CN2470871Y - Directing heat-conductive radiating device of central processor - Google Patents
Directing heat-conductive radiating device of central processor Download PDFInfo
- Publication number
- CN2470871Y CN2470871Y CN 01211709 CN01211709U CN2470871Y CN 2470871 Y CN2470871 Y CN 2470871Y CN 01211709 CN01211709 CN 01211709 CN 01211709 U CN01211709 U CN 01211709U CN 2470871 Y CN2470871 Y CN 2470871Y
- Authority
- CN
- China
- Prior art keywords
- heat
- fan
- radiator
- processing unit
- central processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a heat dissipating device by directly heat conducting used for a CPU, which includes heat dissipating pieces and a fan. One end of a micro heat pipe is connected with the heat dissipating pieces while the other end is connected with a radiator which is structured by a shell and a fan, wherein the shell is provided with an air hole and is covered around the outer circumference of the fan. A positioning plate is arranged between the micro heat pipe and the motherboard of the computer. The utility model is characterized by simple structure, easy installation and high efficiency of heat transfer and heat dissipation. Through the micro heat pipe installed between the heat dissipating pieces and the radiator, the heat generated by the electronic components and CPU will be transferred and removed rapidly, thus ensuring the normal temperature environment of the computer.
Description
The utility model relates to a kind of heat abstractor of computer motherboard central processing unit.
Central processing unit (CPU) will produce a large amount of heats in operate as normal, the problem that raises and to cause whole computer system security and service life to reduce as the untimely temperature that will make central processing unit (CPU) and mainboard of dispelling the heat.For example: modal is the deadlock phenomenon to occur.The heat dissipating method that adopts is that fan and heat radiator are set directly over the outside surface of central processing unit at present.But along with the raising of electronic component power such as central processing unit, this way can not have been finished the problem that a large amount of heats that will produce in time leave.
The purpose of this utility model provides a kind of simple in structure, the straight heat-conducting heat abstractor of central processing unit that conduct heat, radiating efficiency is high.
For achieving the above object, the straight heat-conducting heat abstractor of the utility model central processing unit comprises heat radiator, fan, and micro heat pipe one end and heat radiator join, the other end with by being provided with air hole and being located at the housing of fan periphery and heating radiator that fan is formed joins.
Adopt said structure, because micro heat pipe has good heat-conductive characteristic, can be in time with the heat on the heat radiator, be delivered on the heating radiator of forming by housing, fan, because housing is provided with air hole, according to convective principles, heat is blown out by the air-flow that fan produces; Reach the reduction temperature, the purpose that conduct heat, radiating efficiency is high.
As further improvement of the utility model, micro heat pipe one end is plugged in the caulking groove of heat radiator, and the other end is plugged in and is provided with air hole and is located in the caulking groove of fan periphery housing.After adopting this structure, can realize easy for installation.
Further improve as the utility model, between described micro heat pipe and computer motherboard, be provided with a locating rack.After adopting this structure, can with the micro heat pipe stationkeeping and and mainboard between keep certain distance, in order to avoid influence the work of other electron component above the mainboard.Certainly, also can adopt another kind of structure to reach this effect, described micro heat pipe and the bundle ear Joint that is arranged on the heat radiator.
Above-mentioned heat spreader structures also can and be arranged on by forward and backward housing for the forward and backward housing that is provided with air hole and be surrounded fan in the space.Thereby it is attractive in appearance to avoid influencing cabinet.
In sum, the utility model has the advantages that: simple in structure, easy for installation.Owing between heat radiator and heating radiator, set up micro heat pipe, thereby realize purpose that the heat that central processing unit produces is in time transmitted, leaves, had heat transfer, characteristics that radiating efficiency is high.
Below in conjunction with drawings and Examples the utility model is described in further detail.
Fig. 1 is the exploded perspective illustration of the straight heat-conducting heat abstractor of the utility model central processing unit.
Fig. 2 is the micro heat pipe parts cut-open view of the straight heat-conducting heat abstractor of the utility model central processing unit.
Fig. 3 is the heat sink assembly decomposition diagram of the straight heat-conducting heat abstractor of the utility model central processing unit.
As shown in Figure 1, the straight heat-conducting heat abstractor of the utility model central processing unit, aluminum parallel-plate strip heat radiator 1, computing machine dedicated fan 2 are arranged, micro heat pipe 3 one ends are plugged in the caulking groove 1-1 of heat radiator 1, the other end is plugged in and is cast with or is drilled with air hole 4-1 and be located in the caulking groove 4-2 of sheet iron system housing 4 of fan 2 peripheries, forms heating radiators by fan 2 and housing 4 that screw connects.Iron locating rack 5 is installed between micro heat pipe 3 and the computer motherboard, thereby makes the location of the certain space length of maintenance between micro heat pipe 3 and mainboard not influence the work of other electron component on the mainboard.Iron bundle ear 6 can certainly be connected with heat radiator 1, micro heat pipe 3 screws respectively.Realize the stationkeeping of micro heat pipe 3.Described heat spreader structures also can connect and be arranged on by forward and backward housing 4 and surrounded the computing machine dedicated fan 2 (showing as Fig. 3) in the space in order to avoid fan 2 directly reveals puts outside cabinet for the forward and backward sheet iron system housing that is cast with or is drilled with air hole 4-1 and by screw, influences attractive in appearance.
As shown in Figure 1, 2, according to heat-conduction principle and micro heat pipe heat-conductive characteristic efficiently, micro heat pipe 3 can be delivered to the heat that is produced by central processing unit that is trapped on the heat radiator 1 on the heating radiator of being made up of forward and backward housing 4, fan 2 apace in actual use; Because the rotation of fan 2 and the air hole 4-1 on the forward and backward housing 4 promptly drain into heat outside the computing machine according to convective principles.
The utility model has the advantages that to have simple in structurely, easy for installation, conduct heat, heat radiation efficient High characteristics. By between fin and the radiator that formed by housing, fan, low-grade fever being installed Pipe can transmit the heat that the electronic components such as central processing unit produce, get rid of fast, from And guarantee the computer temperature of working normally.
Claims (6)
1, the straight heat-conducting heat abstractor of a kind of central processing unit, comprise heat radiator (1), fan (2), it is characterized in that: micro heat pipe (3) one ends and heat radiator (1) join, the other end with by being provided with air hole (4-1) and being located at the housing (4) of fan (2) periphery and heating radiator that fan (2) is formed joins.
2, the straight heat-conducting heat abstractor of central processing unit according to claim 1, it is characterized in that: micro heat pipe (3) one ends are plugged in the caulking groove (1-1) of heat radiator (1), and the other end is plugged in and is provided with air hole (4-1) and is located in the caulking groove (4-2) of fan (2) periphery housing (4).
3, the straight heat-conducting heat abstractor of central processing unit according to claim 1 and 2 is characterized in that: be provided with a locating rack (5) between described micro heat pipe (3) and computer motherboard.
4, the straight heat-conducting heat abstractor of central processing unit according to claim 1 and 2 is characterized in that: described micro heat pipe (3) and bundle ear (6) Joint that is arranged on the heat radiator (1).
5, the straight heat-conducting heat abstractor of central processing unit according to claim 3, its spy is: described heating radiator comprises the forward and backward housing (4) that is provided with air hole (4-1) and is arranged on by forward and backward housing (4) and surrounded fan (2) in the space.
6, the straight heat-conducting heat abstractor of central processing unit according to claim 4 is characterized in that: described heating radiator comprises the forward and backward housing (4) that is provided with air hole (4-1) and is arranged on by forward and backward housing (4) and surrounded fan (2) in the space.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01211709 CN2470871Y (en) | 2001-02-19 | 2001-02-19 | Directing heat-conductive radiating device of central processor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01211709 CN2470871Y (en) | 2001-02-19 | 2001-02-19 | Directing heat-conductive radiating device of central processor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2470871Y true CN2470871Y (en) | 2002-01-09 |
Family
ID=33631049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01211709 Expired - Fee Related CN2470871Y (en) | 2001-02-19 | 2001-02-19 | Directing heat-conductive radiating device of central processor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2470871Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107450692A (en) * | 2017-07-18 | 2017-12-08 | 陕西理工大学 | A kind of radiating structure of computer |
-
2001
- 2001-02-19 CN CN 01211709 patent/CN2470871Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107450692A (en) * | 2017-07-18 | 2017-12-08 | 陕西理工大学 | A kind of radiating structure of computer |
| CN107450692B (en) * | 2017-07-18 | 2019-07-05 | 陕西理工大学 | A kind of radiating structure of computer |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6373700B1 (en) | Heat sink modular structure inside an electronic product | |
| CN201138463Y (en) | Computer system with wind-guiding cowl | |
| TW200421073A (en) | System and method for cooling an electronic device | |
| CN202887087U (en) | Semiconductor central processing unit (CPU) radiator having heat insulation protection | |
| CN203444409U (en) | Radiator | |
| CN2470871Y (en) | Directing heat-conductive radiating device of central processor | |
| CN214800416U (en) | Head-mounted display device and heat dissipation mechanism thereof | |
| CN210119749U (en) | Heat dissipation device and notebook computer | |
| CN100410841C (en) | Heat sink of computer system | |
| JP3734895B2 (en) | heatsink | |
| CN201837951U (en) | Radiating device | |
| CN115047960A (en) | Auxiliary heat dissipation device for computer | |
| CN201184991Y (en) | Efficient radiator | |
| TW200930275A (en) | Heat dissipation device | |
| CN204498550U (en) | Radiating subassembly | |
| CN101193537A (en) | Heat radiator | |
| CN208159080U (en) | A kind of heat pipe heat radiation mould group | |
| CN2599641Y (en) | Vacuum heat-conducting pipe type heat sink for computer | |
| CN209343264U (en) | A kind of computer system puts device with control panel fixing card | |
| CN103167783B (en) | Heat sink device | |
| CN1629770A (en) | Computer radiating method requiring no fans | |
| CN216901552U (en) | Cooling and noise reducing host | |
| CN111338442A (en) | Server case and high-wind-speed low-power-consumption wind-guiding heat-radiating structure thereof | |
| JP2000075960A5 (en) | Expansion device | |
| CN212135374U (en) | Rack-mounted server cooling system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |