CN221209835U - Die carrier guiding mechanism - Google Patents

Abstract

The utility model discloses a die carrier guiding mechanism, which belongs to the technical field of die processing and comprises a lower die carrier and an upper die carrier, wherein the upper die carrier is positioned at the upper side of the lower die carrier; in the die assembly process of the upper die frame and the lower die frame, the four buffer springs and the two groups of buffer mechanisms are matched to buffer the upper die frame and the lower die frame, the two groups of buffer mechanisms adopt the mutually exclusive principle of a magnetic field to buffer the die assembly of the lower die frame and the upper die frame, repeated buffer use can be carried out, the service life is long, and abrasion rising of various parts on the die frame due to the reduction of the elasticity of the buffer springs is effectively avoided.

Description

Die carrier guiding mechanism

Technical Field

The utility model relates to the technical field of mold processing, in particular to a mold frame guiding mechanism.

Background

The die carrier is the support of the die, for example, the die carrier is formed by combining and fixing the parts of the die according to a certain rule and position on the die casting machine, and the parts of the die which can be installed on the die casting machine to work are called as the die carrier, and the die carrier consists of a push-out mechanism, a guide mechanism, a die leg cushion block of a pre-reset mechanism and a seat plate.

The utility model discloses a mould die carrier guiding mechanism of authorized bulletin number "CN211489316U", is equipped with the die carrier directly over the lower die carrier, goes up four corners of die carrier bottom surface and all is equipped with the guide bar, and the guide bar comprises base, connector, buffer spring and limiting plate, and the base upper surface is equipped with the loop bar, and loop bar circular arc side outer lane is equipped with buffer spring, and loop bar circular arc side top cover has the connector, and the loop bar top has the limiting plate through bolted connection, and the guide bar bottom is connected with the die carrier down.

The guide mechanism of the die carrier is a part for ensuring the correct positioning and guiding of the die closing and opening of the moving and fixed die so as to ensure the shape and dimensional accuracy of products and avoid abrasion caused by collision of various parts on the die carrier, a spring is usually arranged on the guide mechanism, the abrasion is reduced through elastic buffering of the spring, but the elasticity of the spring is reduced under the long-time use of most of the existing die guide mechanisms, so that the buffering effect is poor, and the abrasion of various parts on the die carrier is increased.

Disclosure of utility model

1. Technical problem to be solved

Aiming at the problems in the prior art, the utility model aims to provide a die carrier guiding mechanism which aims at solving the problems in the prior art.

2. Technical proposal

In order to solve the problems, the utility model adopts the following technical scheme:

The utility model provides a die carrier guiding mechanism, includes die carrier and last die carrier down, it is located the upside of die carrier down to go up the die carrier, the one end fixedly connected with four guide bars that the die carrier is close to the die carrier down, go up the one end fixedly connected with four stand bars that the die carrier is close to the die carrier down, and four stand bars phase-match respectively with four stand bars, four the surface of stand bar all overlaps and is equipped with buffer spring, and four buffer spring respectively with four stand bars are corresponding, be provided with two sets of buffer gear down between die carrier and the last die carrier, two sets of buffer gear is used for buffering down die carrier and last die carrier when the compound die, reduces the wearing and tearing that various spare part impact produced on the die carrier.

As a preferred scheme of the utility model, each group of buffer mechanism comprises two sliding sheets, two sliding blocks, two first connecting rods, two second connecting rods, a top plate, a group of first magnets and a group of second magnets, wherein the two sliding sheets are respectively and slidably connected to the outer surfaces of the two guide rods, the two sliding sheets are respectively positioned between the two guide pipes and the two buffer springs, the two sliding blocks are respectively and slidably connected to the lower die frame, the two first connecting rods are respectively and movably hinged between the two sliding sheets and the two sliding blocks through hinge shafts, the two second connecting rods are respectively and movably hinged to the two sliding blocks through hinge shafts, the top plate is movably and movably hinged to the two second connecting rods through hinge shafts, one group of first magnets are fixedly connected to the top plate, one group of second magnets are fixedly connected to the upper die frame, and one group of second magnets correspond to one group of first magnets.

As a preferable scheme of the utility model, the bottom ends of the four sliding blocks are fixedly connected with stabilizing blocks, two sliding grooves are cut on the lower die frame, and each two stabilizing blocks are slidably connected in one sliding groove.

As a preferable scheme of the utility model, rubber pads are fixedly connected in the four guide pipes, and the four rubber pads correspond to the four guide rods respectively.

3. Advantageous effects

Compared with the prior art, the utility model has the advantages that:

(1) In this scheme, lower die carrier and last die carrier are when the compound die, and four stand bars are led the compound die of lower die carrier and last die carrier, make the compound die of lower die carrier and last die carrier keep stable, go up and lower die carrier compound die in-process, four buffer springs and two sets of buffer mechanism cooperation buffer to last lower die carrier, and two sets of buffer mechanism adopt the mutually exclusive principle of magnetic field to carry out the buffering of lower die carrier and last die carrier compound die, can carry out multiple buffering use, long service life, effectually avoid various spare parts to lead to wearing and tearing rising because of buffer spring's elasticity reduction on the die carrier.

Drawings

FIG. 1 is a front view of the present utility model;

FIG. 2 is a perspective view of the present utility model;

FIG. 3 is an exploded view of the present utility model;

fig. 4 is a perspective view of a buffer mechanism according to the present utility model.

The reference numerals in the figures illustrate:

1. a lower die frame; 2. a die carrier is arranged; 3. a guide rod; 4. a guide tube; 5. a buffer spring; 601. a sliding sheet; 602. a slide block; 603. a first link; 604. a second link; 605. a top plate; 606. a first magnet; 607. a second magnet; 7. a stabilizing block; 8. a chute; 9. and a rubber pad.

Detailed Description

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the drawings in the embodiments of the present utility model. It is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments, and that all other embodiments obtained by persons of ordinary skill in the art without making creative efforts based on the embodiments in the present utility model are within the protection scope of the present utility model.

In the description of the present utility model, it should be noted that the positional or positional relationship indicated by the terms such as "upper", "lower", "inner", "outer", "top/bottom", etc. are based on the positional or positional relationship shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "configured to," "engaged with," "connected to," and the like are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

Examples:

Referring to fig. 1-4, a die carrier guiding mechanism includes a lower die carrier 1 and an upper die carrier 2, the upper die carrier 2 is located at the upper side of the lower die carrier 1, one end of the lower die carrier 1 close to the upper die carrier 2 is fixedly connected with four guiding rods 3, one end of the upper die carrier 2 close to the lower die carrier 1 is fixedly connected with four guiding pipes 4, the four guiding pipes 4 are respectively matched with the four guiding rods 3, buffer springs 5 are respectively sleeved on the outer surfaces of the four guiding rods 3, the four buffer springs 5 respectively correspond to the four guiding pipes 4, two groups of buffer mechanisms are arranged between the lower die carrier 1 and the upper die carrier 2 and used for buffering when the lower die carrier 1 and the upper die carrier 2 are clamped, and abrasion caused by impact of various parts on the die carrier is reduced.

In this embodiment, when the lower die carrier 1 and the upper die carrier 2 are used for die assembly, the four guide pipes 4 respectively correspond to the four guide rods 3 to slide, so that parts on the lower die carrier 1 and the guide pipes 4 can be accurately guided for die assembly, meanwhile, the four guide pipes 4 are subjected to auxiliary buffering by the four buffer springs 5, and the two groups of buffer mechanisms are used for magnetically repulsive buffering the guide pipes 4, so that collision and abrasion generated during die assembly of the lower die carrier 1 and the upper die carrier 2 are reduced, and the service lives of the parts on the lower die carrier 1 and the upper die carrier 2 are prolonged.

Specifically, each group of buffer mechanism includes two sliding sheets 601, two sliding blocks 602, two first connecting rods 603, two second connecting rods 604, a top plate 605, a group of first magnets 606 and a group of second magnets 607, the two sliding sheets 601 are respectively and slidably connected to the outer surfaces of the two guide rods 3, the two sliding sheets 601 are respectively located between the two guide tubes 4 and the two buffer springs 5, the two sliding blocks 602 are respectively and slidably connected to the lower die frame 1, the two first connecting rods 603 are respectively and movably hinged between the two sliding sheets 601 and the two sliding blocks 602 through hinge shafts, the two second connecting rods 604 are respectively and movably hinged to the two sliding blocks 602 through hinge shafts, the top plate 605 is movably hinged to the two second connecting rods 604 through hinge shafts, the group of first magnets 606 are fixedly connected to the top plate 605, the group of second magnets 607 are fixedly connected to the upper die frame 2, and the group of second magnets 607 correspond to the group of first magnets 606.

In this embodiment, in the process that the four guide tubes 4 slide on the four guide rods 3, the two guide tubes 4 of each group of buffer mechanisms can squeeze the two buffer springs 5 through the two sliding sheets 601, the two sliding sheets 601 move downwards to enable the two first connecting rods 603 to push the two sliding blocks 602 to slide on the lower die frame 1, the two sliding blocks 602 jack the top plate 605 through the two second connecting rods 604, and the group of first magnets 606 and the group of second magnets 607 are close to each other, so that repulsive magnetic fields are generated to buffer, wherein the two buffer springs 5 play a role in assisting in buffering, and only have the effect of jacking the two sliding sheets 601, even if elasticity is reduced, the use of the buffer mechanisms is not hindered.

Specifically, the bottom ends of the four sliding blocks 602 are fixedly connected with a stabilizing block 7, two sliding grooves 8 are cut on the lower die frame 1, and each two stabilizing blocks 7 are slidably connected in one sliding groove 8.

In this embodiment, the two sliding blocks 602 of each group of buffer mechanism can slide in one sliding slot 8 during the sliding process, and the sliding connection between the four sliding blocks 7 and the two sliding slots 8 can keep the movement of the four sliding blocks 602 stable.

Specifically, rubber pads 9 are fixedly connected in the four guide pipes 4, and the four rubber pads 9 correspond to the four guide rods 3 respectively.

In this embodiment, when the lower die carrier 1 performs die assembly with the upper die carrier 2, the rubber pads 9 in the four guide pipes 4 will contact with the four guide rods 3, so as to further buffer die assembly of the lower die carrier 1 and the upper die carrier 2, and reduce wear of parts on the lower die carrier 1 and the guide pipes 4.

Working principle: when the lower die frame 1 and the upper die frame 2 are in die assembly, the four guide pipes 4 respectively correspond to the four guide rods 3 to slide, so that parts on the lower die frame 1 and the upper die frame 2 can be accurately guided and die assembled, meanwhile, the four guide pipes 4 are subjected to auxiliary buffering by the four buffer springs 5, the two guide pipes 4 of each group of buffer mechanisms extrude the two buffer springs 5 through the two sliding sheets 601, the two sliding sheets 601 move downwards to enable the two first connecting rods 603 to push the two sliding blocks 602 to slide on the lower die frame 1, the two sliding blocks 602 jack up the top plate 605 through the two second connecting rods 604, a group of first magnets 606 and a group of second magnets 607 are close to each other, so that repulsive magnetic fields are generated to buffer, collision abrasion generated when the lower die frame 1 and the upper die frame 2 are in die assembly is reduced, and the service lives of the parts on the lower die frame 1 and the upper die frame 2 are prolonged.

The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical solution and the modified concept thereof, within the scope of the present utility model.

Claims (4)

1. The utility model provides a die carrier guiding mechanism, includes lower die carrier (1) and goes up die carrier (2), its characterized in that: the upper die carrier (2) is located the upside of die carrier (1) down, the one end fixedly connected with four guide bars (3) of die carrier (1) down is close to die carrier (2), the one end fixedly connected with four stand pipes (4) of die carrier (1) down are close to die carrier (2), and four stand pipes (4) respectively with four stand pipes (3) assorted, four the surface of stand pipe (3) all overlaps and is equipped with buffer spring (5), and four buffer spring (5) respectively correspond with four stand pipes (4), be provided with two sets of buffer gear between die carrier (1) and the last die carrier (2) down, two sets of buffer gear are used for buffering when die carrier (1) and last die carrier (2) compound die down, reduce the wearing and tearing that various spare parts impact produced on the die carrier.

2. A scaffold guiding mechanism according to claim 1, wherein: each group of buffer mechanisms comprises two sliding sheets (601), two sliding blocks (602), two first connecting rods (603), two second connecting rods (604), a top plate (605), a group of first magnets (606) and a group of second magnets (607), wherein the two sliding sheets (601) are respectively and slidably connected to the outer surfaces of the two guide rods (3), the two sliding sheets (601) are respectively positioned between the two guide pipes (4) and the two buffer springs (5), the two sliding blocks (602) are respectively and slidably connected to the lower die frame (1), the two first connecting rods (603) are respectively and movably hinged between the two sliding sheets (601) and the two sliding blocks (602) through hinge shafts, the two second connecting rods (604) are respectively and movably hinged to the two sliding blocks (602) through hinge shafts, the top plate (605) is movably hinged to the two second connecting rods (604), the group of first magnets (606) are fixedly connected to the top plate (605), the group of second magnets (607) are fixedly connected to the first magnets (607), and the group of second magnets (606) are fixedly connected to the first die frame (606).

3. A scaffold guiding mechanism according to claim 2, wherein: the bottom of four slider (602) all fixedly connected with firm piece (7), it has two spout (8) to open on lower die carrier (1), and every two firm piece (7) sliding connection in a spout (8).

4. A scaffold guiding mechanism according to claim 3, wherein: rubber pads (9) are fixedly connected in the four guide pipes (4), and the four rubber pads (9) are respectively corresponding to the four guide rods (3).