CN221429169U - Dual power supply module heat radiation structure - Google Patents

Abstract

The utility model discloses a dual-power module radiating structure which comprises a circuit main board and spring pressing sheets, wherein four groups of spring pressing sheets are arranged in front of the top of the circuit main board side by side, fixing nuts are arranged between the spring pressing sheets and the circuit main board through screw thread knobs, four groups of thyristors are fixed at the bottom of the circuit main board, and a heat-conducting silica gel pad is transversely arranged below the circuit main board. This dual power supply module heat radiation structure is through transversely installing the heat conduction silica gel pad in circuit motherboard's below, and this dual power supply module is sealed design, and natural heat dissipation does not take the fan, and the purpose is just to the heat that generates heat because of the operation inside quick-witted case conduction to the quick-witted case outside as far as, reduces the temperature of inboard, and each thyristor is pressed and is pasted on heat conduction aluminum plate, has still one deck heat conduction silica gel pad and one deck insulating silica gel tape between thyristor and the heat conduction aluminum plate, can play insulating and heat conduction's dual function, has solved the problem that the thermal efficiency is low that falls.

Description

Dual power supply module heat radiation structure

Technical Field

The utility model relates to the technical field of dual power supply modules, in particular to a dual power supply module heat dissipation structure.

Background

The double power supply module is electronic equipment for realizing double-circuit power supply conversion by adopting a static switch switching mode, a thyristor used in the process needs a good heat dissipation mode to maintain daily work, if the power supply module is tightly attached to a case and other objects, and a separation space is lacked, heat is difficult to evacuate, and if the temperature inside the case is too high, electric appliances inside the case are extremely easy to damage, so that a heat dissipation structure is required to be additionally arranged below the object, but the heat dissipation structure is mostly used for extracting hot air inside the case through a fan, the special structure of the case cannot support people to install a plurality of groups of fans, a large amount of noise exists, and the double power supply module is not suitable for use any more.

At present, a novel dual-power module heat dissipation structure is provided for solving the problems.

Disclosure of utility model

The utility model aims to provide a dual-power module heat dissipation structure to solve the problem of low heat reduction efficiency in the background technology.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a dual power supply module heat radiation structure, includes circuit board and spring preforming, the place ahead at circuit board top is provided with four sets of spring preforming side by side, and all screw thread knob has fixation nut between spring preforming and the circuit board, circuit board's bottom is fixed with four sets of thyristors, the heat conduction silica gel pad is transversely installed to circuit board's below, and the bottom of heat conduction silica gel pad covers there is the insulating silica gel tape, the below level of insulating silica gel tape is provided with heat conduction aluminum plate, and welds four sets of double-screw bolts between the both sides at heat conduction aluminum plate top place ahead.

Preferably, the number of the spring pressing sheets is the same as that of the fixing nuts, and the spring pressing sheets and the corresponding fixing nuts are located on the same vertical plane.

Preferably, the stud penetrates through the circuit main board and is embedded in the fixing nut with the spring pressing piece, and lines matched with the fixing nut are arranged on the outer portion of the stud.

Preferably, the heat conduction aluminum plate's below transversely is provided with the quick-witted case bottom plate, and the both ends at quick-witted case bottom plate top all welded fastening has the support column, the inside a week in quick-witted case bottom plate edge is provided with the screw, and the inside screw of screw revolves to twist has fastening bolt, the left side of quick-witted case bottom plate below transversely is provided with first radiator, and the right side concatenation of first radiator has the second radiator, the bottom of first radiator and second radiator all welded fastening has the piece of standing, and has the rectangular channel in reserve between the piece of standing.

Preferably, the fastening bolts are embedded in the screw holes, and the fastening bolts and the screw holes are arranged in concentric circles.

Preferably, the first radiator is located at the left side of the second radiator below the chassis bottom plate, and the first radiator and the second radiator are located at the same horizontal plane.

Compared with the prior art, the utility model has the beneficial effects that: the dual-power module heat dissipation structure not only integrates insulation and heat conduction, is convenient to install and disassemble, but also achieves rapid heat dissipation;

(1) The double-power module is of a sealed design, naturally dissipates heat, does not have a fan, and aims to conduct heat generated by running heating inside a case to the outside of the case as much as possible, reduce the temperature at the inner side, and the thyristors are pressed and stuck on a heat-conducting aluminum plate, and a layer of heat-conducting silica gel pad and a layer of insulating silica gel tape are arranged between the thyristors and the heat-conducting aluminum plate, so that the double functions of insulation and heat conduction can be achieved, and the temperature of all components inside the case is prevented from being too high;

(2) Four groups of spring pressing sheets are arranged in front of the top of the circuit main board side by side, the thyristor is pressed and stuck to the top of the heat conducting aluminum plate, a stud of the aluminum plate passes through an opening of the circuit board, then the top is screwed on the stud by a fixing nut, the circuit main board is tightly pressed by the spring pressing sheets, so that the heat conducting aluminum plate can be tightly stuck to the lower part of the thyristor, and then the heat conducting aluminum plate is mounted and stuck to a chassis bottom plate by a fastening bolt, and a first radiator and a second radiator are mounted at the bottom end of the heat conducting aluminum plate, so that the heat conducting aluminum plate is convenient for people to assemble and fast detach, and workers to operate if maintenance and new replacement are provided;

(3) Through transversely being provided with first radiator in the left side of quick-witted case bottom plate below, first radiator and the accessory that second radiator originally is the same, but both horizontal grafting are in the same place, support quick-witted case etc. thing jointly, and the equidistant piece of standing of arranging in below of radiator unit can form multiunit rectangular channel dispersion to derive heat, can be outside the heat conduction to the quick-witted case that thyristor operation produced, furthest reduces airtight quick-witted case's inside temperature to improve this power module's operational reliability.

Drawings

FIG. 1 is a schematic elevational view of the present utility model;

FIG. 2 is a schematic side view of the present utility model;

FIG. 3 is a schematic diagram of a front view of a circuit board according to the present utility model;

Fig. 4 is a schematic bottom perspective view of the present utility model.

In the figure: 1. a circuit motherboard; 2. spring tabletting; 3. a fixing nut; 4. a thyristor; 5. a thermally conductive silicone pad; 6. a silicon-on-insulator tape; 7. a heat conducting aluminum plate; 8. a chassis base; 9. a first heat sink; 10. rectangular grooves; 11. a standing block; 12. a second heat sink; 13. a support column; 14. a fastening bolt; 15. a stud; 16. screw holes.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Example 1: referring to fig. 1-4, a dual power module heat dissipation structure includes a circuit board 1 and a spring pressing sheet 2, wherein four groups of spring pressing sheets 2 are arranged in parallel in front of the top of the circuit board 1, fixing nuts 3 are arranged between the spring pressing sheet 2 and the circuit board 1 through screw knobs, four groups of thyristors 4 are fixed at the bottom of the circuit board 1, a heat conduction silica gel pad 5 is transversely arranged below the circuit board 1, the bottom of the heat conduction silica gel pad 5 is covered with a silicon rubber insulation cloth 6, a heat conduction aluminum plate 7 is horizontally arranged below the silicon rubber insulation cloth 6, and four groups of studs 15 are welded between two sides in front of the top of the heat conduction aluminum plate 7;

The number of the spring pressing sheets 2 is the same as that of the fixing nuts 3, the spring pressing sheets 2 and the corresponding fixing nuts 3 are in the same vertical plane, the studs 15 penetrate through the circuit main board 1 and are embedded in the fixing nuts 3, and lines matched with the fixing nuts 3 are arranged outside the studs 15;

Specifically, as shown in fig. 1, 2 and 3, the dual-power module is of a sealed design, naturally dissipates heat, does not have a fan, and aims to conduct heat generated by running heating inside a case to the outside of the case as much as possible, reduce the temperature at the inner side, and press-attach each thyristor 4 on a heat-conducting aluminum plate 7, and a layer of heat-conducting silica gel pad 5 and a layer of insulating silica gel cloth 6 are arranged between each thyristor 4 and the heat-conducting aluminum plate 7, so that the dual functions of insulation and heat conduction can be achieved.

Example 2: a chassis bottom plate 8 is transversely arranged below the heat conduction aluminum plate 7, support columns 13 are welded and fixed at two ends of the top of the chassis bottom plate 8, screw holes 16 are formed in the periphery of the inner part of the edge of the chassis bottom plate 8, and fastening bolts 14 are screwed into internal threads of the screw holes 16;

Specifically, as shown in fig. 1, 2, 3 and 4, the thyristor 4 is pressed on the top of the heat conducting aluminum plate 7, the stud 15 of the aluminum plate passes through the hole of the circuit board, then the stud 15 is screwed on the top by a fixing nut 3, and the circuit board 1 is pressed by the spring pressing plate 2, so that the heat conducting aluminum plate 7 can be tightly attached to the lower part of the thyristor 4, and then attached to the chassis bottom plate 8 by the fastening bolt 14, and the bottom end of the thyristor is provided with the first radiator 9 and the second radiator 12, thereby being convenient for people to assemble and rapidly disassemble.

Example 3: a first radiator 9 is transversely arranged on the left side below the chassis bottom plate 8, a second radiator 12 is spliced on the right side of the first radiator 9, standing blocks 11 are welded and fixed at the bottom ends of the first radiator 9 and the second radiator 12, rectangular grooves 10 are reserved between the standing blocks 11, fastening bolts 14 are embedded in screw holes 16, the fastening bolts 14 and the screw holes 16 are concentrically arranged, the first radiator 9 is positioned on the left side of the second radiator 12 below the chassis bottom plate 8, and the first radiator 9 and the second radiator 12 are positioned on the same horizontal plane;

Specifically, as shown in fig. 1, 2 and 4, the first radiator 9 and the second radiator 12 are identical in shape and can be horizontally inserted together to support objects such as a case together, standing blocks 11 are arranged at equal intervals below the radiating parts, a plurality of groups of rectangular grooves 10 can be formed to disperse and guide out heat, heat generated by operation of the thyristor 4 can be conducted to the outside of the case, and the internal temperature of the closed case is reduced to the greatest extent.

Working principle: when the dual-power module is used, the thyristor 4 is pressed on the top of the heat conducting aluminum plate 7, the stud 15 of the aluminum plate passes through the opening of the circuit board, then the fixing nut 3 is screwed on the stud 15 at the top, the circuit main board 1 is pressed by the spring pressing sheet 2, so that the heat conducting aluminum plate 7 can be tightly attached to the lower part of the thyristor 4, and then the thyristor is attached to the chassis base plate 8 through the fastening bolt 14, the bottom end of the thyristor is provided with the first radiator 9 and the second radiator 12, so that the thyristor is convenient for people to assemble and can be quickly disassembled.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (6)

1. The utility model provides a dual power module heat radiation structure, includes circuit motherboard (1) and spring preforming (2), its characterized in that: four groups of spring pressing pieces (2) are arranged in parallel in front of the top of the circuit main board (1), fixing nuts (3) are arranged between the spring pressing pieces (2) and the circuit main board (1) through screw knobs, four groups of thyristors (4) are fixed at the bottom of the circuit main board (1), a heat conduction silica gel pad (5) is transversely arranged below the circuit main board (1), an insulating silica gel cloth (6) is covered at the bottom of the heat conduction silica gel pad (5), a heat conduction aluminum plate (7) is horizontally arranged below the insulating silica gel cloth (6), and four groups of studs (15) are welded between two sides of the front of the top of the heat conduction aluminum plate (7).

2. The dual power module heat dissipation structure as defined in claim 1, wherein: the number of the spring pressing sheets (2) is the same as that of the fixing nuts (3), and the spring pressing sheets (2) and the corresponding fixing nuts (3) are located on the same vertical plane.

3. The dual power module heat dissipation structure as defined in claim 1, wherein: the stud (15) penetrates through the circuit main board (1) and is embedded in the fixing nut (3) with the spring pressing piece (2), and lines matched with the fixing nut (3) are arranged outside the stud (15).

4. The dual power module heat dissipation structure as defined in claim 1, wherein: the heat conduction aluminum plate (7) is transversely provided with chassis bottom plate (8) in the below, and all welded fastening in both ends at chassis bottom plate (8) top has support column (13), the inside week in chassis bottom plate (8) edge is provided with screw (16), and screws in the internal screw thread of screw (16) have fastening bolt (14), the left side of chassis bottom plate (8) below transversely is provided with first radiator (9), and the right side concatenation of first radiator (9) has second radiator (12), the bottom of first radiator (9) and second radiator (12) all welded fastening has standing piece (11), and has rectangular channel (10) in reserve between standing piece (11).

5. The dual power module heat dissipation structure as defined in claim 4, wherein: the fastening bolts (14) are embedded in the screw holes (16), and the fastening bolts (14) and the screw holes (16) are arranged in concentric circles.

6. The dual power module heat dissipation structure as defined in claim 4, wherein: the first radiator (9) is positioned on the left side of the second radiator (12) below the chassis bottom plate (8), and the first radiator (9) and the second radiator (12) are positioned on the same horizontal plane.