CN2536973Y - High efficiency semiconductor refrigerator - Google Patents
High efficiency semiconductor refrigerator Download PDFInfo
- Publication number
- CN2536973Y CN2536973Y CN 02213134 CN02213134U CN2536973Y CN 2536973 Y CN2536973 Y CN 2536973Y CN 02213134 CN02213134 CN 02213134 CN 02213134 U CN02213134 U CN 02213134U CN 2536973 Y CN2536973 Y CN 2536973Y
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- heat
- thermal
- condenser
- exchanger
- arrest
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Abstract
The utility model relates to a highly efficient semiconductor refrigerator, belonging to the technical field of refrigeration, comprising a heat absorption exchanger, a heat dissipation exchanger and a plurality of semiconducting refrigeration pieces, which is characterized in that the curved metal plate of the heat absorption exchanger is connected with the inner cavity wall of the refrigeration apparatus, and the heat conduction metal block of the heat absorption exchanger is jointly connected with the cold end of the semiconducting refrigeration pieces; the heat dissipation exchanger comprises a heat collection metal block, an upper communication tube and a lower communication tube, a flow divider, a condenser and a current collector; the parts of the heat dissipation exchanger are connected successively, and the heat collection metal block is closely connected with the hot end of the semiconducting refrigeration pieces; the condenser is multilayer superimposed fiber tube type condenser. The utility model has the advantages of reasonable structure, easy production, convenient operation, high heat dissipation efficiency, strong refrigeration capacity and electricity conservation.
Description
(1) technical field
The utility model relates to a kind of refrigerator, belongs to refrigeration technology field.
(2) background technology
Mechanical compression type refrigeration cost height, big, the system complex of noise the particularly important is, and CFC 3. cold-producing mediums of employing have been arranged progressively forbidding in relevant international convention; The semiconductor refrigerating that 20 middle of century occur is a kind of and the mechanical compression type diverse environmental-protection refrigeration technology of freezing, and refrigerating efficiency is low, power consumption is high, cooling does not reach the defective of requirement but exist; At present advanced Natural Heat Convection system has introduced heat pipe, but because the cooling system design is unreasonable, has still that hot-side heat dissipation is insufficient, the problem of poor refrigerating efficiency.
(3) summary of the invention
At the deficiencies in the prior art, the utility model provide a kind of rational in infrastructure, easy to manufacture, easy to use, radiating efficiency is high, refrigerating capacity is strong, the high efficiency semiconductor refrigerator of saves energy.
A kind of high efficiency semiconductor refrigerator of forming by heat absorption heat exchanger, heat dissipation heat exchanger and semiconductor chilling plate, the heat absorption heat exchanger is made up of crooked metal sheet and heat-conducting metal piece, crooked metal sheet closely is connected with the heat-conducting metal piece, and be connected with the internal chamber wall of refrigerating equipment, heat-conducting metal piece and semiconductor chilling plate cold junction are fitted and connected; Heat dissipation heat exchanger is made up of thermal-arrest metal derby, last lower communicating tube, current divider, condenser and current collector, thermal-arrest metal derby and last communicating pipe, current divider, condenser and current collector, lower communicating tube are linked in sequence successively, and the hot junction of thermal-arrest metal derby and semiconductor chilling plate is fitted and connected; Semiconductor chilling plate is a monolithic single-stage thermoelectric pile.
The thermal-arrest metal derby is made up of housing, connecting hole, inner chamber and rib shape plate, is staircase structural model, and inner chamber and rib shape plate are in housing, and connecting hole and inner chamber are communicated with, and the hot junction of step surface and semiconductor chilling plate is fitted and connected.
Condenser is that the threaded pipe type condenser and the thermal-arrest metal derby of Multi-layer Parallel stack has certain inclination in vertical direction.
During use, vacuumize the back in the loop with thermal-arrest metal derby and condenser formation and inject a certain amount of environment protection liquid, form closed circuit.The heat absorption heat exchanger absorbs the heat of refrigerating equipment, pass through semiconductor chilling plate, the hot-side temperature of semiconductor chilling plate is raise, thereby thermal-arrest metal derby temperature is raise, after the environment protection liquid boiling of thermal-arrest metal derby inner chamber, in the heat radiation closed circuit,, thermal-arrest metal derby temperature is reduced by condenser free convection and temperature-fall period.Through continuous heat absorption heat exchange and heat radiation heat transfer process, reach the purpose of refrigerating equipment refrigeration.The utlity model has rational in infrastructure, easy to manufacture, easy to use, radiating efficiency is high, refrigerating capacity is strong, the characteristics of saves energy.
(4) description of drawings
Fig. 1 is a structural representation of the present utility model.
Fig. 2 is the front view of heat dissipation heat exchanger in the utility model.
Fig. 3 is the left view of heat dissipation heat exchanger in the utility model.
Fig. 4 is the right view of thermal-arrest metal derby in the utility model.
Fig. 5 is the front view of thermal-arrest metal derby in the utility model.
