CN221232302U - Wafer thin film reduction polishing equipment - Google Patents
Wafer thin film reduction polishing equipment Download PDFInfo
- Publication number
- CN221232302U CN221232302U CN202323020912.9U CN202323020912U CN221232302U CN 221232302 U CN221232302 U CN 221232302U CN 202323020912 U CN202323020912 U CN 202323020912U CN 221232302 U CN221232302 U CN 221232302U
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- fixedly connected
- polishing
- wafer
- thin film
- telescopic link
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- 238000005498 polishing Methods 0.000 title claims abstract description 76
- 239000010409 thin film Substances 0.000 title claims description 12
- 230000009467 reduction Effects 0.000 title abstract description 9
- 238000009434 installation Methods 0.000 claims abstract description 25
- 230000007246 mechanism Effects 0.000 claims abstract description 18
- 238000003825 pressing Methods 0.000 claims abstract description 17
- 230000001629 suppression Effects 0.000 claims abstract description 3
- 230000000694 effects Effects 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000007517 polishing process Methods 0.000 abstract description 5
- 238000012545 processing Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 49
- 239000010408 film Substances 0.000 description 21
- 239000012528 membrane Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model relates to the technical field of wafer thinning film processing, and discloses wafer thinning film polishing equipment. Including the polishing platform, the top fixed mounting of polishing platform has the platform of placing, top one side edge swing joint of polishing platform has the installation piece, the top fixed mounting of polishing platform has vertical telescopic link, the top fixed mounting of vertical telescopic link has the installation cover, one side fixedly connected with base of installation cover, one side fixedly connected with transverse telescopic link of base, the surface fixedly connected with connecting seat of transverse telescopic link, the below fixedly connected with suppression pole of connecting seat. According to the utility model, the wafer film reduction is placed above the placing table, and the polishing mechanism is opened, so that the wafer film reduction is polished, the application range of polishing equipment is greatly increased, the working efficiency of wafer film reduction polishing is improved, the situation that the wafer film reduction is deviated in the polishing process is avoided by the pressing rod, and the polishing accuracy is improved.
Description
Technical Field
The utility model relates to the technical field of wafer thinning film processing, in particular to wafer thinning film polishing equipment.
Background
With the progress of semiconductor technology, LED and camera technology, the requirements of users on product performance are higher and higher, and new packaging technology is continuously emerging. When the wafer comes out of the wafer manufacturing factory, the thickness is thicker, and the wafer can be thinned during packaging due to the requirement on the packaging size so as to adapt to the smaller packaging size. In order to protect the circuit layer of the wafer during thinning, a film is attached to the circuit layer of the wafer to protect the wafer from being scratched and stained during thinning and lapping.
The existing references are: the utility model discloses a polishing device for thinning wafers, which comprises a bottom plate, wherein four rectangular support rods are fixedly connected to the upper surface of the bottom plate, top plates are fixedly connected to the top ends of the four support rods, lifting mechanisms are arranged on the upper surface of the bottom plate, and polishing mechanisms are arranged above the lifting mechanisms, and the polishing device has the beneficial effects that: according to the utility model, the limiting mechanism is arranged, so that the limiting block matched with the preset thickness size of the wafer can be replaced before the wafer is polished, the thickness size of the polished wafer can be preset, the limiting block gradually approaches the limiting ring along with the thinning of the wafer when the wafer is polished, and finally abuts against the smooth bottom surface of the limiting ring, thereby terminating the polishing process of the wafer, and the limiting block can be replaced conveniently and rapidly, so that the purpose of accurately controlling the thickness of the polished wafer can be achieved.
Although the polishing device for wafer thinning solves the problem of operating and using a wafer polishing procedure, along with the development of semiconductor technology, the wafer is thinned and attached when the wafer is packaged, so that the use protectiveness of the wafer is greatly improved, the conventional polishing device is inconvenient for polishing a wafer film, the flexibility is poor in the polishing process, equipment adjustment is not facilitated according to the actual condition of the wafer film, the working efficiency is reduced, the precision is reduced, and meanwhile, when the wafer film is polished, the wafer film can be subjected to position deviation, so that the precision is reduced in the polishing process.
Disclosure of utility model
(One) solving the technical problems
Aiming at the defects of the prior art, the utility model provides wafer film reduction polishing equipment which has the advantages of being convenient to use for wafer film reduction polishing operation, improving operation accuracy and the like, and solves the technical problems.
(II) technical scheme
In order to achieve the above purpose, the present utility model provides the following technical solutions:
This wafer subtracts film polishing equipment, including being used for subtracting the polishing platform that film polishing work used to the wafer, the top fixed mounting of polishing platform has the mount pad that is used for placing the platform wafer and subtracting the film, top one side edge swing joint of polishing platform is used for connecting the cooperation to use, the top fixed mounting of polishing platform has the vertical telescopic link that is used for the altitude mixture control, the top fixed mounting of vertical telescopic link has the installation cover that is used for connecting the base, one side fixedly connected with of installation cover is used for connecting the base of horizontal telescopic link structure, one side fixedly connected with of base is used for the horizontal telescopic link that the wide range adjustment was used, the surface fixedly connected with of horizontal telescopic link is used for connecting the connecting seat of pressing the pole, the below fixedly connected with of connecting seat is used for pressing the fixed auxiliary use of subtracting the film to the wafer.
As the preferable technical scheme of the utility model, the vertical telescopic rods are fixedly connected to the two sides of the placing table, and the pressing rods are movably connected above the placing table; the vertical telescopic rods and the like are connected with two structures which are connected to two sides of the placing table for cooperation.
As the preferable technical scheme of the utility model, the two sides of the installation block are movably connected with the installation bolts, the center position above the installation block is fixedly connected with the fixed block, and the upper part of the fixed block is movably connected with the supporting block in a penetrating way; the inside of the fixed block is in a hollow state, and the supporting block is movably telescopic to one side of the inside of the fixed block.
As the preferable technical scheme of the utility model, the inside of the fixed block is fixedly connected with an inner telescopic rod, and one end of the mounting bolt is movably embedded and connected in the polishing table; the mounting bolts fixedly connect the mounting blocks above the polishing table.
As the preferable technical scheme of the utility model, a connecting block is fixedly connected above the supporting block, a limit frame is fixedly connected above the connecting block, grooves are fixedly embedded and installed on two sides of the limit frame, and a movable rod is movably connected inside the grooves; the connecting blocks are connected to the two sides of the supporting block for fixed cooperation.
As the preferable technical scheme of the utility model, one side of the movable rod is fixedly connected with a controller, the upper part of the controller is fixedly connected with a supporting seat, the upper part of the supporting seat is fixedly connected with a driving motor, and one side of the driving motor is fixedly connected with a polishing mechanism; the controller is connected with the staff electronic equipment for matching use.
As the preferable technical scheme of the utility model, the polishing mechanism is movably connected above the placing table, the supporting seat is movably connected above the limiting frame, and the controller is movably connected inside the limiting frame; the polishing mechanism is convenient for the film-reduction polishing operation of the wafer.
Compared with the prior art, the utility model provides wafer thin film polishing equipment, which has the following beneficial effects:
according to the polishing device, the vertical telescopic rod is arranged above the polishing table, the transverse telescopic rod is arranged on one side above the vertical telescopic rod, the connecting seat is connected to the outer side of the transverse telescopic rod, the pressing rod is arranged below the connecting seat, when a wafer film is placed on the placing table for polishing operation, a worker operates the telescopic rod to connect the pressing rod on one side above the wafer film, the wafer film is pressed and fixed for auxiliary use, the situation that the wafer film deviates in the polishing process is effectively avoided, meanwhile, the telescopic rod structure is adopted to connect the pressing rod, the pressing rod is convenient to adjust and use, the auxiliary use of the wafer film with different sizes is realized, the setting of the telescopic rod can adjust according to the actual size situation of the wafer film, the use flexibility is improved, and the polishing accuracy is also improved.
Drawings
FIG.1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic view of a mounting block of the present utility model;
FIG. 3 is a schematic view of a connection block according to the present utility model;
fig. 4 is a schematic view of a vertical telescopic rod according to the present utility model.
Wherein: 1. a polishing table; 2. a placement table; 3. a mounting block; 31. installing a bolt; 32. a fixed block; 33. a support block; 34. an inner telescopic rod; 4. a connecting block; 41. a limit frame; 42. a groove; 43. a moving rod; 44. a controller; 45. a support base; 46. a driving motor; 47. a polishing mechanism; 5. a vertical telescopic rod; 51. a mounting sleeve; 52. a base; 53. a transverse telescopic rod; 54. a connecting seat; 55. pressing the rod.
Detailed Description
Embodiments of the present utility model are described in further detail below with reference to the accompanying drawings and examples. The following examples are illustrative of the utility model but are not intended to limit the scope of the utility model.
In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front," "rear," "head," "tail," and the like are used merely for convenience in describing the present utility model and to simplify the description by referring to the figures, rather than to indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and thus should not be construed as limiting the utility model. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the term "connected" shall be construed broadly, and may be, for example, a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
Referring to fig. 1-4, in this embodiment, the wafer thin film polishing apparatus includes a polishing table 1, a placing table 2 is fixedly installed above the polishing table 1, an installation block 3 is movably connected to an edge of one side above the polishing table 1, a vertical telescopic rod 5 is fixedly installed above the polishing table 1, an installation sleeve 51 is fixedly installed above the vertical telescopic rod 5, a base 52 is fixedly connected to one side of the installation sleeve 51, a transverse telescopic rod 53 is fixedly connected to one side of the base 52, a connecting seat 54 is fixedly connected to an outer surface of the transverse telescopic rod 53, and a pressing rod 55 is fixedly connected to a lower side of the connecting seat 54.
The vertical telescopic rods 5 are fixedly connected to the two sides of the placing table 2, and the pressing rods 55 are movably connected to the upper side of the placing table 2.
Specifically, through will place platform 2 and install in the top of polishing platform 1 for polishing platform 1's top still installs and is connected with installation piece 3 and vertical telescopic link 5 structure, installation piece 3 top structure is realized connecting polishing mechanism 47 in placing platform 2's top, place platform 2 top with placing the wafer and subtract the membrane, reach and use the wafer and subtract membrane polishing work operation, vertical telescopic link 5 is taken top installation cover 51 to use, installation cover 51 one side and horizontal telescopic link 53 are connected, horizontal telescopic link 53 below and connecting seat 54 fixed connection, connecting seat 54 below and pressing rod 55 fixed connection, pressing rod 55 is convenient for to the fixed auxiliary use of wafer subtracting membrane suppression, increase wafer subtracting membrane polishing accuracy.
The both sides swing joint of installation piece 3 has mounting bolt 31, and the top central point of installation piece 3 puts fixedly connected with fixed block 32, and the top activity of fixed block 32 is connected with supporting shoe 33 throughout.
The inner telescopic rod 34 is fixedly connected to the inside of the fixed block 32, and one end of the mounting bolt 31 is movably connected to the inside of the polishing table 1 in a jogged manner.
Specifically, through the both ends through connection of installation piece 3 have mounting bolt 31, the one end swing joint of mounting bolt 31 is inside top one side of polishing table 1 for install the installation piece 3 in the top cooperation of polishing table 1 and use, increased this wafer thin film polishing equipment structure and connected cooperation result of use.
The connecting block 4 is fixedly connected to the upper side of the supporting block 33, the limiting frame 41 is fixedly connected to the upper side of the connecting block 4, the grooves 42 are fixedly embedded and installed on two sides of the limiting frame 41, and the moving rods 43 are movably connected to the inner portions of the grooves 42.
One side of the movable rod 43 is fixedly connected with a controller 44, a supporting seat 45 is fixedly connected above the controller 44, a driving motor 46 is fixedly connected above the supporting seat 45, and a polishing mechanism 47 is fixedly connected on one side of the driving motor 46.
The polishing mechanism 47 is movably connected above the placement table 2, the supporting seat 45 is movably connected above the limiting frame 41, and the controller 44 is movably connected inside the limiting frame 41.
Specifically, through installing connecting block 4 in the outside top of supporting seat 45, connecting block 4 top and spacing frame 41 fixed connection, recess 42 is installed to the inside both sides gomphosis of spacing frame 41, and the inside of recess 42 is used for swing joint movable rod 43, and the drive of movable rod 43 is connected with controller 44 and is matchd and use, and then the output control of this controller 44 and staff's electronic equipment are connected matchd and use, opens controller 44 through controlling electronic equipment and drives movable rod 43 and remove the use, is convenient for take structure such as top supporting seat 45 to remove and use.
