CN221226169U

CN221226169U - Semiconductor wafer cleaning device

Info

Publication number: CN221226169U
Application number: CN202322849014.8U
Authority: CN
Inventors: 李峰; 李振锋
Original assignee: Shenzhen Suntech Engineering Co ltd
Current assignee: Shenzhen Suntech Engineering Co ltd
Priority date: 2023-10-24
Filing date: 2023-10-24
Publication date: 2024-06-25
Anticipated expiration: 2033-10-24

Abstract

The utility model discloses a semiconductor wafer cleaning device which comprises a cleaning box, a rotating seat, a rotary table, a transmission mechanism, a motor I, a rotating groove, a mounting seat, an air cylinder, a sliding plate, a connecting shaft I, a roller I, a power mechanism, a motor II, a protective cover, a limiting mechanism, a limiting seat, a baffle, a trapezoid block, a positioning shaft, a crank, a connecting shaft II, a roller II, a groove, a movable mechanism, a connecting shaft III, a roller III, a box cover, a cleaning mechanism, a connecting pipe, a spraying seat, a spray head, a filter screen and a water outlet pipe seat, wherein the middle of the rear end of the cleaning box is fixedly connected with the rotating seat, the middle of the interior of the rotating seat is rotationally connected with the rotary table, and the transmission mechanism is arranged on the rotary table. Compared with the prior art, the utility model has the advantages that: the wafer spin-drying machine can clamp wafers of different sizes, can clean the wafers in all directions, and has higher cleaning efficiency, better cleaning effect and better spin-drying effect.

Description

Semiconductor wafer cleaning device

Technical Field

The utility model relates to the technical field of semiconductor manufacturing, in particular to a semiconductor wafer cleaning device.

Background

Wafer surface cleaning is a core link in the semiconductor industry, has an important influence on the quality and stability of chip products, and is disclosed in publication No. CN218282848U, and comprises a base, a driving assembly and a nozzle assembly, wherein the base is provided with a containing groove; the driving assembly is rotatably arranged at the bottom of the accommodating groove in a penetrating way, the end part of the driving assembly is provided with an adsorption piece, the adsorption piece is positioned in the accommodating groove and is in transmission connection with the driving assembly, and the adsorption piece can adsorb wafers; the nozzle assembly comprises a supporting rod and a nozzle arranged at the end part of the supporting rod, the supporting rod is rotationally connected with the bottom of the accommodating groove, the nozzle comprises a first nozzle and a second nozzle, the first nozzle can spray cleaning liquid to the upper surface of the wafer, the second nozzle can spray gas to the upper surface of the wafer, and an output port of the second nozzle is opposite to the center of the wafer.

1. In the prior art, the adsorption piece is arranged in a disc-shaped structure, is matched with the shape of the wafer, and is convenient for rapidly placing the wafer on the adsorption piece; after placing the wafer in the absorption piece, the wafer is attached to the surface of the absorption piece, and the wafer is fixed on the absorption piece through the air suction of an external air pipe, so that the size of the absorption piece is fixed, the wafer with the same size can only be absorbed and fixed, and the flexible adjustment can not be performed according to the size of the wafer.

2. In the prior art, the wafer is quickly placed on the adsorption piece, only one surface of the wafer can be cleaned at a time, and the side surface of the wafer has cleaning dead angles, so that the cleaning effect is not ideal.

Disclosure of utility model

The technical problem to be solved by the utility model is to overcome the defects and provide a semiconductor wafer cleaning device.

In order to solve the technical problems, the technical scheme provided by the utility model is as follows: the utility model provides a semiconductor wafer cleaning device, includes washs the case, the fixedly connected with rotates the seat in the middle of the inside rear end of washs the case, rotate in the middle of the inside rotation of seat and be connected with the carousel, be provided with drive mechanism on the carousel, fixedly connected with mount pad in the middle of the carousel front end, fixedly connected with cylinder in the middle of the inside rear end of mount pad, cylinder front end fixedly connected with slide, the grafting of slide front end has connecting axle one, connecting axle one in the middle of fixedly cup joints the gyro wheel, be provided with power unit on the connecting axle one, be provided with the stop gear that the cooperation slide was used on the mount pad, fixedly cup joints trapezoidal piece in the middle of the slide, the inside front end both sides fixedly connected with locating shaft of mount pad, cup jointed the crank on the locating shaft, the crank front end has cup jointed the connecting axle two in the middle of the connecting axle, the gyro wheel is provided with the recess in the middle of the gyro wheel two, the crank rear end is provided with the movable mechanism that the cooperation trapezoidal piece was used, the articulated on the washout case has case lid, the case lid upper portion has the lid, the filter screen has the inside washout side, the filter screen has the lower side to wash down.

As an improvement, the transmission mechanism comprises a first motor fixedly connected to the middle of the rear side of the cleaning box, an output shaft of the front end of the first motor is fixedly connected to the middle of the rear end of the rotary table, and a rotary groove matched with the rotary table is formed in the rotary seat.

As an improvement, the power mechanism comprises a second motor fixedly connected to the front end of the upper side of the sliding plate, an output shaft of the second motor is fixedly connected to the upper end of the first connecting shaft, and the front end of the upper side of the sliding plate is fixedly connected with a protective cover matched with the second motor.

As an improvement, stop gear includes fixed connection in the middle of the inside front end of mount pad spacing seat, spacing seat cup joints in the slide front end, inside rear end both sides fixedly connected with baffle of mount pad, the baffle is located slide rear end both sides, the baffle is located trapezoidal piece rear end.

As an improvement, the movable mechanism comprises a connecting shaft III inserted into the rear end of the crank, a roller III is sleeved in the middle of the connecting shaft III, and the side surface of the roller III is in rolling connection with the side surface of the trapezoid block.

As an improvement, the cleaning mechanism comprises a connecting pipe inserted into the front end of the upper side of the box cover, the lower end of the connecting pipe is inserted into the cleaning box, the lower end of the connecting pipe is sleeved with a spraying seat, a plurality of evenly distributed spray heads are inserted into the lower end of the spraying seat, and the spraying seat is positioned right above the first idler wheel and the second idler wheel.

Compared with the prior art, the utility model has the advantages that: 1. according to the utility model, the air cylinder can drive the sliding plate to move forwards and backwards, the sliding plate drives the trapezoid block to move forwards and backwards, the first roller and the second roller are close to each other or far away from each other, clamping of wafers with different sizes can be realized, and the application range is wider.

2. When the wafer is washed, the motor drives the mounting seat to rotate slowly so as to drive the wafer to rotate for washing, meanwhile, the motor drives the roller I to rotate, the wafer can rotate between the roller I and the roller II under the drive of the roller I, the wafer rotates between the roller I and the roller II, no washing dead angle exists, and the wafer can be washed in all directions and is more thoroughly washed.

Drawings

Fig. 1 is a schematic view showing an internal structure of a cleaning tank of a semiconductor wafer cleaning apparatus according to the present utility model.

Fig. 2 is a schematic structural view of a semiconductor wafer cleaning apparatus according to the present utility model.

Fig. 3 is a right side cross-sectional view of a cleaning tank of a semiconductor wafer cleaning apparatus according to the present utility model.

Fig. 4 is an enlarged view of the area a in fig. 3.

Fig. 5 is a schematic view showing a partial structure of a semiconductor wafer cleaning apparatus according to the present utility model.

As shown in the figure: 1. a cleaning box; 2. a rotating seat; 3. a turntable; 4. a transmission mechanism; 4.1, a first motor; 4.2, a rotating groove; 5. a mounting base; 6. a cylinder; 7. a slide plate; 8. a first connecting shaft; 9. a roller I; 10. a power mechanism; 10.1, a second motor; 10.2, a protective cover; 11. a limiting mechanism; 11.1, a limiting seat; 11.2, baffle plates; 12. a trapezoid block; 13. positioning a shaft; 14. a crank; 15. a second connecting shaft; 16. a second roller; 17. a groove; 18. a movable mechanism; 18.1, a connecting shaft III; 18.2, a roller III; 19. a case cover; 20. a cleaning mechanism; 20.1, connecting pipes; 20.2, a spray seat; 20.3, a spray head; 21. a filter screen; 22. and a water outlet pipe.

Detailed Description

The present utility model will be described in further detail with reference to the accompanying drawings.

The utility model provides a semiconductor wafer cleaning device, including wasing case 1, the inside rear end middle fixedly connected with of wasing case 1 rotates seat 2, rotate in the middle of the inside rotation of seat 2 and be connected with carousel 3, be provided with drive mechanism 4 on the carousel 3, drive mechanism 4 includes a fixed connection in the middle of wasing case 1 rear side motor 4.1, a motor 4.1 front end output shaft fixed connection is in the middle of carousel 3 rear ends, the inside rotation groove 4.2 that cooperates carousel 3 to use of having seted up of rotation seat 2, a motor 4.1 can drive carousel 3 and rotate in rotation groove 4.2.

Fixedly connected with mount pad 5 in the middle of the carousel 3 front end, mount pad 5 can rotate along with carousel 3, fixedly connected with cylinder 6 in the middle of the inside rear end of mount pad 5, cylinder 6 front end fixedly connected with slide 7 is provided with stop gear 11 that cooperation slide 7 used on the mount pad 5, stop gear 11 includes stop seat 11.1 in the middle of the inside front end of mount pad 5 fixedly connected with, stop seat 11.1 cup joints in slide 7 front end, the inside rear end both sides fixedly connected with baffle 11.2 of mount pad 5, baffle 11.2 is located slide 7 rear end both sides, cylinder 6 can drive slide 7 back-and-forth movement, stop seat 11.1 and baffle 11.2 can carry out spacingly to it.

The front end of the sliding plate 7 is inserted with a first connecting shaft 8, a first roller 9 is fixedly sleeved in the middle of the first connecting shaft 8, a power mechanism 10 is arranged on the first connecting shaft 8, the power mechanism 10 comprises a second motor 10.1 fixedly connected to the front end of the upper side of the sliding plate 7, an output shaft of the lower end of the second motor 10.1 is fixedly connected to the upper end of the first connecting shaft 8, a protective cover 10.2 matched with the second motor 10.1 is fixedly connected to the front end of the upper side of the sliding plate 7, and the second motor 10.1 can drive the first connecting shaft 8 to rotate so as to drive the first roller 9 to rotate.

The trapezoid block 12 is fixedly sleeved in the middle of the sliding plate 7, the positioning shafts 13 are fixedly connected to two sides of the front end inside the mounting seat 5, the crank 14 is sleeved on the positioning shafts 13, the crank 14 can rotate on the positioning shafts 13, the connecting shafts II 15 are spliced at the front ends of the crank 14, the rollers II 16 are sleeved in the middle of the connecting shafts II 15, the grooves 17 are formed in the middle of the rollers I9 and II 16, the grooves 17 are used for limiting wafers, and the edges of the wafers are clamped in the grooves 17.

The rear end of the crank 14 is provided with a movable mechanism 18 matched with the trapezoid block 12, the movable mechanism 18 comprises a connecting shaft III 18.1 inserted into the rear end of the crank 14, a roller III 18.2 is sleeved in the middle of the connecting shaft III 18.1, the side face of the roller III 18.2 is in rolling connection with the side face of the trapezoid block 12, the sliding plate 7 drives the trapezoid block 12 to move forwards and backwards when moving forwards and backwards, the roller III 18.2 can roll on the side face of the trapezoid block 12 when moving forwards and backwards, and the roller III 18.2 drives the crank 14 to move when rolling along the side face of the trapezoid block 12.

The slide plate 7 drives the trapezoid block 12 to move backwards, the front ends of the cranks 14 on two sides are driven to move away from each other when the roller III 18.2 on two sides rolls, the slide plate 7 drives the trapezoid block 12 to move forwards, the front ends of the cranks 14 on two sides are driven to move close to each other when the roller III 18.2 on two sides rolls, so that the roller I9 and the roller II 16 are close to each other or move away from each other, wafers with different diameters are clamped, and when the motor II 10.1 drives the roller I9 to rotate after clamping, the wafers can rotate between the roller I9 and the roller II 16 under the driving of the roller I9.

The upper end of the cleaning box 1 is hinged with a box cover 19, a cleaning mechanism 20 is arranged on the box cover 19, the cleaning mechanism 20 comprises a connecting pipe 20.1 which is inserted into the front end of the upper side of the box cover 19, the connecting pipe 20.1 is used for externally connecting a pipeline for conveying cleaning liquid, the lower end of the connecting pipe 20.1 is inserted into the cleaning box 1, the lower end of the connecting pipe 20.1 is sleeved with a spraying seat 20.2, the lower end of the spraying seat 20.2 is inserted with a plurality of evenly distributed spray heads 20.3, the spraying seat 20.2 is positioned right above the first roller 9 and the second roller 16, and the spray heads 20.3 can comprehensively spray the cleaning liquid onto the wafer for flushing.

When the wafer is washed, the first motor 4.1 can drive the mounting seat 5 to slowly rotate so as to drive the wafer to rotate and wash, meanwhile, the wafer rotates between the first roller 9 and the second roller 16, no washing dead angle can appear, the comprehensive washing can be realized, the washing is more thorough, after the washing is finished, the first motor 4.1 can drive the mounting seat 5 to rotate in an accelerating way so as to spin-dry the liquid on the surface of the wafer, the position of the front end of the mounting seat 5, which is connected with the crank 14 and the sliding plate 7, can be provided with a waterproof mechanism, and the washing liquid is placed to splash into the mounting seat 5.

The filter screen 21 is arranged at the lower end of the inside of the cleaning box 1, and the water outlet pipe 22 is inserted in the middle of the lower end of the rear side of the cleaning box 1.

In the implementation of the utility model, as shown in fig. 1-5, a wafer to be cleaned is placed between the first roller 9 and the second roller 16, the cylinder 6 is started to drive the slide plate 7 to move forward, the slide plate 7 drives the trapezoid block 12 to move forward, the first roller 9 and the second roller 16 are close to each other to clamp the wafer, the clamping of wafers with different sizes can be realized, the edge of the wafer is clamped in the groove 17 between the first roller 9 and the second roller 16, and the spray head 20.3 can spray the cleaning liquid over the wafer comprehensively for cleaning.

When the wafer is washed, the first motor 4.1 drives the mounting seat 5 to slowly rotate so as to drive the wafer to rotate and wash, the second motor 10.1 simultaneously drives the first roller 9 to rotate, the wafer can rotate between the first roller 9 and the second roller 16 under the drive of the first roller 9, the wafer rotates between the first roller 9 and the second roller 16, no washing dead angle can appear, the omnibearing washing can be realized, the washing is more thorough, after the washing is finished, the first motor 4.1 can drive the mounting seat 5 to rotate in an accelerating way so as to spin-dry the liquid on the surface of the wafer, the condition that the middle liquid eccentricity is low and is not easy to spin-out can not appear in the longitudinal rotation of the wafer, the wafer rotates during the spin-drying, and the spin-drying effect is better and the efficiency is higher.

The utility model and its embodiments have been described above with no limitation, and the actual construction is not limited to the embodiments of the utility model as shown in the drawings. In summary, if one of ordinary skill in the art is informed by this disclosure, a structural manner and an embodiment similar to the technical solution should not be creatively devised without departing from the gist of the present utility model.

Claims

1. The semiconductor wafer cleaning device comprises a cleaning box (1), and is characterized in that: the utility model discloses a cleaning box, including cleaning box (1), including inside rear end, fixed connection in the middle of the inside rear end of cleaning box (1), rotation seat (2) inside centre is rotated and is connected with carousel (3), be provided with drive mechanism (4) on carousel (3), fixed connection mount pad (5) in the middle of carousel (3) front end, fixed connection cylinder (6) in the middle of mount pad (5) inside rear end, cylinder (6) front end fixedly connected with slide (7), peg graft in slide (7) front end has connecting axle one (8), connecting axle one (9) have been cup jointed in the middle of connecting axle one (8), be provided with power unit (10) on connecting axle one (8), be provided with stop gear (11) that cooperation slide (7) used on mount pad (5), trapezoidal piece (12) have been cup jointed in the middle of slide (7), fixed connection location axle (13) in the inside front end both sides of mount pad (5), crank (14) have cup jointed on location axle (13), crank (14) front end have connecting axle one (15), two (16) have cup jointed in the middle of connecting axle one (16) with intermediate groove (17), the novel cleaning device is characterized in that a movable mechanism (18) matched with the trapezoid block (12) is arranged at the rear end of the crank (14), a box cover (19) is hinged to the upper end of the cleaning box (1), a cleaning mechanism (20) is arranged on the box cover (19), a filter screen (21) is arranged at the lower end inside the cleaning box (1), and a water outlet pipe (22) is inserted in the middle of the lower end of the rear side of the cleaning box (1).

2. A semiconductor wafer cleaning apparatus according to claim 1, wherein: the transmission mechanism (4) comprises a motor I (4.1) fixedly connected to the middle of the rear side of the cleaning box (1), an output shaft of the front end of the motor I (4.1) is fixedly connected to the middle of the rear end of the rotary table (3), and a rotary groove (4.2) matched with the rotary table (3) is formed in the rotary seat (2).

3. A semiconductor wafer cleaning apparatus according to claim 1, wherein: the power mechanism (10) comprises a motor II (10.1) fixedly connected to the front end of the upper side of the sliding plate (7), an output shaft of the lower end of the motor II (10.1) is fixedly connected to the upper end of the connecting shaft I (8), and a protective cover (10.2) matched with the motor II (10.1) for use is fixedly connected to the front end of the upper side of the sliding plate (7).

4. A semiconductor wafer cleaning apparatus according to claim 1, wherein: stop gear (11) are including fixed connection in limit seat (11.1) in the middle of mount pad (5) inside front end, limit seat (11.1) cup joints in slide (7) front end, inside rear end both sides fixedly connected with baffle (11.2) of mount pad (5), baffle (11.2) are located slide (7) rear end both sides, baffle (11.2) are located trapezoidal piece (12) rear end.

5. A semiconductor wafer cleaning apparatus according to claim 1, wherein: the movable mechanism (18) comprises a connecting shaft III (18.1) inserted into the rear end of the crank (14), a roller III (18.2) is sleeved in the middle of the connecting shaft III (18.1), and the side surface of the roller III (18.2) is in rolling connection with the side surface of the trapezoid block (12).

6. A semiconductor wafer cleaning apparatus according to claim 1, wherein: the cleaning mechanism (20) comprises a connecting pipe (20.1) inserted into the front end of the upper side of the box cover (19), the lower end of the connecting pipe (20.1) is inserted into the cleaning box (1), the lower end of the connecting pipe (20.1) is sleeved with a spraying seat (20.2), a plurality of evenly distributed spray heads (20.3) are inserted into the lower end of the spraying seat (20.2), and the spraying seat (20.2) is located right above the first roller (9) and the second roller (16).