Wherein, 1, the thermal-arrest metal derby, 2, last communicating pipe, 3, current divider, 4, condenser, 5, current collector, 6, lower communicating tube, 7, the refrigerating box shell, 8, crooked metal sheet, 9, heat-conducting metal piece, 10, semiconductor chilling plate, 11, thermal-arrest metal derby housing, 12, thermal-arrest metal derby connecting hole, 13, thermal-arrest metal derby inner chamber, 14, thermal-arrest metal derby rib shape plate, 15, thermal-arrest metal derby step surface.
(5) specific embodiment
Embodiment: structure chart 1 of the present utility model, Fig. 2 and shown in Figure 3, the heat absorption heat exchanger is made up of crooked metal sheet 8 and heat-conducting metal piece 9, crooked metal sheet 8 closely is connected with heat-conducting metal piece 9, the internal chamber wall of crooked metal sheet 8 and refrigerating equipment is connected, and heat-conducting metal piece 9 and semiconductor chilling plate 10 cold junctions are fitted and connected; The heat radiation heat exchange is made up of thermal-arrest metal derby 1, last communicating pipe 2, current divider 3, condenser 4, lower communicating tube 6 and current collector 5, thermal-arrest metal derby 1 and last communicating pipe 2, current divider 3, condenser 4 and current collector 5, lower communicating tube 6 are linked in sequence successively, and the hot junction of thermal-arrest metal derby 1 and semiconductor chilling plate 10 is fitted and connected; Semiconductor chilling plate 10 is a monolithic single-stage thermoelectric pile.Thermal-arrest metal derby 1 is made up of housing 11, connecting hole 12, inner chamber 13 and rib shape 14 plates, is staircase structural model, and inner chamber and rib shape plate are in housing, and connecting hole and inner chamber are communicated with, and the hot junction of step surface 15 and semiconductor chilling plate is fitted and connected.Thermal-arrest metal derby thermal-arrest copper billet, condenser are that the threaded pipe type condenser and the thermal-arrest copper billet of Multi-layer Parallel stack has certain inclination in vertical direction.
Claims (3)
1, a kind of high efficiency semiconductor refrigerator of forming by heat absorption heat exchanger, heat dissipation heat exchanger and semiconductor chilling plate, it is characterized in that, the heat absorption heat exchanger is made up of crooked metal sheet and heat-conducting metal piece, crooked metal sheet closely is connected with the heat-conducting metal piece, and be connected with the internal chamber wall of refrigerating equipment, heat-conducting metal piece and semiconductor chilling plate cold junction are fitted and connected; Heat dissipation heat exchanger is made up of thermal-arrest metal derby, last lower communicating tube, current divider, condenser and current collector, thermal-arrest metal derby and last communicating pipe, current divider, condenser and current collector, lower communicating tube are linked in sequence successively, and the hot junction of thermal-arrest metal derby and semiconductor chilling plate is fitted and connected; Semiconductor chilling plate is a monolithic single-stage thermoelectric pile.
2, high efficiency semiconductor refrigerator as claimed in claim 1 is characterized in that, the thermal-arrest metal derby is made up of housing, connecting hole, inner chamber and rib shape plate, be staircase structural model, inner chamber and rib shape plate are in housing, and connecting hole and inner chamber are communicated with, and the hot junction of step surface and semiconductor chilling plate is fitted and connected.
3, high efficiency semiconductor refrigerator as claimed in claim 1 is characterized in that, condenser is that the threaded pipe type condenser and the thermal-arrest metal derby of Multi-layer Parallel stack has certain inclination in vertical direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02213134 CN2536973Y (en) | 2002-03-06 | 2002-03-06 | High efficiency semiconductor refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02213134 CN2536973Y (en) | 2002-03-06 | 2002-03-06 | High efficiency semiconductor refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2536973Y true CN2536973Y (en) | 2003-02-19 |
Family
ID=33692691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02213134 Expired - Fee Related CN2536973Y (en) | 2002-03-06 | 2002-03-06 | High efficiency semiconductor refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2536973Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100433392C (en) * | 2006-12-01 | 2008-11-12 | 王双玲 | Special finned pipe shaped radiator for semiconductor refrigeration unit and its preparation method |
| CN101377392B (en) * | 2007-08-27 | 2012-02-22 | Abb研究有限公司 | Heat exchanger |
| CN102954630A (en) * | 2012-11-06 | 2013-03-06 | 苏州市瑞泰克机电有限公司 | Semiconductor type wire tube condenser |
| CN104329828A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Semiconductor refrigeration refrigerator and hot-end heat exchange device thereof |
-
2002
- 2002-03-06 CN CN 02213134 patent/CN2536973Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100433392C (en) * | 2006-12-01 | 2008-11-12 | 王双玲 | Special finned pipe shaped radiator for semiconductor refrigeration unit and its preparation method |
| CN101377392B (en) * | 2007-08-27 | 2012-02-22 | Abb研究有限公司 | Heat exchanger |
| CN102954630A (en) * | 2012-11-06 | 2013-03-06 | 苏州市瑞泰克机电有限公司 | Semiconductor type wire tube condenser |
| CN104329828A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Semiconductor refrigeration refrigerator and hot-end heat exchange device thereof |
| CN104329828B (en) * | 2014-03-28 | 2017-01-11 | 海尔集团公司 | Semiconductor refrigeration refrigerator and hot-end heat exchange device thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |