CN2522409Y - Minisize hot-pipe with nono core-body - Google Patents

Minisize hot-pipe with nono core-body Download PDF

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Publication number
CN2522409Y
CN2522409Y CN02205487U CN02205487U CN2522409Y CN 2522409 Y CN2522409 Y CN 2522409Y CN 02205487 U CN02205487 U CN 02205487U CN 02205487 U CN02205487 U CN 02205487U CN 2522409 Y CN2522409 Y CN 2522409Y
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core body
heat pipe
nanometer
nano
micro heat
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CN02205487U
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刘静
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Technical Institute of Physics and Chemistry of CAS
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Technical Institute of Physics and Chemistry of CAS
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure

Abstract

A minisize hot-pipe with nano core-body comprises a hot-surface substrate, a microporous pipeline, a nano core-body, working fluid and a case chip; the nano core-body is made of nano-tube material or porous material and is fixed on the inner wall surface of the microporous pipeline; the hot-surface substrate and the case chip are respectively packaged on two ends of the microporous pipeline; the fluid medium is packaged in the inner cavity of the nano core-body and the channel in the microporous pipeline or the hole of the nano core-body; the nano core-body can be the millimeter-level or micron-level nano array structure consisting of a nano tube; the cross section of the nano core-body is square, triangular or circular; when used, the minisize hot-pipe of the utility model is adhered to the surface of a heating element; thus, the utility model can realize the highly efficient heat dissipation effect; the size of the whole minisize hot-pipe can be adjusted according to needs. The minisize hot-pipe unit provided by the utility model can work singly and can be combined to form composite units of different shapes to work.

Description

The micro heat pipe of band nanometer core body
Technical field
The utility model relates to a kind of micro heat pipe, particularly a kind of micro heat pipe with the nanometer core body.
Background technology
Natural science and engineering development important trend is to develop towards microminiaturization in recent years, people's notice turns to those to occur in small scale and/or fast on the phenomenon and device the process from macro object gradually, wherein, microelectromechanical systems has especially obtained immense success and just has been applied to various industrial process by expansion, this type systematic refers to those characteristic sizes below 1 millimeter but greater than 1 micron device, its current collection and mechanical organ and can be made by the batch processing method that is adopted in the integrated circuit manufacturing.Nano-device has then further advanced the miniaturization of microelectromechanical systems.Because the modern lasting progress made from application technology, the size of " micromechanics " or " receive machinery " just reduces with unusual speed, and its performance has obtained keeping even be better simultaneously, and various surprising achievements follow on sb.'s heels shoulder to shoulder.Yet, in nearly all little/nanometer electronic device, all have the problem of how to dispel the heat.Such as, along with little/nano-electron industrial expansion, personal computer, work station, palm PC are like springing up like mushrooms, in these products, will cool off heater members with the convection current air bar none, its requirement to the high density heat transportation usually becomes and is rich in challenging problem.The difficulty of cooling microsystem is: at first, the cooling air speed can not be too high, otherwise acoustic noise is too big; Secondly, the component compact requirement only allows to keep limited cooling fluid space; The 3rd, it is heat sink to avoid installing big surface on the module as far as possible.So it is very important to develop high performance close-coupled heat abstractor.In addition, each spacefaring nation of the world has all strengthened the development dynamics of and micro-satellite large and small to each in recent years, whole satellite development trend is to stride forward towards the complicated and first evolution of function, their concentrated reflections are growing for spaceborne electronic devices and components closeness, meanwhile, its heat production intensity is also more and more higher, becomes the bottleneck of restriction satellite technology development equally.So above-mentioned these problems have all proposed the importance of development compact high power density radiating element, and volume is little, in light weight, high one of the most important index wherein just of efficient.
In numerous high efficiency and heat radiation technology, hot pipe technique embodies particularly remarkablely on performance.It with capillary force as circulation power, again with phase transformation (evaporate with condense) heat exchange as the main mode of conducting heat, have that heat-transfer capability is big, characteristics such as light weight, temperature control capability are strong, heat transfer efficiency height, competitively explored in space industry so far, its application aspect the heat radiation of computer components and parts is also noticeable.Heat pipe mainly is made up of capillary body (mainly being divided into evaporator section, adiabatic section and condensation segment three parts), capillary wick, fluid media (medium) etc., its basic functional principle is: the external heat load is added on evaporator section, internal working medium is subjected to thermal evaporation, the steam that produces passes to condensation segment and condenses into liquid, the heat that release absorbs from evaporimeter, and heat reached the condensation end outside, the liquid that condenses in the condensation end is by capillary wick suction backheat end.Like this, working medium constantly circulates in heat pipe, and in the mode of latent heat of phase change heat is transported away constantly.
Adopt phase-change heat transfer to compare with single-phase heat transfer or heat conduction, required working medium is few, and hot transmission quantity is big, but thereby weight reduction.The thrust of heat pipe operation will make the heat pipe operate as normal from the suction force of capillary wick, the overall presure drop that capillary pressure reduction is flowed greater than fluid, thereby how to select and make the bigger capillary wick of capillary suction force be a key.
Summary of the invention
The purpose of this utility model is: providing a kind of is the micro heat pipe of core body with nanotube or nano-porous materials, this heat pipe is a kind ofly to realize the micro heat pipe of the band nanometer core body of heat transmission high efficiency and heat radiation by what hole between nanotube mesopore and array thereof constituted the ultra micro fluid passage in the heat pipe mode, can be used as the desirable heat abstractor of heating components and parts.
Embodiment of the present utility model is as follows:
The micro heat pipe of the band nanometer core body that the utility model provides, comprise: hot side substrate 1, micropore pipeline 11, nanometer core body 3, working media 2,15 and cold junction case chip 16, it is characterized in that, nanometer core body 3 anchors on micropore pipeline 11 internal faces, hot side substrate 1 and cold junction case chip 16 are encapsulated in the two ends of micropore pipeline 11 respectively, to constitute the hot junction and the cold junction of micro heat pipe, working media 2 is encapsulated in nanometer core body 3 inner chambers, and fluid media (medium) 15 is encapsulated in the duct or nanometer core body 3 holes in the micropore pipeline 11; Described nanometer core body 3 is made by Nano/micron tubing or Nano/micron porous material; Described nanometer core body 3 is that Nano/micron carbon or Nano/micron metal pipe material are made; Described nanometer core body 3 is that Nano/micron porous metals or Nano/micron non-metallic particle material are made; Described micro heat pipe internal diameter be 2 centimetres to 10 nanometers, and the cross section of nanometer core body 3 is square, triangle or circle, its cool and heat ends distance be 1 centimetre to 10 nanometers; Described hot side substrate 1 is metal or semiconductor silicon substrate, and its thickness is 1 centimetre to 1 micron; Described case chip 16 is metal or semiconductor silicon case chip, and its thickness is 1 centimetre to 1 micron; Described fluid media (medium) 2 is working solution pure water or ammoniacal liquor; Described fluid media (medium) 15 is working solution pure water or ammoniacal liquor; The micro heat pipe of band nanometer core body of the present utility model can be the micro heat pipe combination that is combined into flat sheet type, camber or tubular type, its heat transfer direction by hot side substrate 1 to cold junction case chip 16.
At first nanometer core body 3 is produced on the inwall of micropore pipeline 11, afterwards fluid media (medium) 15 is injected micropore pipeline 11 and 3 holes of nanometer core body, at last hot side substrate 1 and cold junction case chip 16 are encapsulated in micropore pipeline 11 two ends respectively, again fluid media (medium) 2 is injected nanometer core body 3, promptly form the micro heat pipe of band nanometer core body of the present utility model, it is attached at heating components and parts surface, can realizes the high efficiency of transmission of heat.As required, the micro heat pipe size of entire belt nanometer core body can be adjusted as required; Wherein nanometer core body 3 materials are except that adopting modal CNT, also can adopt metal (as Au) nanotube, can form nano array structure as required, can realize oriented growth such as CNT, and reach overlength magnitude (millimeter level), and continue to improve also can obtaining from now on, this makes that the utility model is easy to realize; Fluid media (medium) can adopt the working medium compatible with substrate, as ammonia, R-134a etc.
The micropore of nanometer core body 3 or groove diameter are at 10nm to 10 in the utility model 3Between the μ m; Can be produced on the thin slice of silicon, metal or other material, each thin slice both can be formed a heat exchanger separately, also can pile up and was welded together to form parallel following current or contra-flow heat exchanger.
Crucial part of the present utility model is nanometer core body 3, have good mechanical, electricity, magnetic performance, it also is present best in the world Heat Conduction Material, heat is by the ultrasonic wave transmission in it, even nanotube is tied together, heat can not pass to another CNT from a CNT yet, and this explanation nanotube can only be along one dimension direction transferring heat energy.This characteristic can perform well in the one-way heat conduction in the heat pipe.And the minimum size of nanotube makes its surface high to the capillary suction force of liquid, thereby promotes the liquid flow in the microtubule greatly, is desirable heat pipe core material.
At present, the development of nanometer technology is maked rapid progress, but the practicability technology is still less, realizes that in conjunction with advanced micro-/ nano technology some important application is the target that people pursue.The micro heat pipe of the band nanometer core body that the utility model provides can find a point of penetration for this reason.
Description of drawings
Accompanying drawing 1 is principle of the present utility model and structural representation;
Accompanying drawing 2 is the profilograph of Fig. 1;
Wherein: hot side substrate 11 fluid media (medium)s 2 fins 5
Nanometer core body 3 vavuum pumps 8 micropore pipelines 11
Fluid media (medium) 15 case chips 16 heat pipe packaging parts 18
Heat pipe connector 19 vacuum chambers 20
Embodiment
Further describe the utility model below in conjunction with the drawings and specific embodiments: as can be known by Fig. 1 and Fig. 2, the micro heat pipe of the band nanometer core body that the utility model provides, comprise: hot side substrate 1, micropore pipeline 11, nanometer core body 3, working media 2,15 and cold junction case chip 16, it is characterized in that, nanometer core body 3 anchors on micropore pipeline 11 internal faces, hot side substrate 1 and cold junction case chip 16 are encapsulated in the two ends of micropore pipeline 11 respectively, to constitute the hot junction and the cold junction of micro heat pipe, working media 2 is encapsulated in nanometer core body 3 inner chambers, and fluid media (medium) 15 is encapsulated in the duct or nanometer core body 3 holes in the micropore pipeline 11; Described nanometer core body 3 is made by Nano/micron tubing or Nano/micron porous material; Described nanometer core body 3 is that Nano/micron carbon or Nano/micron metal pipe material are made; Described nanometer core body 3 is that Nano/micron porous metals or Nano/micron non-metallic particle material are made; Described micro heat pipe internal diameter be 2 centimetres to 10 nanometers, and the cross section of nanometer core body 3 is square, triangle or circle, its cool and heat ends distance be 1 centimetre to 10 nanometers; Described hot side substrate 1 is metal or semiconductor silicon substrate, and its thickness is 1 centimetre to 1 micron; Described case chip 16 is metal or semiconductor silicon case chip, and its thickness is 1 centimetre to 1 micron; Described fluid media (medium) 2 is working solution pure water or ammoniacal liquor; Described fluid media (medium) 15 is working solution pure water or ammoniacal liquor; The micro heat pipe of band nanometer core body of the present utility model can be the micro heat pipe combination that is combined into flat sheet type, camber or tubular type, its heat transfer direction by hot side substrate 1 to cold junction case chip 16.
Fig. 1 is principle and structural representation that the utility model provides, also is an embodiment of the present utility model; Sleeve mechanism can be flat sheet type, also can be other shapes (seeing Figure 14-16); Its hot side substrate 1 is attached at certain heating components and parts surface, can realizes thermolysis efficiently; Can be as required, the size of entire heat dissipation structure can be adjusted.Heat pipe core body 3 materials that the utility model provides also can adopt metal (as Au) type nanotube except that adopting at present more common CNT.At present, can be assembled into nano-structure array as required, and combination (Zhang Lide, Mu Jimei, the nano material and the nanostructured of realization various ways, Beijing: Science Press, 2001), can realize oriented growth, and reach overlength degree (millimeter level) such as CNT, and also be expected to be improved from now on, this makes that the utility model is easy to realize.Fluid media (medium) also can adopt multiple working medium, as ammonia, R-134a etc.The micro heat pipe that the utility model provides also can directly be manufactured by micro-processing technology and treat on the surface of radiating piece.
The micro heat pipe of the band nanometer core body that the utility model provides is similar with conventional heat pipe on the implementation, but substantive difference is then arranged in the selection of core material.Its skin is seal casinghousing (Fig. 1), be equipped with certain thickness nanometer core body 3 (as CNT) along micropore pipeline 11 inwalls, filled with fluid medium 15 (as water) in the capillary porosity of nanometer core body 3, micropore pipeline 11 central spaces then are steam 2 paths, when heat pipe substrate 1 connects thermal source, heat will be passed to nanometer core body 3 and the interior fluid media (medium) that is full of 15 thereof by the tube wall of heat pipe substrate 1, so the fluid media (medium) 15 after temperature raises will be strengthened in the lip-deep evaporation of nanometer core body 3, this part of heat pipe is called bringing-up section or evaporation ends, and steam pressure is P1 herein; Meanwhile, the other end of heat pipe (being cold junction case chip 16 ends) is connected or is in nature heat extraction state with heat sink, is called the heat extraction section or the section of condensing, and the vapo(u)rous pressure in this section is that P2 represents; So under the effect of pressure reduction (P1-P2), steam 2 flow to the section of condensing by evaporator section, and condenses there, emits the latent heat of vaporization; Like this, heat promptly passes to by fluid media (medium) 15, nanometer core body 3 and tube wall and extraneous goes in heat sink; Steam condenses into liquid after emitting latent heat, and the driving by nanometer die 3 capillary forces is back to evaporator section again, thus, promptly finishes a flow circuit.
The concrete production method of a kind of heat pipe form provided by the utility model is as follows:
1. capillary processing: if require made heat pipe sizes as far as possible little (as the internal diameter of micropore pipeline 11 in tens of micron dimensions), then need adopt some micro-/ nano process technologies such as LIGA technology, laser boring etc. in hot side substrate 1 (can be metal such as aluminium or semiconductor silicon etc.), to process a series of micro-groove or ducts that certain depth-to-width ratio is arranged, shown in Fig. 4-1; If to centimetre magnitude, then this duct can make of conventional method such as electric machining heat pipe sizes at millimeter;
2. the nanometer core body 3: for the micropore pipeline 11 of size than macropore, (it makes existing ready-made method to the CNT shown in Fig. 3-3 to get a certain amount of Fig. 3-1, can be referring to [Zhang Lide, Mu Jimei, nano material and nanostructured, Beijing: Science Press, 2001], it is filled on the inwall of micropore pipeline 11 (its concrete shape is seen Fig. 4-2) abreast, because CNT heat conduction direction is mainly axially carried out along it, can guarantee to greatest extent that thus the heat transmission direction is perpendicular to hot side substrate 1; After above-mentioned material is laid and to be finished, adopt certain method to make nanometer core body 3 and stick on the inwall of micropore pipeline 11, so in the CNT and the space between the nanometer tube bundle promptly forms the return flow line of fluid media (medium) 15, and its surface of overflowing as liquid equally; Micropore pipeline 11 for atomic little duct, its preparation method is as follows, at first deposit two walls (seeing Fig. 4-1) that small rib 5 serves as micropore pipeline 11 on hot side substrate 1 equal intervals ground, on hot side substrate 1 and fin 5 walls, lay and adhere to nanotube or nano-porous materials (seeing Fig. 4-2) again, afterwards, heat pipe packaging part 18 covered on fin 5 (see Fig. 4-3), after high temperature melt, promptly form the micropore pipeline 11 that inner filling has nano material; In above-mentioned stowing operation, combining between nanometer core body 3 and micropore pipeline 11 tube walls can be adopted coated in advance certain chemicals on micropore pipeline 11 inwalls, and so that the two is bonded together, this is mature technologies at various chemical fields, is not difficult to realize; After this, an above-mentioned end that has formed the structure shown in Fig. 4-3 is encapsulated with hot side substrate 1, the other end does not temporarily seal, so that the filling fluid;
3. the filling of liquid medium 15: above-mentioned semi-closed structure is placed in the vacuum chamber 20 (Fig. 5), vacuumize, removing in the micropore pipeline 11 and to reside in air in the sodium rice core body 3 as far as possible, thereby improve the heat pipe operating efficiency; And, for removing air to greatest extent, also can toast heating from hot side substrate 1, residual gas is overflowed, and take away by vacuum machine 8; After this, fluid working substance to be filled 15 is joined in the vacuum chamber 20, and it is heated, so liquid medium 15 becomes steam, through behind the certain hour, along with the rising of pressure, the steam of the liquid medium 15 in the vacuum chamber promptly enters in the duct of micropore pipeline 11 and sodium rice core body 3, as required, adjust temperature and pressure in the vacuum chamber, then can change the amount that enters liquid medium 15 steam in micropore pipeline 11 and the sodium rice core body 3; After this handles,, adopt the way of high temperature or diffusion welding (DW) it can be packaged into one at the other end that in the vacuum chamber 20 cold junction case chip 16 is butted up against structure shown in Fig. 4-3; Afterwards, it is taken out in vacuum chamber 20, at room temperature cool off certain hour after, its fluid working substance steam promptly becomes liquid, thereby promptly makes a kind of micro heat pipe of band sodium rice core body of the present utility model;
4. the interior hole shape of heat pipe is selected: in general, because the driving force that fluid flows in the micro heat pipe of band sodium rice core body of the present utility model is from the hole in nanotube or the nanoporous body, because this structure has high specific area, thereby the surface tension that is provided significantly drive fluid is mobile in pipe, in the opposite heat tube requirement of hole shape also just unlike in the micro heat pipe in the past the surface tension of passing through corner connection place slit that must rely on finish, thereby employing all can as Fig. 9-a few class shape of cross sections shown in Figure 13;
5. heat pipe heat piece installing form: according to the requirement for the treatment of heat-delivery surface, the heat pipe heat piece installing that the utility model provides can make various ways, shown in Figure 14-16, be that whole heat pipe structure both can be a plain film structure (Figure 14), the also combination (seeing Figure 15) of several plain films adopts connector 19 (as metalwork) to connect therebetween; Also can be arcuation (Figure 16), be suitable for the heat radiation of kinds of surface.And this heat radiation heat pipe plain film upper end also can be used with multiple radiated rib, is about to heat thus and distributes quite effectively.
For reaching better radiating effect, generally should satisfy following requirement as fluid media (medium) of the present utility model: do not explode, nontoxic, institute's contact material is not played corrosiveness and chemical action, do not decompose under the high temperature; Be convenient to obtain; Has certain heat endurance; It is big that specific heat is wanted, thereby when transmitting certain heat, can make flow little; Fluid media (medium) should be compatible with structural material, and selected fluid media (medium) can not cause the opposite heat tube system unit to produce the unfavorable factor that corrosion and rustization etc. influence service life, and in addition, working medium also should have the bigger latent heat of vaporization and less viscosity.
