semiconductor device assembly of prior art water-cooled is replaced, saved water-cooled pipeline shared space in cabinet, reduce manufacturing cost, make the device cabinet inner structure that adopts the plate power electronics semiconductor device assembly of water-cooled obtain simplifying, make things convenient for installation and maintenance.
Description of drawings:
Fig. 1 is the structural representation of the plate power electronics semiconductor device assembly of the utility model water-cooled.
Fig. 2 is the vertical view of Fig. 1.
Embodiment:
Below in conjunction with accompanying drawing embodiment of the present utility model is described in detail.
The plate power electronics semiconductor device assembly of the utility model water-cooled is made up of housing pin 1, nut 2, water pipe screw rod 3, clamping frame 4,9, briquetting 5, insulation cushion 6,10, water-filled radiator 7, plate power electronics semiconductor device 8 and branching pipe 11 as shown in Figure 1 and Figure 2.Water pipe screw rod 3 is equipped with water-filled radiator 7 with two clamping frames, 4,9 polyphones between two clamping frames 4,9, and plate power electronics semiconductor device 8 is installed between the water-filled radiator 7 in twos, and insulation cushion 6,10 is installed between water-filled radiator 7 and the clamping frame 4,9.One briquetting 5 is arranged between insulation cushion 6 and the clamping frame 4, and housing pin 1 is pressed on the briquetting 5 through clamping frame 4.Branching pipe 11 adopts flexible pipe, and water pipe screw rod 3 links to each other with the intake-outlet of each water-filled radiator 7 by branching pipe 11, forms circulation waterway.
In the present embodiment, plate power electronics semiconductor device 8 can be that shell is any one in plate rectifier diode, fast recovery diode, gate level turn-off thyristor, insulation gate pole bipolar transistor, integral gate change transistor, two-phase thyristor, phase controlled thyristors etc.
The plate power electronics semiconductor device assembly of water-cooled is installed in the cabinet, constitutes heavy-duty motor frequency control unsteady flow power device or reactive power compensator.During work, take away, have very strong cooling effect by the heat that boiler water circulation is passed to radiator with power electronics semiconductor device.The water pipe screw rod replaces screw rod, has saved water-cooled pipeline shared space in cabinet, and the cabinet inner structure is simplified, and makes things convenient for the Unit Installation to safeguard.
Claims (3)
1. plate power electronics semiconductor device assembly of water-cooled, mainly by screw rod, nut, plate power electronics semiconductor device, water-filled radiator, insulation cushion, briquetting, clamping frame, housing pin and branching pipe are formed, screw rod is contacted two clamping frames, between two clamping frames water-filled radiator is installed, plate power electronics semiconductor device is installed between the water-filled radiator in twos, between water-filled radiator and the clamping frame insulation cushion is installed, one briquetting is wherein arranged between the insulation cushion of an end and the clamping frame, housing pin is pressed on the briquetting through clamping frame, it is characterized in that: described screw rod (3) links to each other by the intake-outlet of branching pipe (11) with each water-filled radiator (7) for having the water pipe screw rod of water pipe effect.
2. the plate power electronics semiconductor device assembly of water-cooled according to claim 1 is characterized in that: described branching pipe (11) is a flexible pipe.
3. the plate power electronics semiconductor device assembly of water-cooled according to claim 1 is characterized in that: described plate power electronics semiconductor device (8) is that shell is any one in the power electronics semiconductor device such as plate rectifier diode, fast recovery diode, gate level turn-off thyristor, insulation gate pole bipolar transistor, integral gate change transistor, two-phase thyristor, phase controlled thyristors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03276680 CN2648605Y (en) | 2003-08-22 | 2003-08-22 | Water-cooled plate type electronic power semiconductor device assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03276680 CN2648605Y (en) | 2003-08-22 | 2003-08-22 | Water-cooled plate type electronic power semiconductor device assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2648605Y true CN2648605Y (en) | 2004-10-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03276680 Expired - Fee Related CN2648605Y (en) | 2003-08-22 | 2003-08-22 | Water-cooled plate type electronic power semiconductor device assembly |
Country Status (1)
| Country | Link |
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| CN (1) | CN2648605Y (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101242148B (en) * | 2007-02-07 | 2011-05-04 | 株式会社日立制作所 | Power conversion apparatus |
| CN102208381A (en) * | 2011-03-31 | 2011-10-05 | 上海磁浮交通发展有限公司 | Circulation cooling pipeline of three-level power module of integrated gate commutated thyristor (IGCT) |
| CN102290385A (en) * | 2011-09-20 | 2011-12-21 | 北京金自天正智能控制股份有限公司 | Water-cooling radiator for gate turn-off thyristor |
| CN103456700A (en) * | 2013-04-27 | 2013-12-18 | 昆山良昕环保节能有限公司 | Quick-change cooling and fixing device for thyristors |
| CN104392987A (en) * | 2014-10-22 | 2015-03-04 | 中国船舶重工集团公司第七一二研究所 | Integrated semiconductor power assembly and pressing gauge thereof |
| CN104392967A (en) * | 2014-10-22 | 2015-03-04 | 株洲南车时代电气股份有限公司 | Semiconductor module pressing structure and pressing method thereof |
| CN105489572A (en) * | 2015-12-04 | 2016-04-13 | 许继集团有限公司 | Power component module and heat sink thereof |
-
2003
- 2003-08-22 CN CN 03276680 patent/CN2648605Y/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101242148B (en) * | 2007-02-07 | 2011-05-04 | 株式会社日立制作所 | Power conversion apparatus |
| CN102208381A (en) * | 2011-03-31 | 2011-10-05 | 上海磁浮交通发展有限公司 | Circulation cooling pipeline of three-level power module of integrated gate commutated thyristor (IGCT) |
| CN102208381B (en) * | 2011-03-31 | 2013-03-06 | 上海磁浮交通发展有限公司 | Circulation cooling pipeline of three-level power module of integrated gate commutated thyristor (IGCT) |
| CN102290385A (en) * | 2011-09-20 | 2011-12-21 | 北京金自天正智能控制股份有限公司 | Water-cooling radiator for gate turn-off thyristor |
| CN103456700A (en) * | 2013-04-27 | 2013-12-18 | 昆山良昕环保节能有限公司 | Quick-change cooling and fixing device for thyristors |
| CN103456700B (en) * | 2013-04-27 | 2016-04-06 | 昆山良昕环保节能有限公司 | A kind of thyristor quick change cooling fixture |
| CN104392987A (en) * | 2014-10-22 | 2015-03-04 | 中国船舶重工集团公司第七一二研究所 | Integrated semiconductor power assembly and pressing gauge thereof |
| CN104392967A (en) * | 2014-10-22 | 2015-03-04 | 株洲南车时代电气股份有限公司 | Semiconductor module pressing structure and pressing method thereof |
| CN104392967B (en) * | 2014-10-22 | 2017-02-01 | 株洲南车时代电气股份有限公司 | Semiconductor module pressing structure and pressing method thereof |
| CN105489572A (en) * | 2015-12-04 | 2016-04-13 | 许继集团有限公司 | Power component module and heat sink thereof |
| CN105489572B (en) * | 2015-12-04 | 2018-01-23 | 许继集团有限公司 | Power component module and its radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20041013 Termination date: 20120822 |