Working principle: the polishing device is characterized in that a wafer film needing polishing is placed above a placing table 2, vertical telescopic rods 5 are installed on two sides of the placing table 2, one end outer surface of each vertical telescopic rod 5 is fixedly connected with a mounting sleeve 51, one side of each mounting sleeve 51 and a base 52, each base 52 is fixedly connected with a transverse telescopic rod 53, one side of each transverse telescopic rod 53 is fixedly connected with a connecting seat 54, a pressing rod 55 is arranged below each connecting seat 54, a worker operates the telescopic rods to adjust the height and the width of each telescopic rod, the pressing rods 55 are used, the wafer film reduction pressing is fixedly adjusted, a mounting block 3 is connected above the polishing table 1 after fixing assistance, the mounting block 3 is used with a fixing block 32 and a supporting block 33, a connecting block 4 is connected above the supporting block 33, the connecting block 4 is fixedly connected with a limiting frame 41, two sides of the limiting frame 41 are fixedly connected with grooves 42, a movable rod 43 is movably connected inside each groove 42, a controller 44 with a model JYTCOMSW-6 is arranged on one side of each movable rod 43, the controller 44 is used through electronic equipment of the worker, a motor driving mechanism is conveniently used, a polishing motor is conveniently used, and a polishing mechanism is conveniently used on one side of the supporting seat 45 and the wafer 46 is connected with the supporting seat 46 through the driving mechanism 45, and the polishing mechanism 46.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a wafer thin film polishing equipment, includes polishing table (1), the top fixed mounting of polishing table (1) has place platform (2), top one side edge swing joint of polishing table (1) has installation piece (3), the top fixed mounting of polishing table (1) has vertical telescopic link (5), a serial communication port, the top fixed mounting of vertical telescopic link (5) has installation cover (51), one side fixedly connected with base (52) of installation cover (51), one side fixedly connected with transverse telescopic link (53) of base (52), the surface fixedly connected with connecting seat (54) of transverse telescopic link (53), the below fixedly connected with suppression pole (55) of connecting seat (54).
2. A wafer thin film polishing apparatus as claimed in claim 1, wherein: the vertical telescopic rods (5) are fixedly connected to the two sides of the placing table (2), and the pressing rods (55) are movably connected to the upper side of the placing table (2).
3. A wafer thin film polishing apparatus as claimed in claim 1, wherein: the two sides of the installation block (3) are movably connected with installation bolts (31), a fixed block (32) is fixedly connected to the center position of the upper side of the installation block (3), and a supporting block (33) is movably connected to the upper side of the fixed block (32) in a penetrating manner.
4. A wafer thin film polishing apparatus as claimed in claim 3, wherein: the inside fixedly connected with interior telescopic link (34) of fixed block (32), the one end activity gomphosis of mounting bolt (31) is connected in the inside of polishing platform (1).
5. A wafer thin film polishing apparatus as claimed in claim 3, wherein: the upper portion fixedly connected with connecting block (4) of supporting shoe (33), the top fixedly connected with limit frame (41) of connecting block (4), recess (42) are installed in the fixed gomphosis in both sides of limit frame (41), the inside swing joint of recess (42) has movable rod (43).
6. A wafer thin film polishing apparatus as claimed in claim 5, wherein: one side fixedly connected with controller (44) of movable rod (43), the top fixedly connected with supporting seat (45) of controller (44), the top fixedly connected with driving motor (46) of supporting seat (45), one side fixedly connected with polishing mechanism (47) of driving motor (46).
7. A wafer thin film polishing apparatus as claimed in claim 6, wherein: the polishing mechanism (47) is movably connected above the placing table (2), the supporting seat (45) is movably connected above the limiting frame (41), and the controller (44) is movably connected inside the limiting frame (41).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323020912.9U CN221232302U (en) | 2023-11-08 | 2023-11-08 | Wafer thin film reduction polishing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323020912.9U CN221232302U (en) | 2023-11-08 | 2023-11-08 | Wafer thin film reduction polishing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221232302U true CN221232302U (en) | 2024-06-28 |
Family
ID=91599924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323020912.9U Active CN221232302U (en) | 2023-11-08 | 2023-11-08 | Wafer thin film reduction polishing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221232302U (en) |
-
2023
- 2023-11-08 CN CN202323020912.9U patent/CN221232302U/en active Active
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| GR01 | Patent grant |