The utlity model has lot of advantages, at first, the micro heat pipe thickness of making based on CNT (particle) can be very little, as below 1mm, heat-transfer capability is then quite high mainly axially carry out owing to conduct heat in the CNT at it, thereby thereby good directionality efficient higher; And the heat pipe of making thus also is easy to bending, thereby applicable surface is wideer; Whole heat pipe inner cyclic process seals, and can select the working medium type of fluid restricted less.Just because of these composite factors, make the utility model than in the past micro heat pipe, structure is more compact, and weight is lighter.
The utility model heat pipe can be advantageously used in the heat that device produces is led away from its surface, and it is close to device surface, and the contact-making surface between the two adopts the high thermal conductivity grease to increase heat-transfer effect; And can select the miniature fin of heat pipe type of different sizes to get final product according to treating the heat removal surface area size; So the heat that produces in the device can be transferred to opposite side by heat pipe, thereby safeguards the operate as normal of device.

Claims (10)

1. micro heat pipe with the nanometer core body, comprise: hot side substrate (1), micropore pipeline (11), nanometer core body (3), working media (2), (15) and cold junction case chip (16), it is characterized in that, nanometer core body (3) anchors on micropore pipeline (11) internal face, hot side substrate (1) and cold junction case chip (16) are encapsulated in the two ends of micropore pipeline (11) respectively, to constitute the hot junction and the cold junction of micro heat pipe, working media (2) is encapsulated in nanometer core body (3) inner chamber, and fluid media (medium) (15) is encapsulated in micropore pipeline (11) the interior duct or nanometer core body (3) hole.
2. by the micro heat pipe of the described band nanometer of claim 1 core body, it is characterized in that described nanometer core body (3) is made by Nano/micron tubing or Nano/micron porous material.
3. by the micro heat pipe of the described band nanometer of claim 2 core body, it is characterized in that described nanometer core body (3) is that Nano/micron carbon or Nano/micron metal pipe material are made.
4. by the micro heat pipe of the described band nanometer of claim 2 core body, it is characterized in that described nanometer core body (3) is that Nano/micron porous metals or Nano/micron non-metallic particle material are made.
5. by the micro heat pipe of the described band nanometer of claim 1 core body, it is characterized in that, described micro heat pipe internal diameter be 2 centimetres to 10 nanometers, and the cross section of nanometer core body (3) be square, triangle or circle, its cool and heat ends apart from be 1 centimetre to 10 nanometers.
6. by the micro heat pipe of the described band nanometer of claim 1 core body, it is characterized in that described hot side substrate (1) is metal or semiconductor silicon substrate, its thickness is 1 centimetre to 1 micron.
7. by the micro heat pipe of the described band nanometer of claim 1 core body, it is characterized in that described case chip (16) is metal or semiconductor silicon case chip, its thickness is 1 centimetre to 1 micron.
8. by the micro heat pipe of the described band nanometer of claim 1 core body, it is characterized in that described fluid media (medium) (2) is working solution pure water or ammoniacal liquor.
9. by the micro heat pipe of the described band nanometer of claim 1 core body, it is characterized in that described fluid media (medium) (15) is working solution pure water or ammoniacal liquor.
10. by the micro heat pipe of the described band nanometer of claim 1 core body, it is characterized in that, for being combined into the micro heat pipe combination of flat sheet type, camber or tubular type, its heat transfer direction by hot side substrate (1) to cold junction case chip (16).
CN02205487U 2002-02-25 2002-02-25 Minisize hot-pipe with nono core-body Expired - Lifetime CN2522409Y (en)

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Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1328567C (en) * 2004-02-27 2007-07-25 鸿富锦精密工业(深圳)有限公司 Heat pipes
CN100370207C (en) * 2004-02-20 2008-02-20 鸿富锦精密工业(深圳)有限公司 Heat pipe and its preparation method
CN100413061C (en) * 2004-06-07 2008-08-20 鸿富锦精密工业(深圳)有限公司 Thermal tube and producing method thereof
CN100417908C (en) * 2005-09-16 2008-09-10 富准精密工业(深圳)有限公司 Heat tube and powder and method for sintering forming the same heat tube capillary structure
CN100581333C (en) * 2006-11-21 2010-01-13 中山大学 Cooling substrate of micro heat pipe
US7694726B2 (en) 2005-01-07 2010-04-13 Hon Hai Precision Industry Co., Ltd. Heat dissipation system
CN103126381A (en) * 2011-11-23 2013-06-05 青岛立德热能设备有限公司 Mattress heating apparatus installed with heat pipes
CN103940269A (en) * 2014-04-25 2014-07-23 上海交通大学 Heat tube based on carbon nano tube wick and manufacturing method of heat tube
CN104088957A (en) * 2013-04-01 2014-10-08 陈曦 Nano-porous energy absorption device
TWI479114B (en) * 2012-04-09 2015-04-01 Heat transfer structure, method of manufacturing heat transfer structure and heat dissipating device
EP3539156A4 (en) * 2016-11-08 2020-07-15 Kelvin Thermal Technologies, Inc. Method and device for spreading high heat fluxes in thermal ground planes
US11353269B2 (en) 2009-03-06 2022-06-07 Kelvin Thermal Technologies, Inc. Thermal ground plane
US11598594B2 (en) 2014-09-17 2023-03-07 The Regents Of The University Of Colorado Micropillar-enabled thermal ground plane
US11930621B2 (en) 2020-06-19 2024-03-12 Kelvin Thermal Technologies, Inc. Folding thermal ground plane

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100370207C (en) * 2004-02-20 2008-02-20 鸿富锦精密工业(深圳)有限公司 Heat pipe and its preparation method
CN1328567C (en) * 2004-02-27 2007-07-25 鸿富锦精密工业(深圳)有限公司 Heat pipes
CN100413061C (en) * 2004-06-07 2008-08-20 鸿富锦精密工业(深圳)有限公司 Thermal tube and producing method thereof
US7874347B2 (en) 2004-06-07 2011-01-25 Hon Hai Precision Industry Co., Ltd. Heat pipe with hydrophilic layer and/or protective layer
US7694726B2 (en) 2005-01-07 2010-04-13 Hon Hai Precision Industry Co., Ltd. Heat dissipation system
CN100417908C (en) * 2005-09-16 2008-09-10 富准精密工业(深圳)有限公司 Heat tube and powder and method for sintering forming the same heat tube capillary structure
CN100581333C (en) * 2006-11-21 2010-01-13 中山大学 Cooling substrate of micro heat pipe
US11353269B2 (en) 2009-03-06 2022-06-07 Kelvin Thermal Technologies, Inc. Thermal ground plane
CN103126381A (en) * 2011-11-23 2013-06-05 青岛立德热能设备有限公司 Mattress heating apparatus installed with heat pipes
TWI479114B (en) * 2012-04-09 2015-04-01 Heat transfer structure, method of manufacturing heat transfer structure and heat dissipating device
CN104088957A (en) * 2013-04-01 2014-10-08 陈曦 Nano-porous energy absorption device
CN103940269A (en) * 2014-04-25 2014-07-23 上海交通大学 Heat tube based on carbon nano tube wick and manufacturing method of heat tube
US11598594B2 (en) 2014-09-17 2023-03-07 The Regents Of The University Of Colorado Micropillar-enabled thermal ground plane
EP3539156A4 (en) * 2016-11-08 2020-07-15 Kelvin Thermal Technologies, Inc. Method and device for spreading high heat fluxes in thermal ground planes
US11930621B2 (en) 2020-06-19 2024-03-12 Kelvin Thermal Technologies, Inc. Folding thermal ground plane

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